公开(公告)号：US09860975B2

公开(公告)日：2018-01-02

申请号：US15109177

申请日：2014-01-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Mark Vinod Kapoor ,  David W. Engler

IPC: H05K1/03 ,  H05K1/02 ,  H05K1/11

CPC classification number: H05K1/0271 ,  H05K1/0209 ,  H05K1/0228 ,  H05K1/0243 ,  H05K1/116 ,  H05K2201/10159 ,  H05K2201/10189

Abstract: A printed circuit board (PCB) having a thermal relief pad around at least one via. The thermal relief pad includes at least four thermal cut-outs and at least four conductive bands. The at least four conductive bands are formed between the at least four thermal cut-outs such that adjacent conductive pads are orthogonal to each other. Each pair of mutually opposite conductive bands have substantially equal lengths and each pair of adjacent conductive bands have unequal lengths.

公开(公告)号：US10964180B2

公开(公告)日：2021-03-30

申请号：US15992580

申请日：2018-05-30

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David W. Engler ,  William James Walker

IPC: G08B13/14 ,  G08B13/12 ,  G08B29/18 ,  G08B29/16 ,  G08B25/00

Abstract: Software intrusion protection systems to prevent remote access to sensitive data are very prevalent. In some cases, additional physical access protection may also be desired. By preventing physical access to a system an intruder may not be able to physically “steal” component parts of the system and then obtain their contents (or design criteria) at a remote site (e.g., after the physical theft). Monitors are provided to detect potential access to a secure computer system and identify if inappropriate access to the secure computer system is obtained (or is imminent). In a case where unauthorized access is predicted, warnings and alerts may be sent prior to an actual breach. Upon determination that a breach may be likely to occur, techniques to protect data (e.g., erasure, destruction, etc.) and component parts may be initiated. Sensors monitor internal and external physical environmental conditions to assist in detection of intrusion.

公开(公告)号：US10788872B2

公开(公告)日：2020-09-29

申请号：US15760617

申请日：2015-09-21

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David F. Heinrich ,  David W. Engler ,  Patrick Raymond ,  William C. Hallowell

IPC: G06F1/30 ,  G06F1/26 ,  G06F11/14 ,  G06F11/10 ,  G06F12/0804

Abstract: Example implementations relate to a server node shutdown. For example, a system includes a control module and a secondary power supply. The control module includes a detect engine to detect an even that triggers a sequenced shutdown of a server node and prevent execution of the sequenced shutdown and execution of a data transfer. The control module also includes an initiate engine to initiate a data backup process, by a basic input/output system (BIOS) of the server node, to write data from a volatile memory location of the server node to a non-volatile memory location of the server node. The secondary power supply is to support the data backup process.

公开(公告)号：US10757801B2

公开(公告)日：2020-08-25

申请号：US16126424

申请日：2018-09-10

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David W. Engler ,  Stephen F. Contreras

IPC: H05K1/02 ,  H05K3/00 ,  H05K3/28

Abstract: A printed circuit board having a substrate layer, at least one electrically conductive trace disposed on the substrate layer, and a solder mask layer disposed over the substrate layer and the electrically conductive trace, wherein the solder mask later includes a void region over at least a portion of the electrically conductive trace. Also, a method of optimizing printed circuit board designing including selecting printed circuit board data comprising at least a solder mask layer area, varying the solder mask layer area, determining an insertion loss value for each varied solder mask layer area, comparing the insertion loss values for each varied solder mask layer area, and selecting a solder mask layer area based on the comparing.

公开(公告)号：US20200093021A1

公开(公告)日：2020-03-19

申请号：US16131441

申请日：2018-09-14

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John Norton ,  David W. Engler ,  Hermann Wienchol

IPC: H05K7/14 ,  G02B6/42

Abstract: A modular compute platform including an enclosure, a first module including an application specific integrated circuit, the first module being disposed in the enclosure, a second module including an input/output device, the second module being disposed in the enclosure, the input/output device connected to the first module through a first cable, and a third module including a media device disposed in the enclosure, the media device connected to the first module through a second cable.

公开(公告)号：US20180275731A1

公开(公告)日：2018-09-27

申请号：US15464706

申请日：2017-03-21

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： David W. Engler ,  David F. Heinrich ,  Patrick Raymond

IPC: G06F1/24 ,  G06F3/06 ,  G06F12/02 ,  G06F9/30

CPC classification number: G06F1/24 ,  G06F9/4401 ,  G06F11/1417 ,  G06F12/0246

Abstract: In an example, a system comprises a read-only memory, and a processor. The processor to: access a first reset vector, wherein the first reset vector is associated with a first memory address, wherein the first memory address is located on the read-only memory. Responsive to the processor being reset, the processor to: access a second reset vector, wherein the second reset vector is associated with a second memory address, wherein the second memory address is different than the first memory address.

公开(公告)号：US20180113496A1

公开(公告)日：2018-04-26

申请号：US15567621

申请日：2015-05-15

Applicant: Hewlett Packard Enterprise Development LP

Inventor： David F. Heinrich ,  Hung Quoc Phu ,  David W. Engler

IPC: G06F1/26 ,  G06F1/32 ,  G06F1/28

CPC classification number: G06F1/263 ,  G06F1/28 ,  G06F1/3206 ,  G06F1/3287 ,  G06F1/3296 ,  Y02D10/172

Abstract: Example implementations relate to dynamically changing a power voltage to a system. For example, a system includes a power supply unit to provide power to the system and a control module. The control module is to dynamically enable a first output voltage level from the power supply unit to the system when the system is operating in a first mode, and to dynamically enable a second output voltage level from the power supply unit to the system when the system is operating in a second mode. The first output voltage level is greater than the second output voltage level.