公开(公告)号：US20060216502A1

公开(公告)日：2006-09-28

申请号：US10541081

申请日：2003-12-08

申请人： Takashi Kikuchi ,  Naoki Hase ,  Hiroyuki Tsuji ,  Yasuo Fushiki

发明人： Takashi Kikuchi ,  Naoki Hase ,  Hiroyuki Tsuji ,  Yasuo Fushiki

IPC分类号： B32B7/12

CPC分类号： B32B15/20 ,  B32B7/12 ,  B32B15/08 ,  B32B27/08 ,  B32B27/281 ,  B32B2274/00 ,  B32B2307/5825 ,  B32B2307/732 ,  B32B2457/08 ,  H05K1/036 ,  H05K3/386 ,  H05K2201/0129 ,  Y10T428/28

摘要： A bonding sheet that can be bonded with a metal foil by thermal lamination and has excellent adhesiveness and reduced warpage, and a one-side metal-clad laminate are provided. A bonding sheet has an adhesive layer containing a thermoplastic resin disposed on one side of a heat resistant film and a non-adhesive layer containing a non-thermoplastic resin and a thermoplastic resin disposed on the other side of the heat resistant film. The ratio of the non-thermoplastic resin to the thermoplastic resin in the non-adhesive layer is 82/18 to 97/3 on a weight basis.

摘要翻译： 提供了可以通过热层压与金属箔结合并且具有优异的粘附性和减小的翘曲的粘合片，以及单面覆金属层压板。 接合片具有包含设置在耐热膜一侧的热塑性树脂和含有非热塑性树脂的非粘合层和设置在耐热膜另一侧的热塑性树脂的粘合层。 非粘合剂层中的非热塑性树脂与热塑性树脂的重量比为82/18至97/3。

公开(公告)号：US20060021699A1

公开(公告)日：2006-02-02

申请号：US10532827

申请日：2003-10-27

申请人： Naoki Hase ,  Shinji Matsukubo ,  Hiroyuki Tsuji ,  Yasuo Fushiki

发明人： Naoki Hase ,  Shinji Matsukubo ,  Hiroyuki Tsuji ,  Yasuo Fushiki

IPC分类号： B29C65/00 ,  B32B37/00

CPC分类号： B32B37/0015 ,  B29C66/7422 ,  B29C66/74283 ,  B32B37/06 ,  B32B37/08 ,  B32B2311/00 ,  B32B2379/08 ,  B32B2398/00 ,  H05K3/022

摘要： A laminate having good appearance, which avoids such a problem that end waviness is produced in the laminate during lamination, thus making it impossible to fix the laminate in the process for formation of a circuit pattern. A method of producing a laminate is disclosed which comprises continuously laminating a heat-resistant film having thermal fusibility with a metallic foil, characterized in that the temperature of the ends of the laminate is the same as or higher than that of the center portion in the cooling process after lamination.

摘要翻译： 具有良好外观的层压体，避免了层压时在层叠体中产生端部波纹的问题，因此在形成电路图形的工序中难以将层压体固定。 公开了一种制造层压体的方法，其包括将具有热熔融性的耐热膜与金属箔连续地层压，其特征在于，所述层压体的端部的温度等于或高于所述层压体的中心部分的温度 层压后的冷却过程。

公开(公告)号：US20070275995A1

公开(公告)日：2007-11-29

申请号：US11797975

申请日：2007-05-09

申请人： Yoshiyuki Matsumoto ,  Susumu Takeuchi ,  Naoki Hase

发明人： Yoshiyuki Matsumoto ,  Susumu Takeuchi ,  Naoki Hase

IPC分类号： A61K31/4164 ,  A61K31/44 ,  A61P19/00 ,  A61P19/02 ,  A61P37/08 ,  A61P9/00

CPC分类号： C07D401/12 ,  C07D235/28 ,  C07D405/12 ,  C07D409/12 ,  C07D413/12 ,  C07D417/12 ,  C07D471/04

摘要： The present invention is a thiobenzimidazole derivative represented by the following formula (1) or a medically acceptable salt thereof wherein said thiobenzimidazole derivative and a medically acceptable salt thereof have a potent activity of inhibiting human chymase. Thus, they are potential preventive and/or therapeutic agents clinically applicable to various diseases in which human chymase is involved.

