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1.发明授权公开(公告)号：US09508483B2
公开(公告)日：2016-11-29
申请号：US13927243
申请日：2013-06-26
Applicant: IBIDEN Co., Ltd.
Inventor： Yasuhiko Mano , Kazuhiro Yoshikawa , Haruhiko Morita
CPC classification number: H01F27/2804 , H01F27/24 , H01F41/041 , H01F2027/2809 , Y10T29/4902
Abstract: An inductor device for a printed wiring board has an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding the circumference of the magnetic core structure.
Abstract translation: 一种用于印刷电路板的电感器件具有绝缘层，该绝缘层具有穿过绝缘层的第一穿透孔，磁芯结构包括通过绝缘层填充在第一穿透孔中的磁性材料，使得磁芯结构包括第一 形成在第一穿透孔中的磁性体层通过绝缘层形成，导体层形成在绝缘层上并具有电感图案，使得电感器图案围绕磁芯结构的圆周。
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公开(公告)号：US10388451B2
公开(公告)日：2019-08-20
申请号：US15614919
申请日：2017-06-06
Applicant: IBIDEN CO., LTD.
Inventor： Yasuhiko Mano , Hiroaki Kodama , Hisashi Kato
IPC: H01F27/24 , H01F17/00 , H01F41/02 , H01F41/06 , H01F27/28 , H01F27/32 , H01F41/00 , H05K1/16 , H05K1/18 , H01F17/06
Abstract: An inductor component includes a core base material, a magnetic body in the core, a first conductor pattern formed on primary surface of the core, a second conductor pattern formed on secondary surface of the core, and through-hole conductors formed in through holes through the core such that the conductors are connecting the first and second patterns. The first pattern, second pattern and conductors are positioned to form an inductor such that the magnetic body is positioned on inner side of the inductor, each conductor has a diameter k1, each pattern has conductor thickness in range of 50 μm to 200 μm and has line patterns each having width w1 and separated by line separation distance w2, and a ratio of cross-sectional area of each line pattern to cross-sectional area of each conductor along the diameter k1 in direction of the width w1 is in range of 0.8 to 2.0.
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3.发明授权公开(公告)号：US09514876B2
公开(公告)日：2016-12-06
申请号：US14603822
申请日：2015-01-23
Applicant: IBIDEN Co., Ltd.
Inventor： Yasuhiko Mano , Kazuhiro Yoshikawa , Haruhiko Morita
CPC classification number: H01F27/2804 , H01F27/24 , H01F41/041 , H01F2027/2809 , Y10T29/4902
Abstract: A printed wiring board includes an insulation layer having a first penetrating hole penetrating through the insulation layer, a magnetic core structure including a magnetic material filled in the first penetrating hole through the insulation layer such that the magnetic core structure including a first magnetic body layer formed in the first penetrating hole is formed through the insulation layer, and a conductor layer formed on the insulation layer and having an inductor pattern such that the inductor pattern is surrounding a circumference of the magnetic core structure. The magnetic core structure and the inductor pattern of the conductor layer form an inductor device.
Abstract translation: 印刷布线板包括具有穿过绝缘层的第一穿透孔的绝缘层，包括填充在穿过绝缘层的第一穿透孔中的磁性材料的磁芯结构，使得包括形成第一磁性体层的磁芯结构 在第一贯通孔中形成绝缘层，导体层形成在绝缘层上并具有使电感器图案围绕磁芯结构的圆周的电感图案。 导体层的磁芯结构和电感器图案形成电感器件。
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公开(公告)号：US20140225701A1
公开(公告)日：2014-08-14
申请号：US14178600
申请日：2014-02-12
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko MORITA , Yasuhiko Mano , Kazuhiro Yoshikawa
IPC: H01F17/00
CPC classification number: H01F17/0013 , H01F2017/0066
Abstract: A printed wiring board includes a first core substrate having an opening portion, an inductor component accommodated in the opening portion of the first core substrate, a first buildup layer formed on a first surface of the first core substrate and the inductor component, and a second buildup layer formed on a second surface of the first core substrate and the inductor component on the opposite side with respect to the first surface of the first core substrate. The inductor component has a second core substrate, a buildup layer formed on a surface of the second core substrate and a coil layer formed on the buildup layer, and the second buildup layer has a coil layer and a via conductor connecting the coil layer in the second buildup layer and the coil layer formed on the buildup layer in the inductor component.
Abstract translation: 印刷电路板包括具有开口部分的第一芯基板，容纳在第一芯基板的开口部分中的电感器部件，形成在第一芯基板和电感器部件的第一表面上的第一累积层， 形成在第一芯基板的第二表面上的电感器部件和相对于第一芯基板的第一表面的相反侧的电感器部件。 电感器部件具有第二芯基板，形成在第二芯基板的表面上的积累层和形成在积层上的线圈层，第二累积层具有线圈层和通孔导体， 第二积累层和形成在电感器部件中的积聚层上的线圈层。
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公开(公告)号：US09478343B2
公开(公告)日：2016-10-25
申请号：US14178600
申请日：2014-02-12
Applicant: IBIDEN CO., LTD.
