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公开(公告)号：US20140103460A1
公开(公告)日：2014-04-17
申请号：US13651372
申请日：2012-10-12
Applicant: INFINEON TECHNOLOGIES AG
Inventor： Alfons Dehe , Stephan Pindl , Bernhard Knott , Carsten Ahrens
CPC classification number: B81C1/00825 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81C1/00873 , B81C2201/017 , B81C2201/053 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.
Abstract translation: 公开了一种制造MEMS器件的方法。 此外，公开了一种MEMS器件和包括MEMS器件的模块。 一个实施例包括用于制造MEMS器件的方法，包括在衬底的第一主表面上形成MEMS堆叠，在衬底的第二主表面上形成聚合物层，并在聚合物层和衬底中形成第一开口，使得 第一个开口与MEMS堆栈相邻。
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公开(公告)号：US11926521B2
公开(公告)日：2024-03-12
申请号：US17150527
申请日：2021-01-15
Applicant: Infineon Technologies AG
Inventor： Stephan Pindl , Carsten Ahrens , Stefan Jost , Ulrich Krumbein , Matthias Reinwald
CPC classification number: B81B7/0067 , B81C1/00317 , G01N29/2418 , G01N33/0027 , B81B2201/0214 , B81B2203/0127 , B81B2207/095
Abstract: An infrared emitter with a glass lid for emitting infrared radiation comprises a package enclosing a cavity, wherein a first part is transparent for infrared radiation and a second part comprises a glass material and a heating structure configured for emitting the infrared radiation, wherein the heating structure is arranged in the cavity between the first part and the second part of the package.
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公开(公告)号：US11608265B2
公开(公告)日：2023-03-21
申请号：US17357234
申请日：2021-06-24
Applicant: Infineon Technologies AG
Inventor： Stephan Pindl , Carsten Ahrens , Stefan Jost , Ulrich Krumbein
Abstract: A method for providing a semiconductor layer arrangement on a substrate which comprises providing a semiconductor layer arrangement having a functional layer and a semiconductor substrate layer, attaching the semiconductor layer arrangement to a glass substrate layer such that the functional layer is arranged between the glass substrate layer and the semiconductor substrate layer, and removing the semiconductor substrate layer at least partially such that the glass substrate layer substitutes the semiconductor substrate layer as the substrate of the semiconductor layer arrangement.
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公开(公告)号：US20200249380A1
公开(公告)日：2020-08-06
申请号：US16779928
申请日：2020-02-03
Applicant: Infineon Technologies AG
Inventor： Stephan Pindl , Matthias Steiert
Abstract: A method for manufacturing integrated IR (IR=infrared) emitter elements having an optical filter comprises back side etching through a carrier substrate, forming adhesive spacer elements on a conductive layer on the carrier substrate, placing a filter substrate having a filter carrier substrate and a filter layer on the adhesive spacer elements, fixing the adhesive spacer elements to the carrier substrate and the filter substrate by curing, pre-dicing through the filter substrate for exposing the contact pads of the structured conductive layer, and dicing through the frame structure in the carrier substrate for separating the integrated IR emitter elements having the optical filter.
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公开(公告)号：US20200051824A1
公开(公告)日：2020-02-13
申请号：US16654165
申请日：2019-10-16
Applicant: Infineon Technologies AG
Inventor： Stephan Pindl , Daniel Lugauer , Dominic Maier , Alfons Dehe
IPC: H01L21/306 , H01L23/31 , H01L21/762 , H01L21/02 , H01L21/302 , H01L21/20 , H01L21/18 , H01L33/00 , H01L23/057 , H01L23/053 , G01N27/12 , H01L23/29 , H01L23/00 , G01N27/02 , G01N33/00 , H01L21/56 , H01L23/538 , H05K1/18
Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
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Patent Agency Ranking
公开(公告)号：US20190322523A1
公开(公告)日：2019-10-24
申请号：US16460231
申请日：2019-07-02
Applicant: Infineon Technologies AG
Inventor： Stephan Pindl
Abstract: The present disclosure relates to an apparatus having a substrate arrangement with a first circuit arrangement that heats up during operation and a second circuit arrangement that is integrated into a substrate material of the substrate arrangement. Further, the apparatus has a cavity structure that is arranged between the first and the second circuit arrangement, said cavity structure being formed in the substrate material and having a pressure that is lower than an ambient atmospheric pressure.
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公开(公告)号：US10186468B2
公开(公告)日：2019-01-22
申请号：US15086573
申请日：2016-03-31
Applicant: Infineon Technologies AG
Inventor： Stephan Pindl , Daniel Lugauer , Dominic Maier , Alfons Dehe
IPC: H01L23/31 , H01L21/20 , H01L21/18 , H01L33/00 , H01L21/762 , H01L23/057 , H01L23/053 , G01N27/02 , G01N33/00 , H01L21/56 , H01L23/538 , H05K1/18 , G01N27/12 , H01L23/00 , H01L23/29
Abstract: According to an embodiment, a sensor package includes an electrically insulating substrate including a cavity in the electrically insulating substrate, an ambient sensor, an integrated circuit die embedded in the electrically insulating substrate, and a plurality of conductive interconnect structures coupling the ambient sensor to the integrated circuit die. The ambient sensor is supported by the electrically insulating substrate and arranged adjacent the cavity.
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公开(公告)号：US20180201504A1
公开(公告)日：2018-07-19
申请号：US15923599
申请日：2018-03-16
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Stephan Pindl , Bernhard Knott , Carsten Ahrens
CPC classification number: B81C1/00825 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81C1/00873 , B81C2201/017 , B81C2201/053 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack over a first main surface of a substrate, forming a polymer layer over a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.
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公开(公告)号：US09938140B2
公开(公告)日：2018-04-10
申请号：US15206836
申请日：2016-07-11
Applicant: Infineon Technologies AG
Inventor： Alfons Dehe , Stephan Pindl , Bernhard Knott , Carsten Ahrens
CPC classification number: B81C1/00825 , B81B2201/0235 , B81B2201/0257 , B81B2201/0264 , B81C1/00873 , B81C2201/017 , B81C2201/053 , H04R19/005 , H04R19/04 , H04R31/00 , H04R2201/003
Abstract: A method for manufacturing a MEMS device is disclosed. Moreover a MEMS device and a module including a MEMS device are disclosed. An embodiment includes a method for manufacturing MEMS devices includes forming a MEMS stack on a first main surface of a substrate, forming a polymer layer on a second main surface of the substrate and forming a first opening in the polymer layer and the substrate such that the first opening abuts the MEMS stack.
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20.发明授权公开(公告)号：US11908763B2
公开(公告)日：2024-02-20
申请号：US17483312
申请日：2021-09-23
Applicant: Infineon Technologies AG
Inventor： Prashanth Makaram , John Cooper , Joerg Ortner , Stephan Pindl , Caterina Travan , Alexander Zoepfl
CPC classification number: H01L23/3171 , H01L21/02282 , H01L23/3178
Abstract: An apparatus includes a semiconductor-based substrate with a functional structure that is formed in or on the semiconductor-based substrate. The apparatus includes a frame structure surrounding the functional structure and includes a coating that covers the functional structure and is delimited by the frame structure.
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