公开(公告)号：US10098233B2

公开(公告)日：2018-10-09

申请号：US15289309

申请日：2016-10-10

Applicant: Intel Corporation

Inventor： Ravi Shankar ,  Ching-Ping Janet Shen

IPC: H05K1/03 ,  H05K1/09 ,  H05K3/00 ,  H05K3/02 ,  B32B37/12 ,  B32B37/24 ,  B32B37/26 ,  B32B38/10 ,  H01L21/465 ,  H01L21/683 ,  B32B7/12 ,  B32B17/06 ,  B32B27/38 ,  B32B15/04 ,  B32B15/08 ,  B32B15/20 ,  B32B27/20 ,  B32B27/28 ,  B32B3/30 ,  B32B5/02 ,  B32B15/14 ,  H01L21/48 ,  H01L23/498

Abstract: Generally discussed herein are systems and apparatuses that can include a base with one or more recesses therein. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include providing a releasable core, the releasable core including a first conductive foil integrally coupled with a base at a first side of the base and a first side of the conductive foil, the first conductive foil situated in a first recess in the first side of the base. The technique can include releasably coupling a second conductive foil to a second side of the first conductive foil through a temporary adhesive layer integrally coupled to a first side of the second conductive foil, the second side of the first conductive foil opposite the first side of the first conductive foil.

公开(公告)号：US09554468B2

公开(公告)日：2017-01-24

申请号：US14227697

申请日：2014-03-27

Applicant: Intel Corporation

Inventor： Ching-Ping Janet Shen ,  Charan K. Gurumurthy ,  Dilan Seneviratne ,  Ravi Shankar ,  Liwen Jin ,  Deepak Arora

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/46 ,  B32B3/26 ,  B32B15/20 ,  B32B37/12 ,  B32B7/12 ,  B32B15/08 ,  B32B37/10 ,  H05K3/28 ,  H01L23/13 ,  H01L23/538

CPC classification number: H05K1/183 ,  B32B3/263 ,  B32B7/12 ,  B32B15/08 ,  B32B15/20 ,  B32B37/10 ,  B32B37/1284 ,  B32B2307/202 ,  B32B2457/08 ,  H01L23/13 ,  H01L23/5389 ,  H01L2924/0002 ,  H05K1/185 ,  H05K3/284 ,  Y10T428/24612 ,  Y10T428/2495 ,  Y10T428/31678 ,  H01L2924/00

Abstract: Generally discussed herein are systems and apparatuses that can include a releasable core panel. The disclosure also includes techniques of making and using the systems and apparatuses. According to an example a technique of making a releasable core panel can include coupling an inner foil to a base, situating an adhesive layer on the inner foil, such that the inner foil is substantially flush with a periphery of the base, situating an outer conductive foil on the adhesive layer, or covering an interface between the adhesive layer, the inner foil and the outer conductive foil with a protective material.

Abstract translation: 本文通常讨论的是可以包括可释放的核心面板的系统和装置。 本公开还包括制造和使用系统和装置的技术。 根据一个实例，制造可释放的芯板的技术可以包括将内箔连接到基底上，将粘合剂层定位在内箔上，使得内箔基本上与基底的周边齐平，将外导电 或者利用保护材料覆盖粘合层，内箔和外导电箔之间的界面。