公开(公告)号：US08354349B2

公开(公告)日：2013-01-15

申请号：US12727406

申请日：2010-03-19

申请人： Junji Shiota

发明人： Junji Shiota

IPC分类号： H01L21/31 ,  H01L21/469

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/6715 ,  H01L21/67207 ,  H01L21/67745 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14

摘要： A semiconductor device includes a plurality of wiring lines which are provided on an upper side of a semiconductor substrate and which have connection pad portions, and columnar electrodes are provided on the connection pad portions of the wiring lines. A first sealing film is provided around the columnar electrodes on the upper side of the semiconductor substrate and on the wiring lines. A second sealing film is provided on the first sealing film. The first sealing film is made of a resin in which fillers are not mixed, and the second sealing film is made of a material in which fillers are mixed in a resin.

摘要翻译： 半导体器件包括设置在半导体衬底的上侧并且具有连接焊盘部分的多条布线，并且柱状电极设置在布线的连接焊盘部分上。 在半导体衬底的上侧和布线的柱状电极周围设置第一密封膜。 在第一密封膜上设置第二密封膜。 第一密封膜由不混合填料的树脂制成，第二密封膜由树脂中填充剂混合的材料制成。

公开(公告)号：US08154133B2

公开(公告)日：2012-04-10

申请号：US12412576

申请日：2009-03-27

申请人： Taisuke Koroku ,  Takeshi Wakabayashi ,  Osamu Okada ,  Osamu Kuwabara ,  Junji Shiota ,  Nobumitsu Fujii

发明人： Taisuke Koroku ,  Takeshi Wakabayashi ,  Osamu Okada ,  Osamu Kuwabara ,  Junji Shiota ,  Nobumitsu Fujii

IPC分类号： H01L23/48 ,  H01L23/52 ,  H01L29/40

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3135 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L2221/6834 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/03 ,  H01L2224/0401 ,  H01L2224/11 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/94 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3512 ,  H01L2924/00

摘要： A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks.

摘要翻译： 在半导体基板的上表面的除了该表面的周边部分之外的区域中设置由低介电常数膜和布线组成的低介电常数膜/布线层叠结构。 低介电常数薄膜/布线层叠结构的周边侧表面被密封膜覆盖。 这提供了低介电常数膜不容易脱落的结构。 在这种情况下，在硅基板的下表面上设置下保护膜，以保护该下表面免受裂纹。

公开(公告)号：US06368515B1

公开(公告)日：2002-04-09

申请号：US09494117

申请日：2000-01-27

申请人： Katsuzo Kaminishi ,  Junji Shiota ,  Ichiro Kohno ,  Kazuyoshi Arai

发明人： Katsuzo Kaminishi ,  Junji Shiota ,  Ichiro Kohno ,  Kazuyoshi Arai

IPC分类号： B41J216

CPC分类号： B41J2/1603 ,  B41J2/1607 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1629 ,  B41J2/1631 ,  B41J2/1632 ,  B41J2/1635 ,  B41J2/1643

摘要： In a method of manufacturing an ink-jet printer which uses a thin film sheet having adhesive layers respectively formed on the top and bottom sides, as an orifice plate, orifices are formed in the ink-ejecting side of the thin film sheet after the adhesive layer on that ink-ejecting side has been removed. This prevents the formation of the orifices from being adversely affected by any otherwise residual of the adhesive layer and can thus permit accurate formation of orifices of a desired shape. Even if helicon-wave dry etching which ensure fast etching using high-power energy is used to form orifices, therefore, no adhesive layer is thermally expanded to be a residual so that multiple orifices can be formed simultaneously and quickly.

摘要翻译： 在制造喷墨打印机的方法中，其使用具有分别形成在顶侧和底侧上的粘合层的薄膜片作为孔板，在粘合剂之后在薄膜片的喷墨侧形成孔 墨水喷射面上的层被去除。 这防止孔的形成受到粘合剂层的任何其它残余物的不利影响，并且因此允许精确形成所需形状的孔。 即使使用确保使用高功率能量的快速蚀刻的螺旋波干法蚀刻来形成孔，因此，没有粘合剂层热膨胀成残留物，从而可以同时且快速地形成多个孔。

