CONTACTLESS SCREENING OF A QUBIT
    11.
    发明公开

    公开(公告)号:US20230333138A1

    公开(公告)日:2023-10-19

    申请号:US18339705

    申请日:2023-06-22

    CPC classification number: G01Q60/00 G06N10/00

    Abstract: Systems, devices, computer-implemented methods, and computer program products to facilitate contactless screening of a qubit are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a scanner component that establishes a direct microwave coupling of a scanning probe device to a qubit of a quantum device. The computer executable components can further comprise a parameter extraction component that determines qubit frequency of the qubit based on the direct microwave coupling.

    Contactless screening of a qubit
    12.
    发明授权

    公开(公告)号:US11726109B2

    公开(公告)日:2023-08-15

    申请号:US17137009

    申请日:2020-12-29

    CPC classification number: G01Q60/00 G06N10/00

    Abstract: Systems, devices, computer-implemented methods, and computer program products to facilitate contactless screening of a qubit are provided. According to an embodiment, a system can comprise a memory that stores computer executable components and a processor that executes the computer executable components stored in the memory. The computer executable components can comprise a scanner component that establishes a direct microwave coupling of a scanning probe device to a qubit of a quantum device. The computer executable components can further comprise a parameter extraction component that determines qubit frequency of the qubit based on the direct microwave coupling.

    Flip chip assembly of quantum computing devices

    公开(公告)号:US11195773B2

    公开(公告)日:2021-12-07

    申请号:US16839248

    申请日:2020-04-03

    Abstract: In an embodiment, a quantum device includes an interposer layer comprising a set of vias. In an embodiment, the quantum device includes a dielectric layer formed on a first side of the interposer, the dielectric layer including a set of transmission lines communicatively coupled to the set of vias. In an embodiment, the quantum device includes a plurality of qubit chips coupled to an opposite side of the interposer layer, each qubit chip of the plurality of qubit chips including: a plurality of qubits on a first side of the qubit chip and a plurality of protrusions on a second side of the qubit chip. In an embodiment, the quantum device includes a heat sink thermally coupled with the plurality of qubit chips, the heat sink comprising a plurality of recesses aligned with the plurality of protrusions of the plurality of qubit chips.

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