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公开(公告)号：US11756721B2
公开(公告)日：2023-09-12
申请号：US16804047
申请日：2020-02-28
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
CPC classification number: H01F27/29 , H01F27/06 , H01F27/2804 , H01F2027/065 , H01F2027/2809 , H01F2027/2819
Abstract: A planar transformer includes a coil substrate including a flexible substrate and multiple coils formed on the flexible substrate. The coil substrate is formed to have coil parts and coilless parts such that the coil parts have the coils and that the coilless parts do not have the coils, and the coil substrate is folded such that at least one of the coilless parts is sandwiched between two of the coil parts.
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公开(公告)号：US11283317B2
公开(公告)日：2022-03-22
申请号：US16567514
申请日：2019-09-11
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
Abstract: A coil substrate for a motor includes a flexible substrate, and multiple coils formed on a surface of the flexible substrate. Each of the coils has a wiring having first wiring portions and second wiring portions extending from the first wirings respectively and is formed such that the first wiring portions extend parallel with respect to each other and that the second wiring portions extend not parallel to the first wirings, and the flexible substrate is formed to be formed around a magnet of a motor such that the first wiring portions form an angle that is substantially perpendicular to a rotation direction of the motor.
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公开(公告)号：US11201515B2
公开(公告)日：2021-12-14
申请号：US16556265
申请日：2019-08-30
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
Abstract: A motor coil substrate includes a flexible substrate, and multiple coils formed on the flexible substrate such that each of the coils has a spiral shape. The flexible substrate has multiple folding lines formed and the multiple coils positioned such that the flexible substrate is folded at the folding lines and wound around a magnet and that an m-th coil and an (m+1)-th coil of the coils partially overlap one another when folded at the folding lines.
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公开(公告)号：US10756589B2
公开(公告)日：2020-08-25
申请号：US16124246
申请日：2018-09-07
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Shinobu Kato , Hitoshi Miwa , Hisashi Kato , Toshihiko Yokomaku
Abstract: A motor coil includes a magnet structure, and a laminated coil substrate formed on the magnet structure and including coil substrates and adhesive layers alternately laminated. The coil substrates are formed by folding a printed wiring board including a resin substrate, a first conductor layer formed on a first surface of the resin substrate and forming coils, and a second conductor layer formed on a second surface on the opposite side with respect to the first surface and forming coils, and the adhesive layers include an adhesive layer including a magnetic sheet.
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公开(公告)号：US10388451B2
公开(公告)日：2019-08-20
申请号：US15614919
申请日：2017-06-06
Applicant: IBIDEN CO., LTD.
Inventor： Yasuhiko Mano , Hiroaki Kodama , Hisashi Kato
IPC: H01F27/24 , H01F17/00 , H01F41/02 , H01F41/06 , H01F27/28 , H01F27/32 , H01F41/00 , H05K1/16 , H05K1/18 , H01F17/06
Abstract: An inductor component includes a core base material, a magnetic body in the core, a first conductor pattern formed on primary surface of the core, a second conductor pattern formed on secondary surface of the core, and through-hole conductors formed in through holes through the core such that the conductors are connecting the first and second patterns. The first pattern, second pattern and conductors are positioned to form an inductor such that the magnetic body is positioned on inner side of the inductor, each conductor has a diameter k1, each pattern has conductor thickness in range of 50 μm to 200 μm and has line patterns each having width w1 and separated by line separation distance w2, and a ratio of cross-sectional area of each line pattern to cross-sectional area of each conductor along the diameter k1 in direction of the width w1 is in range of 0.8 to 2.0.
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Patent Agency Ranking
公开(公告)号：US20180374630A1
公开(公告)日：2018-12-27
申请号：US16019591
申请日：2018-06-27
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA , Shinobu Kato , Hitoshi Miwa , Hisashi Kato , Toshihiko Yokomaku
Abstract: A coil includes a resin substrate, a first coil structure formed on a first surface of the resin substrate, a second coil structure formed on a second surface of the resin substrate on the opposite side with respect to the first surface such that the second coil structure is formed at a position corresponding to the first coil structure, a third coil structure formed on the second surface such that the third coil structure is positioned adjacent to the second coil structure, and a fourth coil structure formed on the first surface such that the fourth coil structure is formed at a position corresponding to the third coil structure. The resin substrate is folded such that the second coil structure and the third coil structure oppose each other.
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公开(公告)号：US20140054068A1
公开(公告)日：2014-02-27
申请号：US13975718
申请日：2013-08-26
Applicant: IBIDEN CO., LTD.