Inventor： Haruhiko Morita , Yasuhiko Mano , Kazuhiro Yoshikawa
CPC classification number: H01F17/0013 , H01F2017/0066
Abstract: A printed wiring board includes a first core substrate having an opening portion, an inductor component accommodated in the opening portion of the first core substrate, a first buildup layer formed on a first surface of the first core substrate and the inductor component, and a second buildup layer formed on a second surface of the first core substrate and the inductor component on the opposite side with respect to the first surface of the first core substrate. The inductor component has a second core substrate, a buildup layer formed on a surface of the second core substrate and a coil layer formed on the buildup layer, and the second buildup layer has a coil layer and a via conductor connecting the coil layer in the second buildup layer and the coil layer formed on the buildup layer in the inductor component.
Abstract translation: 印刷电路板包括具有开口部分的第一芯基板，容纳在第一芯基板的开口部分中的电感器部件，形成在第一芯基板和电感器部件的第一表面上的第一累积层， 形成在第一芯基板的第二表面上的电感器部件和相对于第一芯基板的第一表面的相反侧的电感器部件。 电感器部件具有第二芯基板，形成在第二芯基板的表面上的积累层和形成在积层上的线圈层，第二累积层具有线圈层和通孔导体， 第二积累层和形成在电感器部件中的积聚层上的线圈层。
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Patent Agency Ranking
公开(公告)号：US09307645B2
公开(公告)日：2016-04-05
申请号：US13938637
申请日：2013-07-10
Applicant: IBIDEN Co., Ltd.
Inventor： Yasuhiko Mano , Kazuhiro Yoshikawa , Takashi Kariya
CPC classification number: H05K1/165 , H01L2924/3511 , H05K1/0233 , H05K1/186 , H05K3/0032 , H05K3/30 , H05K3/4676 , H05K3/4697 , H05K2201/0209 , Y10T29/4913
Abstract: A printed wiring board includes a core substrate, a first buildup layer formed on a first surface of the core substrate and including an insulation layer and a conductive layer, a second buildup layer formed on a second surface of the core substrate on the opposite side with respect to the first buildup layer and including an insulation layer and a conductive layer, and an inductor device positioned in the second buildup layer and including a resin insulation layer and a coil layer formed on the resin insulation layer. The second buildup layer has a cavity in which the inductor device is accommodated.
Abstract translation: 印刷电路板包括芯基板，形成在芯基板的第一表面上并包括绝缘层和导电层的第一累积层，在相对侧的芯基板的第二表面上形成的第二累积层， 相对于第一累积层，并且包括绝缘层和导电层，以及位于第二堆积层中的电感器件，并且包括树脂绝缘层和形成在树脂绝缘层上的线圈层。 第二累积层具有容纳电感器装置的空腔。
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7.发明授权Printed wiring board, inductor component, and method for manufacturing inductor component 有权印刷线路板，电感器部件以及用于制造电感器部件的方法公开(公告)号：US09287034B2
公开(公告)日：2016-03-15
申请号：US13729106
申请日：2012-12-28
Applicant: IBIDEN CO., LTD.
Inventor： Yasuhiko Mano , Kazuhiro Yoshikawa , Takashi Kariya
CPC classification number: H01F27/2804 , H01F17/0013 , H01F2017/002 , H01F2017/0066 , H05K1/162 , H05K1/165 , H05K1/18 , H05K1/185 , H05K3/4602 , H05K3/4682 , H05K2201/086 , H05K2201/1003 , H05K2203/0191 , H05K2203/1469
Abstract: A printed wiring board has a core base having an opening portion, an inductor component accommodated in the opening portion, and a filler resin filling gap between the component and a side wall of the opening portion. The component has a support layer, a first conductive pattern on the support, an interlayer insulation layer on the support and first pattern, a second conductive pattern on the insulation layer, and a via conductor in the insulation layer and connecting the first and second patterns, the insulation layer includes a magnetic layer and a resin layer covering the magnetic layer, the magnetic layer includes magnetic material and resin material and has a first hole, the insulation layer has a second hole penetrating through the resin layer such that the second hole passes through the first hole and extends to the first pattern, and the via conductor is formed in the second hole.
Abstract translation: 印刷电路板具有：具有开口部的芯基部，容纳在开口部的电感器部，以及所述部件与所述开口部的侧壁之间的填充树脂填充间隙。 所述部件具有支撑层，支撑体上的第一导电图案，支撑件上的层间绝缘层和第一图案，绝缘层上的第二导电图案，以及绝缘层中的通孔导体，并连接第一和第二图案 所述绝缘层包括磁性层和覆盖所述磁性层的树脂层，所述磁性层包括磁性材料和树脂材料，并且具有第一孔，所述绝缘层具有穿过所述树脂层的第二孔，使得所述第二孔通过 通过第一孔延伸到第一图案，并且通孔导体形成在第二孔中。
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公开(公告)号：US20170352471A1
公开(公告)日：2017-12-07
申请号：US15614919
申请日：2017-06-06
Applicant: IBIDEN CO., LTD.
