ELECTRONIC DEVICE AND METHOD FOR MANUFACTURING ELECTRONIC DEVICE

    公开(公告)号:US20240387387A1

    公开(公告)日:2024-11-21

    申请号:US18633534

    申请日:2024-04-12

    Abstract: An electronic device and a manufacturing thereof are disclosed. The electronic device includes a first conductive layer, a first insulating layer, a second insulating layer, a second conductive layer, a plurality of semiconductor elements and a covering layer. The first insulating layer is disposed on the first conductive layer. In a cross-sectional view of the electronic device, the first insulating layer has two side-surfaces which are opposite to each other. The second insulating layer is disposed on the first insulating layer and in contact with the two side-surfaces of the first insulating layer. The second conductive layer is disposed on the second insulating layer and electrically connected to the first conductive layer. The plurality of semiconductor elements are disposed on the second conductive layer and electrically connected to the second conductive layer. The covering layer is disposed on the plurality of semiconductor elements.

    OPERATING METHOD FOR VEHICLE
    13.
    发明公开

    公开(公告)号:US20240270185A1

    公开(公告)日:2024-08-15

    申请号:US18409325

    申请日:2024-01-10

    CPC classification number: B60R16/0231 B60K35/28 B60K35/60 B60K2360/166

    Abstract: An operating method for a vehicle is provided to operate the vehicle via at least one command output source. The operating method includes steps of: providing a request signal to the vehicle for transmitting a data signal to at least one component of the vehicle; providing an approval signal to the vehicle; transmitting the data signal from the at least one command output source to the at least one component of the vehicle according to the approval signal; and operating the at least one component of the vehicle according to the data signal.

    ELECTRONIC DEVICE AND SPEAKER DEVICE
    14.
    发明公开

    公开(公告)号:US20240251206A1

    公开(公告)日:2024-07-25

    申请号:US18404466

    申请日:2024-01-04

    CPC classification number: H04R9/046 H04R9/025 H04R9/06

    Abstract: An electronic device includes a substrate; and a coil structure disposed on the substrate. The coil structure is provided with a first conductor layer including a connection line; a second conductor layer including a plurality of line segments separated from each other; and a first insulation layer disposed between the first conductor layer and the second conductor layer, and provided with a plurality of first openings, wherein adjacent two of the plurality of line segments are electrically connected to the connection line through the plurality of first openings.

    ELECTRONIC DEVICE
    16.
    发明公开
    ELECTRONIC DEVICE 审中-公开

    公开(公告)号:US20240145255A1

    公开(公告)日:2024-05-02

    申请号:US18368029

    申请日:2023-09-14

    Abstract: An electronic includes an electronic element, an encapsulation layer surrounding the electronic element, a first circuit structure, a second circuit structure and a connecting structure. The encapsulation layer has a top surface, a bottom surface and an opening, wherein a sidewall of the opening connects the top surface and the bottom surface. The first circuit structure is disposed at the top surface of the encapsulation layer. The second circuit structure is disposed at the bottom surface of the encapsulation layer. The connecting structure is disposed in the opening, wherein the electronic element is electrically connected to the second circuit structure through the first circuit structure and the connecting structure. The connecting structure includes a first sub layer and a second sub layer, the first sub layer is located between the encapsulation layer and the second sub layer, and the first sub layer covers the sidewall of the opening.

    FLEXIBLE ELECTRONIC DEVICE
    18.
    发明公开

    公开(公告)号:US20230418334A1

    公开(公告)日:2023-12-28

    申请号:US18197103

    申请日:2023-05-15

    Abstract: A flexible electronic device is disclosed by this disclosure. The flexible electronic device includes a supporting layer, a flexible layer, a medium layer, and electronic elements. The flexible layer is disposed on the supporting layer, and the flexible layer includes at least two main portions and a deformable portion connecting the two main portions. The medium layer is disposed between the supporting layer and the flexible layer, and the medium layer includes a first portion located under the deformable portion and a second portion located under one of the two main portions. The electronic elements are disposed on the two main portions, and a thickness of the first portion is less than a thickness of the second portion.

    Electronic Device and Fabrication Method Thereof

    公开(公告)号:US20230411372A1

    公开(公告)日:2023-12-21

    申请号:US18136352

    申请日:2023-04-19

    CPC classification number: H01L25/167 H01L27/1225

    Abstract: An electronic device includes a substrate, a transistor disposed on the substrate, an electrode disposed on the substrate and coupled to the transistor, and a plurality of electronic units disposed on the substrate and coupled to the electrode. The transistor is used to align the plurality of electronic units when the plurality of electronic units are in an alignment mode, and the transistor is turned off when the plurality of electronic units are in an operating mode.

    Electronic device
    20.
    发明公开
    Electronic device 审中-公开

    公开(公告)号:US20230341957A1

    公开(公告)日:2023-10-26

    申请号:US18342714

    申请日:2023-06-27

    CPC classification number: G06F3/041 G06V10/147 G02F1/133514

    Abstract: An electronic device is disclosed, which includes: a substrate including a biometric sensing region and a non-sensing region; a biometric sensing module disposed corresponding to the biometric sensing region; a display layer disposed on the substrate; a light altering member at least partially disposed in the biometric sensing region; a touch sensing layer disposed on the display layer; and a supporting element disposed between the substrate and the biometric sensing module, wherein the light altering member includes a first insulating layer and a micro-structure layer disposed on the first insulating layer.

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