公开(公告)号：US5932345A

公开(公告)日：1999-08-03

申请号：US714072

申请日：1996-09-10

申请人： Hiroyuki Furutani ,  Naoki Hase ,  Junya Ida ,  Yoshifumi Okamoto ,  Hitoshi Nojiri ,  Shinji Inoue ,  Hirosaku Nagano

发明人： Hiroyuki Furutani ,  Naoki Hase ,  Junya Ida ,  Yoshifumi Okamoto ,  Hitoshi Nojiri ,  Shinji Inoue ,  Hirosaku Nagano

IPC分类号： C08G73/10 ,  C08G73/16 ,  C08J5/18 ,  C09J179/08 ,  H01G4/18 ,  H01L23/29 ,  H01L23/49 ,  H05K1/03 ,  D02G3/00

CPC分类号： H01L23/293 ,  C08G73/1042 ,  C08G73/105 ,  C08G73/1089 ,  C08G73/16 ,  C08J5/18 ,  C09J179/08 ,  H01G4/18 ,  C08J2379/08 ,  H01L2224/16 ,  H01L2224/32245 ,  H01L2224/432 ,  H01L2224/451 ,  H01L2224/45572 ,  H01L2224/45599 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73265 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/00014 ,  H01L2924/01013 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01058 ,  H01L2924/07802 ,  H01L2924/1532 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/3025 ,  H05K1/0346

摘要： A novel heat-fusible copolymer possessing a combination of excellent properties, including mechanical strength, resistivity against radioactive rays, chemical resistance, low temperature stability, thermal resistance, processabilty, adhesiveness, thermal fusible adhesive stability, and simultaneously satisfying requirements relating to low hygroscopic characteristic and stable dielectric constant. Also, a powder, film, laminated film, laminated insulating material, and article, such as electronic modules and capacitors, made from a thermoplastic polyimide resin composed mainly of the copolymer and suitable for use as electronic components and materials for electronic circuit components. The copolymer possesses a glass transition temperature of 100.degree. C. to 250.degree. C., a hygroscopic degree of 1 or less, and a dielectric rate of 3 or less, and has the following formula: ##STR1## wherein Ar.sub.1 represents a quadrivalent organic radical, Ar.sub.2 represents a divalent organic radial, R represents a divalent organic radical, X represents trivalent bonding radicals, m and n are each integers of 0 or more, the sum of m and n being an integer of 1 or more, and 1 is an integer of 1 or more.

摘要翻译： PCT No.PCT / JP96 / 00049 Sec。 371日期：1996年9月10日 102（e）1996年9月10日PCT PCT 1996年1月11日PCT公布。 WO96 / 21693 PCT出版物 日期1996年7月18日新型热熔共聚物具有机械强度，放射线电阻率，耐化学性，低温稳定性，耐热性，可加工性，粘合性，热熔粘合剂稳定性等优异性能的组合，同时满足要求 涉及低吸湿特性和稳定的介电常数。 另外，由主要由共聚物构成的热塑性聚酰亚胺树脂制成的适合用作电子电路部件的电子部件和材料的粉末，薄膜，层压薄膜，层叠绝缘材料，以及电子模块和电容器等制品。 共聚物的玻璃化转变温度为100〜250℃，吸湿度为1以下，介电速度为3以下，具有下式：其中Ar 1表示四价有机基团，Ar 2 表示二价有机径向，R表示二价有机基团，X表示三价键键合基团，m和n各自为0以上的整数，m和n的和为1以上的整数，1为 1个或更多。

公开(公告)号：US20060054262A1

公开(公告)日：2006-03-16

申请号：US10532766

申请日：2003-10-09

申请人： Takashi Kikuchi ,  Naoki Hase ,  Hiroyuki Tsuji ,  Yasuo Fushiki

发明人： Takashi Kikuchi ,  Naoki Hase ,  Hiroyuki Tsuji ,  Yasuo Fushiki

IPC分类号： B32B15/04 ,  B32B37/00

CPC分类号： B32B15/08 ,  B32B7/12 ,  B32B15/20 ,  B32B37/0007 ,  B32B37/26 ,  B32B2307/306 ,  B32B2307/734 ,  B32B2309/105 ,  B32B2311/00 ,  B32B2311/12 ,  B32B2379/08 ,  B32B2457/08 ,  H05K1/0393 ,  H05K3/022 ,  H05K3/386 ,  H05K2201/0154 ,  H05K2201/0355 ,  H05K2201/068 ,  H05K2203/068 ,  Y10T156/10 ,  Y10T428/31678 ,  Y10T428/31721

摘要： A method for manufacturing a heat resistant flexible laminate effectively enabling avoidance of not only visual defects but occurrence of dimensional changes, and a heat resistant flexible laminate are provided. In a process for laminating a heat resistant adhesive material and a metallic foil by thermal lamination, a film-like protective material is disposed between a pressurized surface and the metallic foil at the time of thermal lamination. At this time, coefficients of linear expansion in a temperature range of 200 degree C. to 300 degree C. of the heat resistant adhesive material and the protective material are within a range of a coefficient of linear expansion of the metallic foil ±10 ppm/degrees C. Thereby, occurrence of visual defects is not only effectively avoidable, but excellent dimensional change after etching may be exhibited.