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    Method of manufacturing multi-function LSI wafers
    12.
    发明授权
    Method of manufacturing multi-function LSI wafers 失效
    制造多功能LSI晶圆的方法

    公开(公告)号：US3879839A

    公开(公告)日：1975-04-29

    申请号：US36709373

    申请日：1973-06-04

    Applicant: IBM

    Inventor： LOGUE JOSEPH C

    IPC: H01L21/822 ,  H01L21/00 ,  H01L21/66 ,  H01L21/82 ,  H01L27/00 ,  H01L27/04 ,  H01L27/118 ,  H01L7/64

    CPC classification number: H01L27/118 ,  H01L21/00 ,  H01L27/00

    Abstract: A system that is to be placed on a wafer is partitioned into reasonably large functions, each provided with a set of I/O and power pads. The wafer design is called ''''design A''''. A second wafer design (design B) that is the mirror image of design A is also constructed. Wafers of designs A and B are tested and divided into two groups: group I wafers have relatively few functions that are inoperative; group II wafers have relatively few functions that are operative. Inoperative functions are removed from group I wafers and discarded; good functions are removed from group II wafers and retained. A given function on wafer A is the mirror image of the same function on wafer B. Therefore, a given function from a group II wafer A (or B) can be inverted and attached to a group I wafer B (or A) that has had the corresponding function removed from it. The I/O and power pads of the function removed from the group II wafer are joined to the I/O and power pads remaining on the group I wafer.

    Abstract translation: 放置在晶片上的系统被划分成相当大的功能，每个功能都配有一组I / O和电源板。 晶圆设计称为“设计A”。 还构建了第二个晶片设计（设计B），即设计A的镜像。 设计A和B的晶片被测试并分为两组：第一组晶片具有相对较少的功能不起作用; 第二组晶片具有相对较少的功能。 从I组晶片中除去不能工作的功能并丢弃; 良好的功能从第二组晶圆中取出并保留下来。 晶片A上的给定功能是在晶片B上具有相同功能的镜像。因此，来自组II晶片A（或B）的给定功能可以反转并附着到具有 有相应的功能从中删除。 将从II组晶片去除的功能的I / O和电源焊盘连接到I组晶圆上剩余的I / O和电源板。

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