公开(公告)号：US5259681A

公开(公告)日：1993-11-09

申请号：US911116

申请日：1992-07-09

申请人： Yasunori Kitazawa ,  Hironori Harada ,  Junji Shiota

发明人： Yasunori Kitazawa ,  Hironori Harada ,  Junji Shiota

IPC分类号： B26D7/27 ,  B29C63/00 ,  B65C9/08 ,  B65H41/00 ,  B41J11/26

CPC分类号： B29C63/0013 ,  B26D7/27 ,  B65H41/00 ,  Y10S83/949 ,  Y10T156/1961 ,  Y10T225/259

摘要： An end separating device for a sheet having a backing paper, which can easily separate a film of the sheet from the backing paper without requiring half cutting of the sheet. A fixing and separating member is fixed to a movable blade of a cutter for cutting a tape, and another fixing and separating member is fixed to a fixed blade of the cutter. These fixing and separating members and cooperate to bend and fix a cut end portion of the tape. Accordingly, the cut end portion of the tape is bent. After the tape is released from the fixing and separating members, a film tape is elastically returned to an original condition owing to its relatively large stiffness, but a backing paper is plastically deformed at the bent portion. As a result, the film tape can be separated from the backing paper. In other embodiments of an end separating device, a separating member is passed along end surfaces of free end portions of the sheet. The separating member bends the end surfaces to plastically deform the backing paper and enable separation of the backing paper.

公开(公告)号：US4533267A

公开(公告)日：1985-08-06

申请号：US510614

申请日：1983-07-05

申请人： Hisao Kurachi ,  Takeo Ito ,  Takayuki Iwase ,  Junji Shiota

发明人： Hisao Kurachi ,  Takeo Ito ,  Takayuki Iwase ,  Junji Shiota

IPC分类号： B41J33/14 ,  B41J35/10 ,  B41J35/20 ,  B41J35/22

CPC分类号： B41J35/22

摘要： A ribbon driving mechanism for a typewriter, having a cam member provided on one side thereof with a first cam section for effecting control of a printing ribbon, and a second cam section extending continuously from the first cam section for effecting control of a correction tape, and a stopping member for controlling the movement of a cam follower along the cam sections. Either the printing ribbon or the correction tape is moved selectively to the printing position and only the rotation of a motor for driving the cam member in one particular direction, is transmitted to a printing ribbon winding mechanism, to wind the printing ribbon.

摘要翻译： 一种用于打字机的色带驱动机构，具有在其一侧上设置有用于实现印刷色带的控制的第一凸轮部分的凸轮部件和从第一凸轮部分连续延伸以实现校正带的控制的第二凸轮部分， 以及用于控制凸轮从动件沿着凸轮部的运动的止动构件。 打印带或校正带都被选择性地移动到打印位置，并且只有在一个特定方向上驱动凸轮构件的马达的旋转被传送到打印色带卷绕机构，以卷绕打印色带。

公开(公告)号：US20100173455A1

公开(公告)日：2010-07-08

申请号：US12727406

申请日：2010-03-19

申请人： Junji Shiota

发明人： Junji Shiota

IPC分类号： H01L21/78 ,  H01L21/60

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/6715 ,  H01L21/67207 ,  H01L21/67745 ,  H01L24/02 ,  H01L24/11 ,  H01L24/12 ,  H01L2224/0231 ,  H01L2224/0401 ,  H01L2224/13099 ,  H01L2224/16 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/014 ,  H01L2924/14

摘要： A semiconductor device includes a plurality of wiring lines which are provided on an upper side of a semiconductor substrate and which have connection pad portions, and columnar electrodes are provided on the connection pad portions of the wiring lines. A first sealing film is provided around the columnar electrodes on the upper side of the semiconductor substrate and on the wiring lines. A second sealing film is provided on the first sealing film. The first sealing film is made of a resin in which fillers are not mixed, and the second sealing film is made of a material in which fillers are mixed in a resin.

摘要翻译： 半导体器件包括设置在半导体衬底的上侧并且具有连接焊盘部分的多条布线，并且柱状电极设置在布线的连接焊盘部分上。 在半导体衬底的上侧和布线的柱状电极周围设置第一密封膜。 在第一密封膜上设置第二密封膜。 第一密封膜由不混合填料的树脂制成，第二密封膜由树脂中填充剂混合的材料制成。

公开(公告)号：US20090243097A1

公开(公告)日：2009-10-01

申请号：US12412576

申请日：2009-03-27

申请人： Taisuke KOROKU ,  Takeshi Wakabayashi ,  Osamu Okada ,  Osamu Kuwabara ,  Junji Shiota ,  Nobumitsu Fujii

发明人： Taisuke KOROKU ,  Takeshi Wakabayashi ,  Osamu Okada ,  Osamu Kuwabara ,  Junji Shiota ,  Nobumitsu Fujii

IPC分类号： H01L23/488 ,  H01L21/762

CPC分类号： H01L23/3114 ,  H01L21/561 ,  H01L21/6835 ,  H01L23/3135 ,  H01L24/11 ,  H01L24/12 ,  H01L24/27 ,  H01L2221/6834 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2224/03 ,  H01L2224/0401 ,  H01L2224/11 ,  H01L2224/16 ,  H01L2224/274 ,  H01L2224/94 ,  H01L2924/01019 ,  H01L2924/01029 ,  H01L2924/10157 ,  H01L2924/10158 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30105 ,  H01L2924/3512 ,  H01L2924/00

