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公开(公告)号：US20140054068A1
公开(公告)日：2014-02-27
申请号：US13975718
申请日：2013-08-26
申请人： IBIDEN CO., LTD.
发明人： Hisashi Kato , Ryojiro Tominaga , Tetsuya Nobutoki
CPC分类号： H05K1/0284 , H01L2924/0002 , H05K1/0271 , H05K3/4602 , H05K3/4644 , H05K3/4688 , H05K2201/0195 , H05K2201/029 , H05K2201/09136 , H05K2201/096 , Y10T156/10 , H01L2924/00
摘要： A printed wiring board includes a core substrate including resin and inorganic fiber, a first buildup layer formed on a first surface of the substrate and including resin insulating layers and first conductive layers, and a second buildup layer formed on a second surface of the substrate on the opposite side of the core substrate with respect to the first surface and including resin insulating layers and second conductive layers. The first conductive layers in the first buildup have sum V1 of volumes which is greater than sum V2 of volumes of the second conductive layers in the second buildup, and the substrate has a first-surface side portion which has resin amount greater than resin amount of a second-surface side portion of the substrate where boundary between the first-surface and second-surface side portions is set with respect to the center line in the thickness direction of the substrate.
摘要翻译： 印刷电路板包括：包括树脂和无机纤维的芯基板，形成在基板的第一表面上并包括树脂绝缘层和第一导电层的第一累积层，以及形成在基板的第二表面上的第二累积层， 芯基板相对于第一表面的相对侧，并且包括树脂绝缘层和第二导电层。 第一累积中的第一导电层的体积总和V1大于第二聚集体中的第二导电层的体积的和V2，并且基板具有树脂量大于树脂量的第一表面侧部分 基板的第二表面侧部分相对于基板的厚度方向上的中心线设定在第一表面和第二表面侧部分之间的边界。
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2.发明申请WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权具有内置电子元件的接线板及其制造方法公开(公告)号：US20160037647A1
公开(公告)日：2016-02-04
申请号：US14817388
申请日：2015-08-04
申请人： IBIDEN CO., LTD.
CPC分类号： H05K3/4697 , H05K1/186 , H05K3/4007 , H05K3/429 , H05K3/4644 , H05K2201/096
摘要： A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.
摘要翻译： 具有内置电子部件的布线基板包括具有空腔的基板，容纳在所述空腔中的电子部件，形成在所述基板上并且在所述空腔中的所述电子部件上方延伸的导电层，以及形成在所述基板上的阻焊层 所述导电层具有第一和第二开口，使得所述第一开口形成包括由所述第一开口暴露的所述导电层的第一焊盘，并且所述第二开口形成包括由所述第二开口暴露的所述导电层的第二焊盘。 第二焊盘包括分别直接形成在电子部件上并且连接到电子部件的导电层的部分，第一焊盘包括相对于电子部件形成在外侧的导电层的部分，并且每个第二焊盘 开口的开口直径小于每个第一开口的开口直径。
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公开(公告)号：US20160020164A1
公开(公告)日：2016-01-21
申请号：US14799846
申请日：2015-07-15
申请人： IBIDEN CO., LTD.
CPC分类号： H01L23/49822 , C23C18/1651 , C23C18/1653 , C23C18/31 , C23C18/32 , C23C18/42 , C25D7/00 , H01L21/4857 , H01L21/486 , H01L23/145 , H01L23/15 , H01L23/49827 , H01L23/49894 , H01L23/5389 , H01L25/0655 , H01L2224/16227 , H01L2924/15192 , H01L2924/15313 , H05K1/186 , H05K3/4007 , H05K3/4644 , H05K3/4694 , H05K3/4697 , H05K2201/10378
摘要： A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer.
摘要翻译： 布线基板包括第一最外导体层，覆盖第一导体层的第一最外绝缘层，形成在第一导体层相对侧的第二最外导体层和覆盖第二导体层的第二最外绝缘层。 第一绝缘层具有第一开口，使得第一开口暴露包括第一导体层的部分的第一导体焊盘，第二绝缘层具有第二开口，使得第二开口暴露包括第二导体层的部分的第二导体焊盘， 每个第一导体焊盘具有相对于第一绝缘层的外表面凹陷的第一镀层，并且每个第二导体焊盘具有与第二绝缘层的外表面齐平或具有突出形状的凸起形状的第二镀层 从第二绝缘层的外表面。
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公开(公告)号：US09613893B2
公开(公告)日：2017-04-04
申请号：US14799846
申请日：2015-07-15
申请人： IBIDEN CO., LTD.