Inventor： Hisashi Kato , Ryojiro Tominaga , Tetsuya Nobutoki
CPC classification number: H05K1/0284 , H01L2924/0002 , H05K1/0271 , H05K3/4602 , H05K3/4644 , H05K3/4688 , H05K2201/0195 , H05K2201/029 , H05K2201/09136 , H05K2201/096 , Y10T156/10 , H01L2924/00
Abstract: A printed wiring board includes a core substrate including resin and inorganic fiber, a first buildup layer formed on a first surface of the substrate and including resin insulating layers and first conductive layers, and a second buildup layer formed on a second surface of the substrate on the opposite side of the core substrate with respect to the first surface and including resin insulating layers and second conductive layers. The first conductive layers in the first buildup have sum V1 of volumes which is greater than sum V2 of volumes of the second conductive layers in the second buildup, and the substrate has a first-surface side portion which has resin amount greater than resin amount of a second-surface side portion of the substrate where boundary between the first-surface and second-surface side portions is set with respect to the center line in the thickness direction of the substrate.
Abstract translation: 印刷电路板包括：包括树脂和无机纤维的芯基板，形成在基板的第一表面上并包括树脂绝缘层和第一导电层的第一累积层，以及形成在基板的第二表面上的第二累积层， 芯基板相对于第一表面的相对侧，并且包括树脂绝缘层和第二导电层。 第一累积中的第一导电层的体积总和V1大于第二聚集体中的第二导电层的体积的和V2，并且基板具有树脂量大于树脂量的第一表面侧部分 基板的第二表面侧部分相对于基板的厚度方向上的中心线设定在第一表面和第二表面侧部分之间的边界。
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公开(公告)号：US11695309B2
公开(公告)日：2023-07-04
申请号：US17386957
申请日：2021-07-28
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Hitoshi Miwa , Shinobu Kato , Toshihiko Yokomaku , Hisashi Kato , Takahisa Hirasawa , Tetsuya Muraki , Takayuki Furuno
IPC: H02K3/26
CPC classification number: H02K3/26 , H02K2203/03
Abstract: A coil substrate includes a flexible substrate, and coils formed on the flexible substrate such that the coils are positioned substantially in a raw and that each coil has a center space and wirings surrounding the center space. The coils are formed such that each coil includes first wirings on a first surface of the flexible substrate, second wirings on a second surface of the flexible substrate on the opposite side with respect to the first surface, and via conductors penetrating through the flexible substrate and connecting the first and second wirings, and the coils are positioned such that a m-th coil has the second wirings positioned below the center space of a (m+1)-th coil and that a (m+2)-th coil has the first coils positioned on the center space of a (m+1)-th coil, where in is an integer equal to or greater than 1.
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公开(公告)号：US10978926B2
公开(公告)日：2021-04-13
申请号：US16270642
申请日：2019-02-08
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Shinobu Kato , Hitoshi Miwa , Hisashi Kato , Toshihiko Yokomaku
Abstract: A motor coil substrate includes a flexible insulating substrate having a cylindrical shape, wirings formed on a first surface of the flexible insulating substrate and a second surface of the flexible insulating substrate on the opposite side with respect to the first surface, and via conductors including copper plating penetrating through the flexible insulating substrate such that the via conductors are connecting the wirings formed on the first surface and the wirings formed on the second surface. The wirings and the via conductors form coils formed in spiral shapes, and the flexible insulating substrate is wound more than one turn in a circumferential direction of the cylindrical shape such that the first surface on an inner side of the cylindrical shape and the second surface on an outer side of the cylindrical shape oppose each other.
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公开(公告)号：US10886048B2
公开(公告)日：2021-01-05
申请号：US16161562
申请日：2018-10-16
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Shinobu Kato , Hitoshi Miwa , Hisashi Kato , Toshihiko Yokomaku
Abstract: A laminated coil substrate includes a printed wiring board including a resin substrate, a first conductor layer on first surface of the substrate and including coils, and a second conductor layer formed on second surface of the substrate on the opposite side and including coils. The printed wiring board includes first, second and third coil substrates that are folded such that the second surface of the substrate in the first and second coil substrates oppose each other and that the first surface of the substrate in the second and third coil substrates oppose each other, the second conductor layer of the printed wiring board includes connection wire on the second surface of the substrate and connecting the first and second coil substrates, and the first conductor layer of the printed wiring board includes connection wire on the first surface of the substrate and connecting the second and third coil substrates.
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