公开(公告)号：US20170245365A1

公开(公告)日：2017-08-24

申请号：US15441540

申请日：2017-02-24

Applicant: IBIDEN CO., LTD.

Inventor： Teruyuki ISHIHARA ,  Hiroyuki BAN ,  Haiying MEI

IPC: H05K1/11 ,  H05K3/40 ,  H05K3/28 ,  H05K3/02 ,  H05K3/20 ,  H05K3/30 ,  H05K3/00 ,  H05K3/38

CPC classification number: H05K1/115 ,  H01L23/49534 ,  H01L2224/16225 ,  H01L2924/181 ,  H05K1/112 ,  H05K1/113 ,  H05K3/0061 ,  H05K3/025 ,  H05K3/205 ,  H05K3/243 ,  H05K3/284 ,  H05K3/303 ,  H05K3/388 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09527 ,  H05K2201/10674 ,  H01L2924/00012

Abstract: A printed wiring board includes a laminate, a wiring layer formed on first main surface of the laminate and including conductor pads, via conductors including first and second via conductors and formed in the laminate such that each via conductor has diameter gradually reducing from the first main surface toward second main surface of the laminate, and conductor post formed on the first via conductors such that each conductor post includes a metal foil and a plating layer formed on the metal foil. The via conductors are formed such that the first via conductors are positioned in an outer edge portion of the laminate and have minimum-diameter-side surfaces positioned to form a same plane with the second main surface of the laminate and that the second via conductors are positioned in a central portion of the laminate and have minimum-diameter-side surfaces recessed from the second main surface of the laminate.