公开(公告)号：US12025567B2

公开(公告)日：2024-07-02

申请号：US17725871

申请日：2022-04-21

Applicant: IMEC VZW

Inventor： Ziduo Lin ,  Abdulkadir Yurt ,  Murali Jayapala ,  Geert Vanmeerbeeck

IPC: G01N21/90 ,  G01N21/88

CPC classification number: G01N21/90 ,  G01N2021/8845

Abstract: An illumination system and method for illumination of a sample in a container is described herein. In some embodiments, the container includes a defined volume for receiving the sample. The illumination system includes, in some embodiments, at least one light source, a mask comprising an opaque portion, preventing light from passing through the mask, and an at least partially transparent portion, allowing light to pass through the mask. The illumination system can be adapted to be positioned such that the light generated by the light source, passing through the mask, illuminates the sample in the container. The light source and the mask are configured such that a shape, a size, and a position of a projection of the light passing through the mask, onto a plane of a bottom surface of the container, match a shape, a size, and a position of the bottom surface.

公开(公告)号：US20220350040A1

公开(公告)日：2022-11-03

申请号：US17661251

申请日：2022-04-28

Applicant: IMEC vzw

Inventor： Jiwon Lee ,  Xavier Rottenberg ,  Murali Jayapala

IPC: G01T1/24 ,  G02B6/42

Abstract: In one aspect, an optical system is disclosed. In some embodiments, the optical system includes an optical waveguide, and at least two coupling means forming at least one confocal point being located within the optical waveguide, where a first coupling means of the at least two coupling means has a first focal length, and a second coupling means of the at least two coupling means has a second focal length. In some examples, the first coupling means is configured to couple and/or focus incident light to the optical waveguide, and the second coupling means is configured to emit and/or collimate light conveyed by the optical waveguide.

公开(公告)号：US20200285194A1

公开(公告)日：2020-09-10

申请号：US16648987

申请日：2018-09-19

Applicant: IMEC VZW

Inventor： Abdulkadir Yurt ,  Richard Stahl ,  Murali Jayapala ,  Geert Vanmeerbeeck

IPC: G03H1/04

Abstract: Example embodiments relate to imaging devices for in-line holographic imaging of objects. One embodiment includes an imaging device for in-line holographic imaging of an object. The imaging device includes a set of light sources configured to output light in confined illumination cones. The imaging device also includes an image sensor that includes a set of light-detecting elements. The set of light sources are configured to output light such that the confined illumination cones are arranged side-by-side and illuminate a specific part of the object. The image sensor is arranged such that the light-detecting elements detect a plurality of interference patterns. Each interference pattern is formed by diffracted light from the object originating from a single light source and undiffracted light from the same single light source. At least a subset of the set of light-detecting elements is arranged to detect light relating to not more than one interference pattern.

公开(公告)号：US10126709B2

公开(公告)日：2018-11-13

申请号：US15727832

申请日：2017-10-09

Applicant: IMEC VZW

Inventor： Richard Stahl ,  Murali Jayapala ,  Andy Lambrechts ,  Geert Vanmeerbeeck

IPC: G03H1/04 ,  G03H1/26 ,  G01N15/14 ,  G01N15/10

Abstract: Embodiments described herein relate to lens-free imaging. One example embodiment may include a lens-free imaging device for imaging a moving sample. The lens-free imaging device may include a radiation source configured to emit a set of at least two different wavelengths towards the moving sample. The lens-free imaging device is configured to image samples for which a spectral response does not substantially vary for a set of at least two different wavelengths. The lens-free imaging device may also include a line scanner configured to obtain a line scan per wavelength emitted by the radiation source and reflected by, scattered by, or transmitted through the moving sample. The line scanner is configured to regularly obtain a line scan per wavelength. Either the radiation source or the line scanner is configured to isolate data of the at least two different wavelengths.

公开(公告)号：US20170005018A1

公开(公告)日：2017-01-05

申请号：US15193383

申请日：2016-06-27

Applicant: IMEC vzw

Inventor： Ingrid De Wolf ,  Murali Jayapala ,  Arnita Podpod ,  John Slabbekoorn ,  Carolina Blanch Perez del Notario

IPC: H01L21/66 ,  G05B19/418 ,  H01L21/677 ,  H01L21/683 ,  H01L21/02 ,  H01L21/56 ,  G06T7/00 ,  H01L21/67

CPC classification number: H01L22/20 ,  G01N21/00 ,  G01N21/31 ,  G05B19/418 ,  G05B2219/45031 ,  G06T7/001 ,  G06T2207/20081 ,  G06T2207/30148 ,  H01L21/02076 ,  H01L21/6835 ,  H01L21/6836 ,  H01L22/12 ,  H01L24/94 ,  H01L2221/68327 ,  H01L2224/1181 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/81203 ,  H01L2224/83193 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2924/00014 ,  H01L2224/27 ,  H01L2224/11

Abstract: A method for inspection of a semiconductor device is disclosed. In one aspect, the method includes performing a processing step in manufacturing of the semiconductor device, wherein a compound is at least in contact with the semiconductor device. The method also includes capturing an image on a two-dimensional image sensor of an area of at least part of the semiconductor device, wherein the captured image comprises spectral information for a plurality of positions in the area, and wherein the spectral information comprises intensity of incident electro-magnetic radiation for a plurality of different wavelength bands across a spectrum of wavelengths. The method also includes processing the spectral information of the captured image for each of the plurality of positions to determine whether residue of the compound is present in the position. The method also includes outputting information indicating positions for which residue of the compound is present for controlling a subsequent processing step in manufacturing of the semiconductor device.

Abstract translation: 公开了一种用于检查半导体器件的方法。 一方面，该方法包括在半导体器件的制造中执行处理步骤，其中化合物至少与半导体器件接触。 该方法还包括在半导体器件的至少一部分的区域的二维图像传感器上捕获图像，其中所捕获的图像包括用于该区域中的多个位置的光谱信息，并且其中光谱信息包括 在波长范围内的多个不同波长带的入射电磁辐射。 该方法还包括处理多个位置中的每一个的捕获图像的光谱信息，以确定化合物的残留物是否存在于该位置。 该方法还包括输出指示化合物的残留物的位置的信息，以控制半导体器件的制造中的后续处理步骤。