Inventor： Yasuhiko Mano , Hiroaki Kodama , Hisashi Kato
CPC classification number: H01F27/2828 , H01F17/0006 , H01F17/0013 , H01F17/0033 , H01F27/24 , H01F27/324 , H01F41/005 , H01F2017/002 , H01F2017/065 , H05K1/165 , H05K1/18 , H05K1/185 , H05K2201/1003 , H05K2203/1469
Abstract: An inductor component includes a core base material, a magnetic body in the core, a first conductor pattern formed on primary surface of the core, a second conductor pattern formed on secondary surface of the core, and through-hole conductors formed in through holes through the core such that the conductors are connecting the first and second patterns. The first pattern, second pattern and conductors are positioned to form an inductor such that the magnetic body is positioned on inner side of the inductor, each conductor has a diameter k1, each pattern has conductor thickness in range of 50 μm to 200 μm and has line patterns each having width w1 and separated by line separation distance w2, and a ratio of cross-sectional area of each line pattern to cross-sectional area of each conductor along the diameter k1 in direction of the width w1 is in range of 0.8 to 2.0.
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公开(公告)号：US09326377B2
公开(公告)日：2016-04-26
申请号：US13953150
申请日：2013-07-29
Applicant: IBIDEN Co., Ltd.
Inventor： Haruhiko Morita , Shinobu Kato , Yasuhiko Mano , Satoshi Kurokawa
CPC classification number: H05K1/0306 , H05K1/0219 , H05K1/024 , H05K3/4673 , H05K2201/0191
Abstract: A printed wiring board includes a first buildup layer including first and second interlayer insulating layers, and a second buildup layer formed on the first buildup layer and including the outermost interlayer insulating layer and the outermost conductive layer formed on the outermost interlayer resin insulating layer. The buildup layer includes a first signal line interposed between the first and second interlayer insulating layers, a first ground layer formed on a surface of the first interlayer resin insulating layer, and a second ground layer formed on a surface of the second interlayer resin insulating layer such that the first signal line is interposed between the first and second ground layers, the first and second interlayer insulating layers and the outermost interlayer insulating layer include resin materials, respectively, and the first and second interlayer insulating layers are different from the outermost interlayer insulating layer in material and/or thickness.
Abstract translation: 印刷电路板包括：第一累积层，包括第一和第二层间绝缘层;以及第二累积层，形成在第一堆积层上，并且包括最外层间绝缘层和形成在最外层间树脂绝缘层上的最外层导电层。 积层层包括插入在第一和第二层间绝缘层之间的第一信号线，形成在第一层间树脂绝缘层的表面上的第一接地层和形成在第二层间树脂绝缘层的表面上的第二接地层 使得第一信号线插入在第一和第二接地层之间，第一和第二层间绝缘层和最外层间绝缘层分别包括树脂材料，并且第一和第二层间绝缘层不同于最外层间绝缘层 材料层和/或厚度层。
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10.发明授权公开(公告)号：US09257217B2
公开(公告)日：2016-02-09
申请号：US13954431
申请日：2013-07-30
Applicant: IBIDEN CO., LTD.
Inventor： Kazuhiro Yoshikawa , Yasuhiko Mano
CPC classification number: H01F5/003 , H01F5/00 , H01F17/0013 , H01F41/32 , H01F2017/0066 , H05K1/165 , H05K1/185 , H05K2201/083 , H05K2201/09672 , Y10T29/4902
Abstract: An inductor element has a support layer, a first conductive layer formed on the support layer and having a first inductor pattern and a first pad at one end of the first inductor pattern, a first insulation layer formed on the support layer and first conductive layer and including a magnetic material layer and a resin layer, a second conductive layer formed on the first insulation layer and having a second inductor pattern and a second pad at one end of the second inductor pattern, and a via conductor formed through the first insulation layer and connecting the first and second conductive layers. The magnetic material layer is covering at least part of the first inductor pattern, the resin layer is covering the first pad and has opening exposing at least part of the first pad, and the via conductor is formed in the opening of the first insulation layer.
Abstract translation: 电感器元件具有支撑层，形成在支撑层上并具有第一电感器图案的第一导电层和位于第一电感器图案的一端的第一焊盘，形成在支撑层和第一导电层上的第一绝缘层和 包括磁性材料层和树脂层，形成在第一绝缘层上并具有第二电感器图案的第二导电层和在第二电感器图案的一端的第二焊盘，以及通过第一绝缘层形成的通孔导体和 连接第一和第二导电层。 磁性材料层覆盖第一电感器图案的至少一部分，树脂层覆盖第一焊盘，并且具有暴露第一焊盘的至少一部分的开口，并且通孔导体形成在第一绝缘层的开口中。
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