DISPLAY DEVICE
    11.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20190250747A1

    公开(公告)日:2019-08-15

    申请号:US16390425

    申请日:2019-04-22

    Abstract: A touch display device is provided. The touch display device includes a substrate and a plurality of display units disposed on the substrate, wherein the display units form a display region and the display region has a first outline. The touch display device further includes an insulating layer disposed on the display units and a plurality of touch units disposed on the insulating layer, wherein the touch units form a touch region, and the touch region has a second outline. The touch display device further includes a reflection reducing layer disposed on the touch units, the reflection reducing layer is in contacted with the touch units and has a third outline, wherein the first outline and the second outline are located within the third outline in a view of a first direction perpendicular to the substrate.

    DISPLAY DEVICE
    14.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20190087004A1

    公开(公告)日:2019-03-21

    申请号:US16103308

    申请日:2018-08-14

    Abstract: A display device includes a display panel, a vibrator and an adhesive layer. The vibrator is disposed on a surface of the display panel. The adhesive layer is disposed between the display panel and the vibrator, and a part of the adhesive layer contacts the display panel and another part of the adhesive layer contacts the vibrator.

    LIGHT EMITTING UNIT AND DISPLAY DEVICE

    公开(公告)号:US20250022986A1

    公开(公告)日:2025-01-16

    申请号:US18903541

    申请日:2024-10-01

    Abstract: An electronic device includes: a semiconductor layer; a first layer disposed on the semiconductor layer, including at least one of oxygen atoms and nitrogen atoms and having a first maximum thickness; a second layer, wherein the first layer is disposed between the second layer and the semiconductor layer, and the second layer has a second maximum thickness; and a third layer, wherein the second layer is disposed between the first layer and the third layer, the third layer has a third maximum thickness, and the second maximum thickness and the third maximum thickness are greater than the first maximum thickness, wherein the first layer comprises a first position and a second position, the first position is closer to the semiconductor layer than the second position, and a first oxygen atomic percentage at the first position is less than a second oxygen atomic percentage at the second position.

    ELECTRONIC DEVICE
    17.
    发明申请

    公开(公告)号:US20240404919A1

    公开(公告)日:2024-12-05

    申请号:US18800801

    申请日:2024-08-12

    Abstract: An electronic device includes: a substrate including a through hole; a connecting element disposed in the through hole; a first insulating layer disposed on the substrate and including a first via; a first conductive element disposed on the first insulating layer and electrically connected to the connecting element through the first via; a second conductive element and a third conductive element disposed on the first conductive element and separated from each other by a space; a second insulating layer disposed in the space; a fourth conductive element disposed under the substrate and electrically connected to the connecting element; and a semiconductor disposed between the substrate and the first insulating layer, wherein, in a cross-sectional view of the electronic device, at least one of the second conductive element and the third conductive element is not overlapping with the connecting element.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

    公开(公告)号:US20240255714A1

    公开(公告)日:2024-08-01

    申请号:US18409730

    申请日:2024-01-10

    CPC classification number: G02B6/423 G02B6/4259 G02B6/4283 G02B6/4295

    Abstract: The present disclosure provides a semiconductor device, including a substrate structure, a photonic unit, an optical fiber and a chip unit. The substrate structure includes a coupling member. The photonic unit is disposed in a first recess of the coupling member. The optical fiber is disposed in a second recess of the coupling member and optically coupled to the photonic unit. The chip unit is disposed on the substrate structure and electrically connected to the photonic unit through the coupling member. A depth of the second recess is greater than or equal to half a diameter of the optical fiber.

    ELECTRONIC DEVICE AND SPEAKER DEVICE
    19.
    发明公开

    公开(公告)号:US20240251206A1

    公开(公告)日:2024-07-25

    申请号:US18404466

    申请日:2024-01-04

    CPC classification number: H04R9/046 H04R9/025 H04R9/06

    Abstract: An electronic device includes a substrate; and a coil structure disposed on the substrate. The coil structure is provided with a first conductor layer including a connection line; a second conductor layer including a plurality of line segments separated from each other; and a first insulation layer disposed between the first conductor layer and the second conductor layer, and provided with a plurality of first openings, wherein adjacent two of the plurality of line segments are electrically connected to the connection line through the plurality of first openings.

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