公开(公告)号：US11112636B2

公开(公告)日：2021-09-07

申请号：US17029069

申请日：2020-09-23

Applicant: Innolux Corporation

Inventor： Chia-Chieh Fan ,  Tong-Jung Wang

IPC: G02F1/1333 ,  G02F1/1335 ,  G02F1/1345 ,  G02F1/1362 ,  H01L27/15 ,  H01L33/62

Abstract: A display device including a liquid crystal display, light-emitting diode boards, a system board, and a flexible circuit board is provided. The plurality of light-emitting diode boards are disposed adjacent to the liquid crystal display and overlaps a peripheral region of the liquid crystal display in a normal direction of the display device. At least one of the light-emitting diode boards includes a carrier, light-emitting diodes, and connecting pads. The carrier has a first surface and a second surface opposite to the first surface and located between the first surface and the liquid crystal display. The light-emitting diodes are disposed on the first surface. The connecting pads are disposed on the second surface and are electrically connected to the light-emitting diodes. The system board is located below and electrically connected to the liquid crystal display. The system board is electrically connected to the connecting pads through the flexible circuit board.

公开(公告)号：US20190214288A1

公开(公告)日：2019-07-11

申请号：US16211194

申请日：2018-12-05

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Chin-Lung Ting ,  Cheng-Chi Wang ,  Ming-Tsang Wu

IPC: H01L21/683 ,  H01L23/00 ,  H01L21/56 ,  H01L21/48 ,  H01L25/00 ,  H01L25/10

CPC classification number: H01L21/6835 ,  H01L21/4853 ,  H01L21/565 ,  H01L21/568 ,  H01L23/3128 ,  H01L24/97 ,  H01L25/105 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0231 ,  H01L2224/0233 ,  H01L2224/95001 ,  H01L2225/1023 ,  H01L2225/1058 ,  H01L2924/3511

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, disposing first chips on the sacrificial layer, forming a first dielectric layer surrounding the first chips, forming trenches in the first dielectric layer, and forming a second dielectric layer in the trenches, wherein an upper surface of the first dielectric layer and an upper surface of the second dielectric layer are at a same plane.

公开(公告)号：US10095060B2

公开(公告)日：2018-10-09

申请号：US15495577

申请日：2017-04-24

Applicant: InnoLux Corporation

Inventor： Chun-Sheng Yen ,  Chia-Chieh Fan ,  Ming-Tsang Wu ,  Pai-Chi Tsai

IPC: G06F1/16 ,  G02F1/1333 ,  G02F1/1335

Abstract: A display device includes a first substrate, a second substrate, a first polarizer, a second polarizer and a frame. The frame contacts with a first surface and a first side of the first substrate, a second surface and a second side of the second substrate, and a third side of the first polarizer. The frame has a fourth surface and a fourth side connecting to the fourth surface, and the fourth side is disposed corresponding to the second side. In a first direction perpendicular to the first surface, a shortest distance between the fourth and first surfaces is a first distance, a shortest distance between the fourth and first surfaces is a second distance, and a shortest distance between the third and first surfaces is a third distance. The third distance is substantially equal to the first distance, and the first distance and the second distance are different.

公开(公告)号：US20220328460A1

公开(公告)日：2022-10-13

申请号：US17694644

申请日：2022-03-14

Applicant: Innolux Corporation

Inventor： Chia-Chieh Fan ,  Ming-Tsang Wu

IPC: H01L25/075 ,  H01L33/56 ,  H01L33/62

Abstract: An electronic device is provided. The electronic device includes a supporting board, multiple circuit boards, a gap, and a molding material. The circuit boards are disposed on the supporting board. Each circuit board includes a substrate and multiple semiconductor elements. The semiconductor elements are disposed on the substrate. The gap is disposed between two adjacent circuit boards. The molding material is disposed on the supporting board and covers the circuit boards and the gap. The electronic device of the embodiment of the disclosure can improve uniformity of product appearance or uniformity of a display image.

公开(公告)号：US20210375643A1

公开(公告)日：2021-12-02

申请号：US17402595

申请日：2021-08-15

Applicant: InnoLux Corporation

Inventor： Chia-Chieh Fan ,  Chin-Lung Ting ,  Cheng-Chi Wang ,  Ming-Tsang Wu

IPC: H01L21/56 ,  H01L21/683 ,  H01L21/48 ,  H01L25/00 ,  H01L23/00

Abstract: A manufacturing method of semiconductor device includes providing a substrate, forming a sacrificial layer on the substrate, forming a resin layer on the sacrificial layer, disposing first chips on the sacrificial layer, and forming a first dielectric layer having trenches and surrounding the first chips, wherein an upper surface of the first dielectric layer and an upper surface of the resin layer are at a same plane.

