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公开(公告)号：US10051742B2
公开(公告)日：2018-08-14
申请号：US14964575
申请日：2015-12-10
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Heng-Chieh Chien , Chun-Kai Liu
Abstract: A power module and a manufacturing method thereof are provided, and the power module includes a carrier substrate, an interconnection layer, a first chip, a second chip, a ceramic bonding substrate, a top interconnection layer and a lead frame. The interconnection layer is disposed on the carrier substrate. The first chip and the second chip are disposed on the interconnection layer, and electrically connected to the interconnection layer. The ceramic bonding substrate is disposed on the interconnection layer, and is disposed in between the first chip and the second chip so as to separate the first chip from the second chip. The top interconnection layer is disposed on the ceramic bonding substrate, covers the first chip and the second chip, and is electrically connected to the first chip and the second chip. The lead frame is disposed on the top interconnection layer and electrically connected to the top interconnection layer.
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公开(公告)号：US20170345735A1
公开(公告)日：2017-11-30
申请号：US15606355
申请日：2017-05-26
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Chun-Kai Liu , Ming Kaan Liang , Jiin Shing Perng
IPC: H01L23/373 , H01L25/065 , H01L23/31 , H01L23/467 , H01L23/367
Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.
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公开(公告)号：US20170171978A1
公开(公告)日：2017-06-15
申请号：US14964575
申请日：2015-12-10
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Heng-Chieh Chien , Chun-Kai Liu
CPC classification number: H05K1/185 , H01L29/02 , H05K1/186 , H05K3/4605 , H05K2201/10 , H05K2201/10166
Abstract: A power module and a manufacturing method thereof are provided, and the power module includes a carrier substrate, an interconnection layer, a first chip, a second chip, a ceramic bonding substrate, a top interconnection layer and a lead frame. The interconnection layer is disposed on the carrier substrate. The first chip and the second chip are disposed on the interconnection layer, and electrically connected to the interconnection layer. The ceramic bonding substrate is disposed on the interconnection layer, and is disposed in between the first chip and the second chip so as to separate the first chip from the second chip. The top interconnection layer is disposed on the ceramic bonding substrate, covers the first chip and the second chip, and is electrically connected to the first chip and the second chip. The lead frame is disposed on the top interconnection layer and electrically connected to the top interconnection layer.
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公开(公告)号：US09807914B2
公开(公告)日：2017-10-31
申请号：US14788808
申请日：2015-07-01
Applicant: Industrial Technology Research Institute
Inventor： Chun-Kai Liu , Yu-Lin Chao
IPC: H05K1/02 , H05K7/14 , H05K7/20 , H01L23/473 , H01L25/07
CPC classification number: H05K7/20927 , H01L23/473 , H01L25/07 , H05K1/028 , H05K7/1432 , H05K7/20918
Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.
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公开(公告)号：US20160157384A1
公开(公告)日：2016-06-02
申请号：US14788808
申请日：2015-07-01
Applicant: Industrial Technology Research Institute
Inventor： Chun-Kai Liu , Yu-Lin Chao
CPC classification number: H05K7/20927 , H01L23/473 , H01L25/07 , H05K1/028 , H05K7/1432 , H05K7/20918
Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.
Abstract translation: 提供了包括多个基板，多个功率器件和散热组件的功率模块。 基板位于不同的平面上并且围绕轴线。 每个基板沿轴线延伸。 彼此电连接的功率器件分别设置在基板上。 散热组件设置在基板上并与功率器件相对。 从功率器件产生的热量通过衬底转移到散热组件。
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Patent Agency Ranking
公开(公告)号：US20240243097A1
公开(公告)日：2024-07-18
申请号：US18415677
申请日：2024-01-18
Applicant: Industrial Technology Research Institute
Inventor： Yu-Ming Peng , I-Hung Chiang , Chun-Kai Liu , Po-Kai Chiu , Hsin-Han Lin , Kuo-Shu Kao
IPC: H01L25/065 , H01L23/00 , H01L23/31 , H01L23/498
CPC classification number: H01L25/0655 , H01L23/3121 , H01L23/49838 , H01L24/16 , H01L24/32 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48155 , H01L2224/73253 , H01L2224/73265 , H01L2924/181
Abstract: A power module package structure includes a first substrate and a power component. The first substrate includes at least one conductive layer on a surface thereof. The power component includes a first chip and a first spacer. The first chip has at least one electrode. The first spacer in a heat dissipation space between the first substrate and the first chip includes an insulating heat dissipation layer in the heat dissipation space and multiple vertical conductive connectors, each of the vertical conductive connectors penetrates the insulating heat dissipation layer. The insulating heat dissipation layer surrounds the vertical conductive connectors and electrically isolates the vertical conductive connectors. The vertical conductive connector includes two opposite ends, one end electrically connected to the conductive layer, and the other end electrically connected to the electrode to form a conductive path and a heat dissipation path between the first chip and the first substrate.
