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公开(公告)号：US20220255458A1
公开(公告)日：2022-08-11
申请号：US17729340
申请日：2022-04-26
Applicant: Huawei Digital Power Technologies Co., Ltd.
IPC: H02M7/487 , G01R19/175 , H02M1/38 , H02M7/5387
Abstract: Embodiments of the present application disclose a multi-level inverter clamping modulation method and apparatus, and an inverter. Switching elements of an inverter are controlled when an output voltage of the inverter crosses zero, and switching elements in each inverter bridge arm of an active clamp multi-level inverter include an internal tube, an external tube, and a clamping tube. The internal tube and the external tube are connected in series between a positive bus and a negative bus, the clamping tube is connected between a common terminal of the internal tube and the external tube and a bus, the internal tube is a low-frequency switching element, and the external tube and the clamping tube are high-frequency switching elements.
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公开(公告)号：US20240235423A9
公开(公告)日：2024-07-11
申请号：US18489576
申请日：2023-10-18
Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
Inventor： Yunyu TANG , Lei SHI , Yaojia ZHANG , Dong CHEN , Kai XIN
IPC: H02M7/5387 , H02M1/00
CPC classification number: H02M7/53871 , H02M1/0054
Abstract: This application describes examples of a grid-tied inverter apparatus and a grid-tied control method. In one example, the grid-tied inverter apparatus includes an inverter circuit, a controller, and a filter circuit. The controller is configured to adjust switching frequencies of a plurality of power switching transistors based on an output current value of the inverter apparatus, to adjust a resonance frequency of the filter circuit through different resonant branches, so that the resonance frequency meets a grid-tied requirement.
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公开(公告)号：US20240136948A1
公开(公告)日：2024-04-25
申请号：US18489576
申请日：2023-10-17
Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
Inventor： Yunyu TANG , Lei SHI , Yaojia ZHANG , Dong CHEN , Kai XIN
IPC: H02M7/5387 , H02M1/00
CPC classification number: H02M7/53871 , H02M1/0054
Abstract: This application describes examples of a grid-tied inverter apparatus and a grid-tied control method. In one example, the grid-tied inverter apparatus includes an inverter circuit, a controller, and a filter circuit. The controller is configured to adjust switching frequencies of a plurality of power switching transistors based on an output current value of the inverter apparatus, to adjust a resonance frequency of the filter circuit through different resonant branches, so that the resonance frequency meets a grid-tied requirement.
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公开(公告)号：US20230155499A1
公开(公告)日：2023-05-18
申请号：US18156554
申请日：2023-01-19
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Jun WANG , Lei SHI , Yunfeng LIU , Zhaohui WANG
CPC classification number: H02M3/156 , H02M1/14 , H02M1/08 , H02M1/0095
Abstract: A three-level boost converter and a control method. The three level flying-capacitor boost converter includes: an inductor, a flying capacitor, a controller, a first switching transistor and a second switching transistor as primary power transistors. When a voltage of the flying capacitor is less than or equal to a half of a bus voltage, a first driving signal is sent to the first switching transistor, and a second driving signal is sent to the second switching transistor; or when a voltage of the flying capacitor is greater than a half of a bus voltage, a first driving signal is sent to the second switching transistor, and a second driving signal is sent to the first switching transistor. The bus voltage is an output voltage Vo of the three-level boost converter.
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公开(公告)号：US20220359349A1
公开(公告)日：2022-11-10
申请号：US17734310
申请日：2022-05-02
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Dong CHEN , Lei SHI , Yunfeng LIU
IPC: H01L23/49 , H02M7/00 , H01L23/00 , H01L25/07 , H01L23/367
Abstract: A packaged power semiconductor device includes a power semiconductor wafer, a heat conduction layer, and a heat sink that are sequentially stacked, and a sealing part configured to wrap and seal the power semiconductor wafer and at least part of the heat conduction layer. The packaged power semiconductor device further includes a pin, where the pin includes a connection segment wrapped inside the sealing part, and an extension segment located outside the sealing part. The connection segment is electrically connected to the power semiconductor wafer, and a shortest distance between the extension segment and a first outer surface is greater than a creepage distance corresponding to a highest working voltage of the power semiconductor wafer. This can avoid a creepage phenomenon of the pin by limiting a distance between the first outer surface and the extension segment that is of the pin and that is exposed outside the sealing part.