IPC分类号： H05K1/16 , H01L23/498 , H01L21/48 , C23C18/32 , C23C18/42 , C23C18/31 , C23C18/16 , H01L23/538 , C25D7/00 , H05K3/40 , H01L25/065 , H01L23/14 , H01L23/15 , H05K3/46 , H05K1/18
CPC分类号： H01L23/49822 , C23C18/1651 , C23C18/1653 , C23C18/31 , C23C18/32 , C23C18/42 , C25D7/00 , H01L21/4857 , H01L21/486 , H01L23/145 , H01L23/15 , H01L23/49827 , H01L23/49894 , H01L23/5389 , H01L25/0655 , H01L2224/16227 , H01L2924/15192 , H01L2924/15313 , H05K1/186 , H05K3/4007 , H05K3/4644 , H05K3/4694 , H05K3/4697 , H05K2201/10378
摘要： A wiring substrate includes a first outermost conductor layer, a first outermost insulating layer covering the first conductor layer, a second outermost conductor layer formed on opposite side of the first conductor layer, and a second outermost insulating layer covering the second conductor layer. The first insulating layer has first openings such that the first openings are exposing first conductor pads including portions of the first conductor layer, the second insulating layer has second openings such that the second openings are exposing second conductor pads including portions of the second conductor layer, each of the first conductor pads has a first plating layer recessed with respect to outer surface of the first insulating layer, and each of the second conductor pads has a second plating layer formed flush with outer surface of the second insulating layer or having bump shape protruding from the outer surface of the second insulating layer.
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公开(公告)号：US09232638B2
公开(公告)日：2016-01-05
申请号：US13975718
申请日：2013-08-26
申请人： IBIDEN CO., LTD.
发明人： Hisashi Kato , Ryojiro Tominaga , Tetsuya Nobutoki
CPC分类号： H05K1/0284 , H01L2924/0002 , H05K1/0271 , H05K3/4602 , H05K3/4644 , H05K3/4688 , H05K2201/0195 , H05K2201/029 , H05K2201/09136 , H05K2201/096 , Y10T156/10 , H01L2924/00
摘要： A printed wiring board includes a core substrate including resin and inorganic fiber, a first buildup layer formed on a first surface of the substrate and including resin insulating layers and first conductive layers, and a second buildup layer formed on a second surface of the substrate on the opposite side of the core substrate with respect to the first surface and including resin insulating layers and second conductive layers. The first conductive layers in the first buildup have sum V1 of volumes which is greater than sum V2 of volumes of the second conductive layers in the second buildup, and the substrate has a first-surface side portion which has resin amount greater than resin amount of a second-surface side portion of the substrate where boundary between the first-surface and second-surface side portions is set with respect to the center line in the thickness direction of the substrate.
摘要翻译： 印刷电路板包括：包括树脂和无机纤维的芯基板，形成在基板的第一表面上并包括树脂绝缘层和第一导电层的第一累积层，以及形成在基板的第二表面上的第二累积层， 芯基板相对于第一表面的相对侧，并且包括树脂绝缘层和第二导电层。 第一累积中的第一导电层的体积总和V1大于第二聚集体中的第二导电层的体积的和V2，并且基板具有树脂量大于树脂量的第一表面侧部分 基板的第二表面侧部分相对于基板的厚度方向上的中心线设定在第一表面和第二表面侧部分之间的边界。
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公开(公告)号：US20130219714A1
公开(公告)日：2013-08-29
申请号：US13853087
申请日：2013-03-29
申请人： IBIDEN CO., LTD.
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K3/40
CPC分类号： H05K3/4038 , H05K1/0222 , H05K1/0231 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , H05K2201/10636 , Y02P70/611 , Y10T29/49165
摘要： A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.
