公开(公告)号：US20250029910A1

公开(公告)日：2025-01-23

申请号：US18909897

申请日：2024-10-08

Applicant: Innolux Corporation

Inventor： Yeong-E Chen ,  Yi-Hung Lin ,  Cheng-En Cheng ,  Wen-Hsiang Liao ,  Cheng-Chi Wang

IPC: H01L23/498 ,  H01L21/48 ,  H01L23/00

Abstract: An electronic component includes a first electronic unit including a plurality of pads, a first conductive layer, a second conductive layer, a first insulating layer having a first thickness, a second insulating layer having a second thickness, a second electronic unit, and a solder ball. The first conductive layer is disposed between the first electronic unit and the second conductive layer, and electrically connected to at least one of the pads through a conductive via. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second conductive layer is disposed between the first insulating layer and the second insulating layer. The first thickness is different from the second thickness. The second conductive layer is disposed between the first conductive layer and the second electronic unit. The second conductive layer is electrically connected to the second electronic unit through the solder ball.

公开(公告)号：US12200857B2

公开(公告)日：2025-01-14

申请号：US18373284

申请日：2023-09-27

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Cheng-En Cheng ,  Yu-Ting Liu

IPC: H05K1/02 ,  B32B3/08 ,  B32B3/30 ,  B32B5/24 ,  B32B15/092 ,  B32B15/14 ,  B32B15/20 ,  H05K1/03 ,  H05K3/02 ,  H05K3/22 ,  H05K3/46

Abstract: The present disclosure provides a package device including a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer, and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test mark, the test mark includes a conductive pattern formed of the conductive layer, the conductive pattern includes a center portion and a plurality of extension portions, and the plurality of extension portions are respectively connected to the center portion.

公开(公告)号：US12148630B2

公开(公告)日：2024-11-19

申请号：US17507915

申请日：2021-10-22

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Cheng-En Cheng ,  Yu-Ting Liu ,  Cheng-Chi Wang

IPC: H01L21/48 ,  H01L21/66 ,  H01L23/544 ,  H01L21/683

Abstract: The application relates to a method for manufacturing an electronic device, and in particular, to a method for manufacturing an electronic device with a carrier substrate. The method includes: providing a carrier, forming a first base layer on the carrier; and forming working units on the first base layer. The working units are spaced apart from one another.

公开(公告)号：US11798853B2

公开(公告)日：2023-10-24

申请号：US17315389

申请日：2021-05-10

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Kuang-Chiang Huang ,  Yu-Ting Liu ,  Yi-Hung Lin ,  Cheng-En Cheng

IPC: H01L21/66 ,  H01L23/00 ,  H01L21/48

CPC classification number: H01L22/14 ,  H01L21/48 ,  H01L22/32 ,  H01L24/19 ,  H01L24/82 ,  H01L2224/829

Abstract: The present disclosure provides a manufacturing method of a package device, which includes providing a carrier substrate, a first conductive layer, and a release layer, where the carrier substrate has a device region and a peripheral region, and the first conductive layer and the release layer are disposed on the carrier substrate. The method further includes forming a second conductive layer on the release layer in the device region, where at least one of the first and second conductive layers includes a first pad in the peripheral region. The second conductive layer includes a second pad electrically connected to the first pad through the first conductive layer. The method also includes performing an inspection step to provide an input signal to one of the first and second pads, and to receive an output signal from another of the first and second pads.

公开(公告)号：US11776914B2

公开(公告)日：2023-10-03

申请号：US17845991

申请日：2022-06-21

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Cheng-En Cheng ,  Yu-Ting Liu

IPC: H01L23/538 ,  H01L21/768 ,  H01L21/66

CPC classification number: H01L23/5384 ,  H01L21/76802 ,  H01L22/32 ,  H01L23/5386

Abstract: A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a second dielectric layer, and a conductive layer. The second dielectric layer is disposed on the first dielectric layer, and the second dielectric layer includes a dielectric pattern. The conductive layer is disposed between the first dielectric layer and the second dielectric layer, and the conductive layer includes a first conductive pattern. The dielectric pattern has a through hole, and in a top view of the package device, the first conductive pattern and the through hole are overlapped with each other.

