公开(公告)号：US11364493B2

公开(公告)日：2022-06-21

申请号：US16645042

申请日：2017-10-12

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W. Cumbie ,  Chien-Hua Chen

IPC: B01L3/00 ,  B81B7/00

Abstract: A microfluidic apparatus may include, in an example, a substrate, at least one silicon die embedded into the substrate, and a planarization layer layered over, at least, a portion of the substrate that interfaces with the silicon die to prevent a fluid from contacting an edge of the silicon die.

公开(公告)号：US20220176708A1

公开(公告)日：2022-06-09

申请号：US17417789

申请日：2019-08-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Boon Bing Ng ,  Anthony M. Fuller ,  Michael W. Cumbie

IPC: B41J2/19 ,  B41J2/14

Abstract: In some examples, a fluid dispensing device includes an inner chamber to contain a fluid. The fluid dispensing device further includes an orifice layer comprising a bubbler orifice to draw air through a bubbler chamber to the inner chamber responsive to a pressure satisfying a criterion, the bubbler chamber being adjacent the bubbler orifice. A circulation path circulates fluid drawn through a feed hole through the bubbler chamber.

公开(公告)号：US11351787B2

公开(公告)日：2022-06-07

申请号：US17276971

申请日：2018-11-21

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Si-Iam J. Choy

IPC: B41J2/16 ,  B41J2/14 ,  B29C53/04 ,  B29C35/02 ,  B29L31/00

Abstract: A curved fluid ejection device may include a plurality of fluid ejection dies overmolded with at least one layer of epoxy mold compound (EMC). Each of the fluid ejection dies and the EMC include a coefficient of thermal expansion (CTE). The combination of the CTE of the fluid ejection dies and the CTE of the at least one layer of EMC defines a curve within the curved fluid ejection device.

公开(公告)号：US11345159B2

公开(公告)日：2022-05-31

申请号：US16768652

申请日：2019-12-03

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W. Cumbie ,  Scott A. Linn ,  James Michael Gardner

IPC: B41J2/00 ,  B41J2/175 ,  B41J2/045 ,  G06F13/42 ,  G06F21/44 ,  G06F1/12 ,  G06F1/08 ,  H03K19/0175 ,  B33Y30/00 ,  B29C64/259 ,  G06F3/12 ,  G01F23/24 ,  G01F23/80

Abstract: A replaceable print apparatus component includes a print material reservoir, a print material within the reservoir and a sensing system including an integrated circuit configured to connect to and communicate over a digital bus. The sensing system includes at least one sensor, a digital controller, an analog to digital converter electrically coupled to the digital controller, and a memory array electrically coupled to the digital controller. The digital controller is configured to generate a clock signal for timing operations of the integrated circuit. The operations include initiating the at least one sensor based on values stored in the memory array and generating outputs of the at least one sensor via the analog to digital converter.

公开(公告)号：US11325378B2

公开(公告)日：2022-05-10

申请号：US17083156

申请日：2020-10-28

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Michael W. Cumbie ,  Devin Alexander Mourey ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/16 ,  B41J2/135 ,  B41J2/175 ,  B41J2/315

Abstract: In example implementations, a method is provided, which may include providing a carrier, applying a thermal release tape over the carrier, attaching a print head die, a drive integrated circuit (IC) and an interposer on the thermal release tape, wherein the print head die comprises ink feed holes formed in a back surface of the print head die, encapsulating the print head die, the drive IC and the interposer with an epoxy molded compound (EMC), removing the carrier and the thermal release tape, and forming a slot over an area of the EMC that covers the ink feed holes, wherein the ink feed holes are to be fluidically coupled to the slot.

公开(公告)号：US20220105726A1

公开(公告)日：2022-04-07

申请号：US17551489

申请日：2021-12-15

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Garrett E. Clark ,  Michael W. Cumbie ,  Mark H. MacKenzie

IPC: B41J2/14 ,  B41J2/045 ,  B41J2/21

Abstract: The present disclosure includes a description of an example printhead having multiple ejection dies. The ejection dies are coupled to a temperature sensor and send temperature signals to a controller. The printhead can also include a heater coupled to the ejection dies to apply heat to at least one ejection die.

公开(公告)号：US11278887B2

公开(公告)日：2022-03-22

申请号：US16493241

申请日：2017-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Viktor Shkolnikov ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B01L3/00

Abstract: A microfluidic device is provided that includes a substrate and microfluidic sub-chips embedded in the substrate. An electric field is applied between an adjacent pair microfluidic sub-chips to move a fluid droplet from one of the adjacent pair of microfluidic sub-chips to another of the adjacent pair microfluidic sub-chips.

公开(公告)号：US11183437B2

公开(公告)日：2021-11-23

申请号：US16737361

申请日：2020-01-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: B41J2/14 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29

Abstract: In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.

公开(公告)号：US11110714B2

公开(公告)日：2021-09-07

申请号：US16604516

申请日：2017-08-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A. Nielsen ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B41J2/175 ,  B41J2/03

Abstract: An apparatus includes a print head coupled to a substrate to dispense fluid from the substrate in response to a command. A reservoir coupled to the substrate transports the fluid to the print head. A preloaded storage container mounted on the reservoir stores the fluid and provides the fluid to the reservoir in response to pressure applied to the container.

公开(公告)号：US20200369031A1

公开(公告)日：2020-11-26

申请号：US16991524

申请日：2020-08-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Silam J. Choy ,  Michael W. Cumbie ,  Devin Alexander Mourey ,  Chien-Hua Chen

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155 ,  B41J2/175

Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.