公开(公告)号：US11737227B2

公开(公告)日：2023-08-22

申请号：US17677785

申请日：2022-02-22

Applicant: Intel Corporation

Inventor： Zhichao Zhang ,  Gregorio R. Murtagian ,  Kuang C. Liu ,  Kemal Aygun

IPC: H05K7/10 ,  H05K1/11 ,  H05K1/02 ,  H01R13/24

CPC classification number: H05K7/1061 ,  H01R13/24 ,  H05K1/0253 ,  H05K1/112 ,  H05K2201/093 ,  H05K2201/09609 ,  H05K2201/10719

Abstract: Embodiments include a transmission line-land grid array (TL-LGA) socket assembly, a TL-LGA socket, and a package substrate. The TL-LGA socket assembly includes a TL-LGA socket having an interconnect in a housing body, the interconnect includes a vertical portion and a horizontal portion. The housing body has a top surface and a bottom surface, where the top surface is a conductive layer. The TL-LGA socket assembly also includes a package substrate having a base layer having a signal pad and a ground strip. The base layer is above the conductive layer of the housing body of the TL-LGA socket. The ground strip is above the horizontal portion of the interconnect and adjacent to the signal pad. The horizontal portion is coupled to the signal pad on the base layer. The package substrate may have a pad with a reduced pad area.

公开(公告)号：US10680367B2

公开(公告)日：2020-06-09

申请号：US15084682

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Anthony P. Valpiani ,  Jonathon Robert Carstens

IPC: H01R12/75 ,  H01R12/77 ,  H01R13/62 ,  H01R13/639 ,  H01R12/70

Abstract: Embodiments of the disclosure are directed to a linear edge connector assembly for connecting to a substrate diving board of a mother board. The linear edge connector assembly can include an electrical interface to electrically connect the contacts on the diving board to one or more conducts of a cable bundle. The linear edge connector assembly can also include a retaining force mechanism. The retaining force mechanism can include a torsional spring, a spring loaded hooking mechanism, or a spring loaded cam and lever. In some embodiments, the linear edge connector can include a notch to receive a latch connected to a bolster plate on the mother board.

公开(公告)号：US20190182955A1

公开(公告)日：2019-06-13

申请号：US15841246

申请日：2017-12-13

Applicant: Intel Corporation

Inventor： Gregorio R. Murtagian ,  Kuang C. Liu ,  Sriram Srinivasan ,  Jeffory L. Smalley ,  Zhichao Zhang

IPC: H05K1/14 ,  H01R12/73 ,  H05K1/11 ,  H05K1/18 ,  H05K1/02 ,  H05K3/36 ,  H05K3/34

Abstract: Electronic device package technology is disclosed. An electronic device package in accordance with the present disclosure can include a package substrate. The electronic device package can also include a processor mounted on the package substrate. Additionally, the electronic device package can include a memory socket mounted on the package substrate and operably coupled to the processor. The memory socket can be operable to removably couple with a memory module and facilitate electrical communication between the processor and the memory module. A memory module can include a plurality of printed circuit boards (PCBs). Each PCB can have a bottom edge and a plurality of contact pads located about the bottom edge. Additionally, the memory module can include a memory device mounted on at least one of the plurality of PCBs and electrically connected to at least one of the pluralities of contact pads to facilitate electrically coupling the memory module with an external electronic component, such as a processor. Associated systems and methods are also disclosed.

公开(公告)号：US20170288331A1

公开(公告)日：2017-10-05

申请号：US15084726

申请日：2016-03-30

Applicant: Intel Corporation

Inventor： Feifei Cheng ,  Kuang C. Liu ,  Michael Garcia ,  Eric W. Buddrius ,  Kevin J. Ceurter ,  Jonathon Robert Carstens

IPC: H01R12/75 ,  H01R12/70

CPC classification number: H01R12/75 ,  H01R12/7023 ,  H01R12/774 ,  H01R13/639

Abstract: Embodiments of the present disclosure are directed to a linear edge connector assembly and corresponding bolster plate features for receiving and securing a linear edge connector assembly. Embodiments of the disclosure are directed to a linear edge connector assembly that includes a grooved and indented receiver that can receive a spring loaded ball on the bolster plate. In embodiments, the linear edge connector assembly can include a magnetic element to create a magnetic attraction to magnetic elements on the bolster plate, such as a press-fit ball or a U-shaped hardstop. In some embodiments, the linear edge connector assembly includes a screw or push pin that can be received by a receiver on the bolster plate. The receiver can include a thread or friction fit receiver.