公开(公告)号：US11406015B2

公开(公告)日：2022-08-02

申请号：US16884323

申请日：2020-05-27

Applicant: InnoLux Corporation

Inventor： Yu-Ting Liu ,  Yeong-E Chen ,  Chean Kee

IPC: H05K1/11 ,  H05K1/02 ,  H05K1/18

Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

公开(公告)号：US12148686B2

公开(公告)日：2024-11-19

申请号：US17572657

申请日：2022-01-11

Applicant: InnoLux Corporation

Inventor： Yeong-E Chen ,  Cheng-En Cheng ,  Yu-Ting Liu

IPC: H01L23/498 ,  H01L21/48

Abstract: The present disclosure provides a package device and a manufacturing method thereof. The package device includes a redistribution layer which includes a first dielectric layer, a conductive layer and a second dielectric layer. The conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern that includes a first conductive pattern, and the first conductive pattern is formed of the conductive layer.

公开(公告)号：US12075566B2

公开(公告)日：2024-08-27

申请号：US17851246

申请日：2022-06-28

Applicant: InnoLux Corporation

Inventor： Yu-Ting Liu ,  Yeong-E Chen ,  Chean Kee

IPC: H05K1/11 ,  H05K1/18 ,  H05K1/02

CPC classification number: H05K1/113 ,  H05K1/028 ,  H05K1/11 ,  H05K1/18 ,  H05K2201/0338 ,  H05K2201/10128

Abstract: An electronic device is provided. The electronic device includes: a substrate, wherein the substrate has a normal direction; a first bonding pad and a second bonding pad disposed side by side on the substrate. The first bonding pad includes a first conductive layer and a second conductive layer, and the first conductive layer is adjacent to the second conductive layer. The second bonding pad includes a third conductive layer, the third conductive layer is adjacent to the second conductive layer, and in the normal direction, a distance between a bottom surface of the third conductive layer and the substrate is different than a distance between a bottom surface of the second conductive layer and the substrate. Viewed from the normal direction of the substrate, at least part of the second conductive layer is between the first conductive layer and the third conductive layer.

公开(公告)号：US20240047633A1

公开(公告)日：2024-02-08

申请号：US18347584

申请日：2023-07-06

Applicant: Innolux Corporation

Inventor： Yi-Hung Lin ,  Yeong-E Chen ,  Yan-Zheng Wu

IPC: H01L33/62 ,  H01L25/075

CPC classification number: H01L33/62 ,  H01L25/0753 ,  H01L2933/0066

Abstract: An electronic device and a manufacturing method thereof are provided. The electronic device includes a substrate, a first metal layer, a first insulating layer, a second metal layer, and a second insulating layer. The first metal layer is disposed on the substrate and configured to transmit a ground signal. The first insulating layer is disposed on the first metal layer and includes at least one first opening. The second metal layer is disposed on the first insulating layer and electrically connected to the first metal layer through the at least one first opening. The second insulating layer is disposed on the second metal layer and includes at least one second opening. In the top view direction, the at least one first opening is separated from the at least one second opening. The electronic device in the embodiments of the disclosure and the manufacturing method thereof may improve the process yield.

公开(公告)号：US11769685B2

公开(公告)日：2023-09-26

申请号：US17520599

申请日：2021-11-05

Applicant: Innolux Corporation

Inventor： Cheng-Chi Wang ,  Wen-Hsiang Liao ,  Yeong-E Chen ,  Hung-Sheng Chou ,  Cheng-En Cheng

IPC: H01L21/683 ,  H01L21/48

CPC classification number: H01L21/6836 ,  H01L21/4853 ,  H01L2221/68354 ,  H01L2221/68363

Abstract: A manufacturing method of a semiconductor package is provided. The manufacturing method includes the following. A plurality of semiconductor components are provided. Each semiconductor component has at least one conductive bump. A substrate is provided. The substrate has a plurality of conductive pads. A transfer device is provided. The transfer device transfers the semiconductor components onto the substrate. A heating device is provided. The heating device heats or pressurizes at least two semiconductor components. During transferring of the semiconductor components to the substrate, the at least one conductive bump of each semiconductor component is docked to a corresponding one of the conductive pads.