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    MICROFLUIDIC DEVICES
    11.
    发明申请
    MICROFLUIDIC DEVICES 有权

    公开(公告)号：US20210299662A1

    公开(公告)日：2021-09-30

    申请号：US16605619

    申请日：2017-10-30

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Viktor Shkolnikov ,  Chien-Hua Chen ,  Michael W Cumbie

    IPC: B01L3/00 ,  G01N15/14

    Abstract: In an example implementation, a microfluidic device includes a first layer with a first microfluidic channel and a second layer with a second microfluidic channel. The first and second channels are adjacent to one another at a channel intersection, and a conductive membrane valve extends across and covers the channel intersection to separate the first and second channels. The microfluidic device includes a conductive trace to open the membrane valve and join the first and second channels by supplying an electric current to heat and melt a thinned region of the membrane valve.

    THERMAL CONTACT DIES
    12.
    发明申请
    THERMAL CONTACT DIES 有权

    公开(公告)号：US20210283926A1

    公开(公告)日：2021-09-16

    申请号：US16466408

    申请日：2017-03-15

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Michael W Cumbie ,  Reynaldo V Villavelez ,  Chien-Hua Chen

    IPC: B41J2/335

    Abstract: A thermal contact device may include a thermal contact die embedded in a moldable material. The thermal contact die may include a number of resistors integrated into the thermal contact die, and a number of heater drivers integrated into the thermal contact die and electronically coupled to the resistors. The moldable material is coplanar with a thermal contact side of the thermal contact device. Further, the moldable material includes at least one gradient edge along a medium feed path.

    FLUID PROPERTY SENSOR
    13.
    发明申请
    FLUID PROPERTY SENSOR 有权

    公开(公告)号：US20210129549A1

    公开(公告)日：2021-05-06

    申请号：US16605071

    申请日：2017-10-18

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Michael W Cumbie ,  Chien-Hua Chen ,  Tony Studer

    IPC: B41J2/175 ,  G01F23/24 ,  G01F23/26

    Abstract: In one example, a fluid property sensor includes a proximal elongated circuit (EC), a distal EC, and an external interface. The proximal EC has multiple point sensors distributed along its length. The distal EC is extended in the direction of the length from a distal end of the proximal EC and is electrically coupled from the distal end of the proximal EC to a proximal end of the distal EC. The proximal and distal ECs share a common interface bus. The external interface is electrically coupled to a proximal end of the proximal EC. The proximal EC, the distal EC, and the external interface are packaged together to form the fluid property sensor.

    FLUID EJECTION DIE FLUID RECIRCULATION
    15.
    发明申请
    FLUID EJECTION DIE FLUID RECIRCULATION 审中-公开

    公开(公告)号：US20200061992A1

    公开(公告)日：2020-02-27

    申请号：US16495456

    申请日：2017-05-08

    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

    Inventor： Chien-Hua Chen ,  Michael W Cumbie ,  Si-lam J Choy

    IPC: B41J2/14 ,  B41J2/18

    Abstract: A fluid ejection device includes a fluid ejection die to eject drops of fluid and a body to support the fluid ejection die, with the fluid ejection die including a fluid ejection chamber, a drop ejecting element within the fluid ejection chamber, and a fluid feed hole communicated with the fluid ejection chamber, and with the body including a fluid feed slot communicated with the fluid feed hole of the fluid ejection die. The fluid ejection device includes a micro-recirculation system to recirculate fluid within the fluid ejection die through the fluid ejection chamber, and a macro-recirculation system to recirculate fluid within the body through the fluid feed slot across the fluid feed hole of the fluid ejection die.

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