摘要： A low dielectric constant film/wiring line stack structure made up of a stack of low dielectric constant films and wiring lines is provided in a region on the upper surface of the semiconductor substrate except for the peripheral part of this surface. The peripheral side surface of the low dielectric constant film/wiring line stack structure is covered with a sealing film. This provides a structure in which the low dielectric constant films do not easily come off. In this case, a lower protective film is provided on the lower surface of a silicon substrate to protect this lower surface against cracks.

摘要翻译： 在半导体基板的上表面的除了该表面的周边部分之外的区域中设置由低介电常数膜和布线组成的低介电常数膜/布线层叠结构。 低介电常数薄膜/布线层叠结构的周边侧表面被密封膜覆盖。 这提供了低介电常数膜不容易脱落的结构。 在这种情况下，在硅基板的下表面上设置下保护膜，以保护该下表面免受裂纹。

公开(公告)号：US06473966B1

公开(公告)日：2002-11-05

申请号：US09494116

申请日：2000-01-27

申请人： Ichiro Kohno ,  Junji Shiota ,  Hideki Kamada ,  Satoshi Kanemitsu ,  Yoshihiro Kawamura

发明人： Ichiro Kohno ,  Junji Shiota ,  Hideki Kamada ,  Satoshi Kanemitsu ,  Yoshihiro Kawamura

IPC分类号： B21D5376

CPC分类号： B41J2/1631 ,  B41J2/1603 ,  B41J2/1623 ,  B41J2/1628 ,  B41J2/1632 ,  Y10T29/49083 ,  Y10T29/49401

摘要： A printer head substrate having a silicon substrate on which heat generating elements and partitions are formed and an orifice plate which adhered to the partitions is placed on a stage of a helicon-wave dry etching system. Helicon-wave dry etching is performed while cooling the printer head substrate by allowing a coolant gas to be intervened between the substrate and the stage. This allows multiple orifices of a desired and adequate shape to be simultaneously and quickly bored in the orifice plate even if a thin film sheet having adhesive layers adhered to both sides thereof is used as the orifice plate, thereby improving the working efficiency.

摘要翻译： 具有形成有发热元件和隔板的硅基板和粘附到隔壁的孔板的打印机头基板被放置在螺旋波干蚀刻系统的台上。 在通过允许冷却剂气体介于基板和台之间来冷却打印机头基板的同时进行Helicon波干蚀刻。 即使将具有粘附到其两侧的粘合剂层的薄膜片用作孔板，从而也可以在孔板中同时且快速地将孔所需要的多个孔同时且快速地钻孔，从而提高工作效率。

公开(公告)号：US5441352A

公开(公告)日：1995-08-15

申请号：US306900

申请日：1994-09-16

申请人： Junji Shiota

发明人： Junji Shiota

IPC分类号： B41J3/36 ,  B41J11/70 ,  B65H35/00

CPC分类号： B41J11/703 ,  B65H35/0073

摘要： A tape cutting device includes a fixed blade fixed to a frame and a movable blade fixed to a manually pivotable lever. A printing operation to the print tape is performed by a print head and a platen. In this case, the tape runs by the rotation of the press roller and a tape feed roller, those being driven by a driving motor 2 through a power transmitting portion including a gear train. A gear of the gear train is associated with a tape cutting prevention mechanism including a stop lever. When the tape printing operation is carried out, the stop lever is movable to a first pivot position where the manually pivotable lever is abuttable on the stop lever to prevent the manually pivotable lever to be angularly rotated. When the tape is to be cut, the stop lever is moved to a second pivot position offset from the manually pivotable lever. Thus, the movable blade can be moved toward the fixed blade to cut the tape.

摘要翻译： 带切割装置包括固定在框架上的固定刀片和固定在手动可枢转杆上的可动刀片。 通过打印头和压板执行对打印带的打印操作。 在这种情况下，带通过压辊和送带辊的旋转而运行，这些辊由驱动电机2通过包括齿轮系的动力传递部分驱动。 齿轮系的齿轮与包括止动杆的带切割防止机构相关联。 当进行带式打印操作时，止动杆可移动到第一枢转位置，在第一枢转位置，手动可枢转的杆可抵靠在止动杆上，以防止可手动转动的杠杆成角度地旋转。 当磁带被切割时，停止杆移动到偏离手动可枢转的杆的第二枢转位置。 因此，可移动刀片可以朝着固定刀片移动以切割带子。