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公开(公告)号：US20200286808A1
公开(公告)日：2020-09-10
申请号：US16883470
申请日：2020-05-26
Applicant: Industrial Technology Research Institute
Inventor： Shu-Jung Yang , Yu-Lin Chao , Chun-Kai Liu , Ming Kaan Liang , Jiin Shing Perng
IPC: H01L23/373 , H01L25/065 , H01L23/427 , H01L25/11 , H01L23/36 , H01L25/07
Abstract: A plug-in type power module includes a power unit and a heat-transfer unit vertically disposed on the power unit and extending outwardly away from two sides of the power unit. A first ceramic layer is disposed between the power unit and the heat-transfer unit. Therefore, heat generated by the power unit can be transferred from the first ceramic layer to the heat-transfer unit to increase the speed of heat dissipation. A subsystem having the plug-in type power module is also provided.
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公开(公告)号：US10288696B2
公开(公告)日：2019-05-14
申请号：US15352989
申请日：2016-11-16
Applicant: Industrial Technology Research Institute
Inventor： Chih-Chung Chiu , Chih-Ming Tzeng , Li-Ling Liao , Yu-Lin Chao , Chih-Ming Shen , Ming-Kaan Liang , Chun-Kai Liu , Ming-Ji Dai
Abstract: An intelligent diagnosis system for a power module. The system includes a power module, a hardware checking module and a diagnostic module. The power module has a temperature sensing element for obtaining a temperature difference between a starting minimum temperature and a current temperature. The hardware checking module has a current sensing element, a voltage sensing element and a magnetic coupling closed loop detection element for obtaining the current, the output voltage and the input voltage of the power module, and the hardware loop status, respectively. The diagnostic module calculates the number of cycles that have been operated, a measured impedance and an instantaneous power based on those measurement results, and calculating a risk index based on the number of cycles that have been operated, the temperature difference, the measured impedance, the instantaneous power and the hardware loop status, thereby determining the accumulation of the abnormality index record.
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公开(公告)号：US20180007815A1
公开(公告)日：2018-01-04
申请号：US15705271
申请日：2017-09-15
Applicant: Industrial Technology Research Institute
Inventor： Chun-Kai Liu , Yu-Lin Chao
IPC: H05K7/20 , H05K1/02 , H01L25/07 , H05K7/14 , H01L23/473
CPC classification number: H05K7/20927 , H01L23/473 , H01L25/07 , H01L25/072 , H01L25/18 , H05K1/028 , H05K7/1432 , H05K7/20918
Abstract: A power module including a plurality of substrates, a plurality of power devices, and a heat dissipation assembly is provided. The substrates are located on different planes and surround an axis. Each of the substrates extends along the axis. The power devices electrically connected with each other are disposed on the substrates respectively. The heat dissipation assembly is disposed on the substrates and opposite to the power devices. Heat generated from the power devices is transferred to the heat dissipation assembly through the substrates.
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公开(公告)号：US20160163950A1
公开(公告)日：2016-06-09
申请号：US14562784
申请日：2014-12-08
Applicant: Industrial Technology Research Institute
Inventor： Li-Ling Liao , Ming-Ji Dai , Chun-Kai Liu , Cheng-Heng Kao , Cheng-Chieh Li , Jeffrey Snyder , Fivos Drymiotis
Abstract: A structure of a thermoelectric module including at least one substrate, a thermoelectric device and an insulation protection structure is provided. The thermoelectric device is disposed on the substrate. The insulation protection structure surrounds the thermoelectric device. The thermoelectric device includes at least three electrode plates, first type and second type thermoelectric materials and a diffusion barrier structure. First and second electrode plates among the three electrode plates are disposed on the substrate. The first type thermoelectric material is disposed on the first electrode plate. The second type thermoelectric material is disposed on the second electrode plate. A third electrode plate among the three electrode plates is disposed on the first type and second type thermoelectric materials. The diffusion barrier structure is disposed on two terminals of each of the first type and second type thermoelectric materials. A fabrication method of the foregoing thermoelectric module is also provided.
Abstract translation: 提供了包括至少一个基板，热电元件和绝缘保护结构的热电模块的结构。 热电装置设置在基板上。 绝缘保护结构围绕热电装置。 热电装置包括至少三个电极板，第一类型和第二类型热电材料和扩散阻挡结构。 三个电极板中的第一和第二电极板设置在基板上。 第一类型热电材料设置在第一电极板上。 第二种热电材料设置在第二电极板上。 三个电极板中的第三电极板设置在第一类型和第二类型热电材料上。 扩散阻挡结构设置在第一类型和第二类型热电材料中的每一个的两个端子上。 还提供了上述热电模块的制造方法。
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