公开(公告)号：US20210109389A1

公开(公告)日：2021-04-15

申请号：US17029069

申请日：2020-09-23

Applicant: Innolux Corporation

Inventor： Chia-Chieh Fan ,  Tong-Jung Wang

IPC: G02F1/1333 ,  G02F1/1335 ,  G02F1/1345 ,  G02F1/1362 ,  H01L27/15 ,  H01L33/62

Abstract: A display device including a liquid crystal display, light-emitting diode boards, a system board, and a flexible circuit board is provided. The plurality of light-emitting diode boards are disposed adjacent to the liquid crystal display and overlaps a peripheral region of the liquid crystal display in a normal direction of the display device. At least one of the light-emitting diode boards includes a carrier, light-emitting diodes, and connecting pads. The carrier has a first surface and a second surface opposite to the first surface and located between the first surface and the liquid crystal display. The light-emitting diodes are disposed on the first surface. The connecting pads are disposed on the second surface and are electrically connected to the light-emitting diodes. The system board is located below and electrically connected to the liquid crystal display. The system board is electrically connected to the connecting pads through the flexible circuit board.

公开(公告)号：US20200051902A1

公开(公告)日：2020-02-13

申请号：US16655201

申请日：2019-10-16

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Cheng-Chi Wang ,  Kuan-Jen Wang

IPC: H01L23/498 ,  H01L21/66 ,  H01L21/48 ,  H01L21/683 ,  H01L23/00 ,  H01L21/78 ,  H01L21/56 ,  H01L23/31

Abstract: A package structure includes a redistribution layer having a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface, at least one bonding electrode disposed on the first surface of the redistribution layer, and a mounting layer disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads that are spaced apart from each other. At least one of the conductive pads is exposed by the sidewall of the redistribution layer.

公开(公告)号：US20190035715A1

公开(公告)日：2019-01-31

申请号：US16018003

申请日：2018-06-25

Applicant: InnoLux Corporation

Inventor： Hsueh-Hsuan Chou ,  Chia-Chieh Fan ,  Kuan-Jen Wang ,  Cheng-Chi Wang ,  Yi-Hung Lin ,  Li-Wei Sung

IPC: H01L23/498 ,  H01L23/31 ,  H01L21/683 ,  H01L21/48 ,  H01L21/56 ,  H01L23/00

Abstract: The present disclosure provides a package device including a conductive pad, a protecting block, and a redistribution layer. The protecting block is disposed on the conductive pad. The redistribution layer is disposed on the protecting block, and the conductive pad is electrically connected to the redistribution layer through the protecting block.

公开(公告)号：US20240103308A1

公开(公告)日：2024-03-28

申请号：US18527392

申请日：2023-12-04

Applicant: Innolux Corporation

Inventor： Ming-Tsang Wu ,  Jia-Sin Li ,  Chia-Chieh Fan

IPC: G02F1/1333 ,  H01L27/12

CPC classification number: G02F1/133305 ,  H01L27/1218 ,  G02F1/1368

Abstract: An electronic device including a substrate, a circuit structure, two adjacent supporting elements and another two adjacent supporting elements is provided. The flexible substrate has a first surface and comprises a region connected with a circuit board. The circuit structure is disposed on the first surface. The two adjacent supporting elements are disposed on the first surface and separated by a first distance. The another two adjacent supporting elements are disposed on the first surface and separated by a second distance, wherein the two adjacent support elements are farther away from the region than the another two adjacent support elements, and the first distance is less than the second distance.

公开(公告)号：US11880100B2

公开(公告)日：2024-01-23

申请号：US17701693

申请日：2022-03-23

Applicant: Innolux Corporation

Inventor： Ming-Tsang Wu ,  Jia-Sin Li ,  Chia-Chieh Fan

IPC: G02F1/1333 ,  H01L27/12 ,  G02F1/1368

CPC classification number: G02F1/133305 ,  H01L27/1218 ,  G02F1/1368 ,  G02F2201/50

Abstract: An electronic device including a flexible substrate, a plurality of light emitting units, and a plurality of supporting elements is provided. The flexible substrate has a first surface and a second surface opposite to each other. The light emitting units are disposed on the first surface. The supporting elements are disposed on the second surface. The supporting element includes an arc-shaped structure.