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Patent Agency Ranking
公开(公告)号：US20220103070A1
公开(公告)日：2022-03-31
申请号：US17548963
申请日：2021-12-13
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Dong CHEN , Lei SHI , Zhaohui WANG
Abstract: A DC-DC converter includes: a first capacitor, a second capacitor, a first switch device, a second switch device, a third switch device, a fourth switch device, a flying capacitor, where one end of the flying capacitor is coupled to the first intermediate node, the other end of the flying capacitor is coupled the second intermediate node; and the protective circuit, including a clamping unit and a buffering unit, where when a voltage between the positive end of the bus and the negative end of the bus increases, the clamping unit clamps the first switch device to a voltage of the first capacitor, and clamps the fourth switch device to a voltage of the second capacitor, and the buffering unit reduces a current flowing through the clamping unit and the flying capacitor.
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公开(公告)号：US20240347263A1
公开(公告)日：2024-10-17
申请号：US18750996
申请日：2024-06-21
Applicant: HUAWEI DIGITAL POWER TECHNOLOGIES CO., LTD.
Inventor： Yunyu TANG , Weixin FANG , Chao LIU , Lei SHI
CPC classification number: H01F27/306 , H01F27/02 , H01F27/24
Abstract: Embodiments of this application provide a magnetic element, an inductor, an inductor assembly, and an electronic device. The magnetic element includes a top plate, a bottom plate, a side plate, and a winding structure. The top plate and the bottom plate are disposed opposite to each other at an interval in a first direction. The winding structure is connected between the top plate and the bottom plate, and is configured to wind a winding. The side plate and the winding structure are disposed at an interval in a second direction. The side plate, the top plate, the winding structure, and the bottom plate jointly form a carrier of a magnetic flux loop. The side plate includes a plurality of strip structures that are stacked. A stacking direction of the plurality of strip structures is a third direction.
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18.发明公开公开(公告)号：US20240322609A1
公开(公告)日：2024-09-26
申请号：US18735556
申请日：2024-06-06
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Haijun QIN , Jian WU , Weirong LIU , Yuan CHENG , Lei SHI
CPC classification number: H02J50/402 , H02J50/005 , H02J50/20 , H02J50/80 , H02J50/90
Abstract: A power supply end, a wireless power supply system, a power supply method, and a computer storage medium, to improve wireless power supply efficiency. The power supply end includes a transceiver and a plurality of radiation circuits. The transceiver is configured to: generate a charging signal including an electromagnetic wave of at least one frequency band, and separately provide the charging signal for the plurality of radiation circuits. Each of the plurality of radiation circuits can transmit an electromagnetic wave of one or more target frequency bands. The plurality of radiation circuits include a first radiation circuit and a second radiation circuit. One or more target frequency bands included in an electromagnetic wave transmitted by the first radiation circuit are different from one or more target frequency bands included in an electromagnetic wave transmitted by the second radiation circuit.
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公开(公告)号：US20240145426A1
公开(公告)日：2024-05-02
申请号：US18489284
申请日：2023-10-18
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Fenglong LU , Dong CHEN , Lei SHI , Yunyu TANG , Yunfeng LIU
IPC: H01L23/00
CPC classification number: H01L24/49 , H01L24/45 , H01L24/48 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48091 , H01L2224/48137 , H01L2224/48155 , H01L2224/4917 , H01L2924/13013 , H01L2924/13055
Abstract: A bonding structure and a power device. The bonding structure includes a first power unit and at least two bonding wires. At least one end of the bonding wire is connected to the first power unit through bonding. Projections that are of lead paths of the at least two bonding wires and that are on a preset plane have at least one intersection point. Spatial cross wire bonding is performed on the bonding wires, so that lead paths of the bonding wires form an angle with each other, thereby weakening electromagnetic force between the bonding wires. Therefore, fatigue due to fluctuating stress of the bonding wires can be alleviated, service lives of the bonding wires can be prolonged, and bonding effect can be ensured to a maximum extent.
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公开(公告)号：US20230299690A1
公开(公告)日：2023-09-21
申请号：US18321824
申请日：2023-05-23
Applicant: Huawei Digital Power Technologies Co., Ltd.
Inventor： Xudong WANG , Zhaohui WANG , Lei SHI
CPC classification number: H02M7/487 , H02J3/381 , H02J2300/24
Abstract: A neutral point clamped inverter and a photovoltaic power supply system include a power module, a switch module, and a control module. The power module may include a power supply and a first capacitor and a second capacitor that are connected in series and then connected in parallel to two ends of the power supply. The switch module may include a first switch unit, a second switch unit, and a third switch unit. The control module may be separately connected to the first switch unit, the second switch unit, and the third switch unit. The control module may control each of the first switch unit, the second switch unit, and the third switch unit to be turned on or turned off, so that different switch units in the switch module are selected to bear a conduction loss or a switching loss.
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