摘要翻译： 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。
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7.发明授权公开(公告)号：US09832878B2
公开(公告)日：2017-11-28
申请号：US14819579
申请日：2015-08-06
申请人： IBIDEN CO., LTD.
CPC分类号： H05K1/185 , H05K1/0224 , H05K3/305 , H05K3/429 , H05K3/4694 , H05K2201/09536 , H05K2201/09745 , H05K2201/10378 , H05K2201/2072
摘要： A wiring board with a cavity for a built-in electronic component includes a conductor layer including a conductor circuit layer and a plane layer, and an insulating layer laminated on the conductor layer and having a cavity such that the cavity is forming an exposed portion of the plane layer and formed to mount a built-in electronic component on the exposed portion of the plane layer. The plane layer has a recess structure formed in an outer peripheral portion in the exposed portion of the plane layer.
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公开(公告)号：US09723728B2
公开(公告)日：2017-08-01
申请号：US14817388
申请日：2015-08-04
申请人： IBIDEN CO., LTD.
CPC分类号： H05K3/4697 , H05K1/186 , H05K3/4007 , H05K3/429 , H05K3/4644 , H05K2201/096
摘要： A wiring board with a built-in electronic component includes a substrate having a cavity, an electronic component accommodated in the cavity, a conductive layer formed on the substrate and extending over the electronic component in the cavity, and a solder-resist layer formed on the conductive layer and having first and second openings such that the first openings are forming first pads including the conductive layer exposed by the first openings and that the second openings are forming second pads including the conductive layer exposed by the second openings. The second pads include portions of the conductive layer formed directly over the electronic component, respectively, and connected to the electronic component, the first pads include portions of the conductive layer formed on outer side with respect to the electronic component, respectively, and each second opening has an opening diameter which is formed smaller than an opening diameter of each first opening.
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公开(公告)号：US09520222B2
公开(公告)日：2016-12-13
申请号：US14041638
申请日：2013-09-30
申请人： IBIDEN CO., LTD.
发明人： Ryojiro Tominaga , Keinosuke Ino
CPC分类号： H01F27/2804 , H01F41/005 , H01F2017/002 , H01F2027/2809 , H05K1/0216 , H05K1/165 , H05K3/4644 , H05K2201/0191 , H05K2201/096 , Y10T156/10
摘要： A wiring board includes a substrate including first insulation layers, a second insulation layer on the first layers, a third insulation layer on the second layer, and a plain conductor on the third layer. The substrate has inductor forming portion in which inductor patterns are formed on the first layers and first via conductors formed in the first layers such that the first via conductors connect the inductor patterns through the first layers, the substrate has a land on the second layer and a second via conductor in the second layer such that the second via conductor connects the land and the outermost inductor pattern, the substrate has a third via conductor in the third layer such that the third via conductor connects the plain conductor and land and has the central axis passing through the center of the third via conductor inside projected region of the second via conductor.
摘要翻译： 布线基板包括：基板，其包括第一绝缘层，第一层上的第二绝缘层，第二层上的第三绝缘层，以及第三层上的平面导体。 衬底具有电感器形成部分，其中电感器图案形成在第一层上形成并且形成在第一层中的第一通孔导体，使得第一通孔导体通过第一层连接电感器图案，衬底在第二层上具有焊盘， 在第二层中的第二通孔导体，使得第二通孔导体连接焊盘和最外面的电感器图案，衬底在第三层中具有第三通孔导体，使得第三通孔导体连接平面导体和焊盘，并且具有中心 轴穿过第二通孔导体的投影区域内的第三通路导体的中心。
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公开(公告)号：US09226409B2
公开(公告)日：2015-12-29
申请号：US13853087
申请日：2013-03-29
申请人： IBIDEN CO., LTD.
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
CPC分类号： H05K3/4038 , H05K1/0222 , H05K1/0231 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , H05K2201/10636 , Y02P70/611 , Y10T29/49165
摘要： A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.
摘要翻译： 布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路， 衬底和第一或第二电路，以及在层间层上的第三导电电路。 层间层在层间层中具有通孔导体，并连接第三电路和第二导体。 衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体 。 通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。
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