公开(公告)号：US20220148972A1

公开(公告)日：2022-05-12

申请号：US17114507

申请日：2020-12-08

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H01L23/538 ,  H01L21/66 ,  H01L21/768

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.

公开(公告)号：US20240337872A1

公开(公告)日：2024-10-10

申请号：US18746572

申请日：2024-06-18

Applicant: InnoLux Corporation

Inventor： Bi-Ly LIN ,  Yeong-E CHEN

IPC: G02F1/133 ,  G02C7/06 ,  G02F1/1343 ,  G02F1/137 ,  G02F1/29 ,  H01L31/054

CPC classification number: G02F1/13324 ,  G02C7/066 ,  G02F1/134309 ,  G02F1/294 ,  H01L31/054 ,  G02F1/13725 ,  G02F1/13775

Abstract: An electronic device includes a solar cell, a light modulating module having a first light modulating layer and a first control circuit. At least a portion of the first light modulating layer is disposed on the solar cell. The first control circuit is electrically connected to the light modulating module and the solar cell. Wherein, the first control circuit is used to transmit a light modulating layer control signal to the light modulating module, so as to adjust the transmittance of the first light modulating layer thereby adjusting the energy radiated to the solar cell.

公开(公告)号：US20240023235A1

公开(公告)日：2024-01-18

申请号：US18373284

申请日：2023-09-27

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H05K1/02 ,  H05K3/46 ,  H05K3/02

CPC classification number: H05K1/0269 ,  H05K3/46 ,  H05K3/022

Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

公开(公告)号：US20230245949A1

公开(公告)日：2023-08-03

申请号：US17898410

申请日：2022-08-29

Applicant: InnoLux Corporation

Inventor： Chin-Lung TING ,  Chung-Kuang WEI ,  Cheng-Chi WANG ,  Yeong-E CHEN ,  Yi-Hung LIN

IPC: H01L23/44 ,  H05K1/02 ,  H01L25/065 ,  H01L23/498 ,  H01L25/075 ,  H01L23/00

CPC classification number: H01L23/44 ,  H05K1/0209 ,  H01L25/0655 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49833 ,  H01L23/49838 ,  H01L25/0753 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2924/12041 ,  H01L2224/32225 ,  H01L2224/73204 ,  H05K2201/064

Abstract: An electronic device is disclosed. The electronic device includes a circuit layer, an electronic element and a thermal conducting element. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The thermal conducting element is disposed between the circuit layer and the electronic element. The thermal conducting element is used for performing heat exchange with the electronic element.

公开(公告)号：US20230077312A1

公开(公告)日：2023-03-09

申请号：US17507915

申请日：2021-10-22

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU ,  Cheng-Chi WANG

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/544

Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier; forming a first base layer on the carrier; and forming working units on the first base layer. The working units are spaced apart from one another.

公开(公告)号：US20220319995A1

公开(公告)日：2022-10-06

申请号：US17845991

申请日：2022-06-21

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H01L23/538 ,  H01L21/768 ,  H01L21/66

Abstract: A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a second dielectric layer, and a conductive layer. The second dielectric layer is disposed on the first dielectric layer, and the second dielectric layer includes a dielectric pattern. The conductive layer is disposed between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive pattern. The dielectric pattern has a through hole, and in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other.

公开(公告)号：US20250140645A1

公开(公告)日：2025-05-01

申请号：US19006108

申请日：2024-12-30

Applicant: InnoLux Corporation

Inventor： Chin-Lung TING ,  Chung-Kuang WEI ,  Cheng-Chi WANG ,  Yeong-E CHEN ,  Yi-Hung LIN

IPC: H01L23/44 ,  H01L23/00 ,  H01L23/498 ,  H01L25/065 ,  H01L25/075 ,  H05K1/02

Abstract: An electronic device including a circuit layer, an electronic element, a first flow-path structure and a fluid material is disclosed. The electronic element is disposed on the circuit layer and electrically connected to the circuit layer. The first flow-path structure includes a first flow path, and the electronic element is disposed in the first flow-path structure. The fluid material is disposed in the first flow path. The fluid material is used for performing heat exchange with the electronic element. The circuit layer includes an input hole and an output hole, and the fluid material enters the first flow path through the input hole and exits the first flow path through the output hole.

公开(公告)号：US20250046623A1

公开(公告)日：2025-02-06

申请号：US18919664

申请日：2024-10-18

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU ,  Cheng-Chi WANG

IPC: H01L21/48 ,  H01L21/66 ,  H01L21/683 ,  H01L23/544

Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier substrate; forming a first base layer on the carrier substrate; forming a working unit on the first base layer, performing a detection step on the working unit to identify whether a defect is present, wherein the detection step includes automated optical inspection (AOI), electrical detection, or a combination thereof; and repairing the electronic device.

公开(公告)号：US20250029907A1

公开(公告)日：2025-01-23

申请号：US18909895

申请日：2024-10-08

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Cheng-En CHENG ,  Yu-Ting LIU

IPC: H01L23/498 ,  H01L21/48

Abstract: A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern including a conductive pattern, and the conductive pattern is formed of the conductive layer. The conductive pattern comprises a plurality of sub-portions arranged along at least one direction, and sizes of the plurality of sub-portions increase sequentially along the at least one direction.

公开(公告)号：US20240006249A1

公开(公告)日：2024-01-04

申请号：US18369847

申请日：2023-09-19

Applicant: InnoLux Corporation

Inventor： Yeong-E CHEN ,  Kuang-Chiang HUANG ,  Yu-Ting LIU ,  Yi-Hung LIN ,  Cheng-En CHENG

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L22/14 ,  H01L22/32 ,  H01L24/19 ,  H01L21/48 ,  H01L24/82 ,  H01L2224/829

Abstract: The present disclosure provides an electronic device including a redistribution layer, a plurality of passive components, and an electronic component. The redistribution layer includes a first insulating layer, a second insulating layer, and a plurality of traces electrically connected to each other through a first opening of the first insulating layer and a second opening of the second insulating layer, wherein the first insulating layer has a first side away from the second insulating layer, and the second insulating layer has a second side away from the first insulating layer. The passive components are disposed on the first side. The electronic component is disposed on the second side. The plurality of passive components are electrically connected to the electronic component through the plurality of traces.