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公开(公告)号:US10030916B2
公开(公告)日:2018-07-24
申请号:US14446123
申请日:2014-07-29
Applicant: INTEL CORPORATION
Inventor: Phi Hung Thanh , Paul J. Diglio , John C. Johnson , Jarett L. Rinaldi , Arnab Choudhury
IPC: F28F7/00 , F28F1/10 , F28F3/12 , F28F13/06 , H01L23/473
Abstract: A heat transfer apparatus is described having a manifold. The manifold has a surface having a fluidic exit opening and a fluidic entrance opening. A fluid is to flow from the fluidic exit opening and into the fluidic entrance opening. The manifold has a protrusion emanating from the surface between the fluidic exit opening and the fluidic entrance opening. An apparatus is described having a thermally conductive grooved structure. The thermally conductive grooved structure has a surface having first and second cavities to form first and second fluidic channels. The thermally conductive grooved structure has a protrusion emanating from between the cavities. The protrusion has side surfaces to form parts of the first and second fluidic channels.
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公开(公告)号:US09869714B2
公开(公告)日:2018-01-16
申请号:US15185468
申请日:2016-06-17
Applicant: INTEL CORPORATION
Inventor: John C. Johnson , James G. Maveety , Abram M. Detofsky , James E. Neeb
CPC classification number: G01R31/2874 , G01R1/0458 , G01R1/06722 , G01R1/06783 , G01R1/44 , G01R31/2642 , G01R31/2875 , G01R31/2891 , H05K7/20
Abstract: A thermal controller includes a thermal control interface to receive test data from an automated test equipment (ATE) system and dynamically adjust a target setpoint temperature based on the data and a dynamic thermal controller to receive the target setpoint temperature from the thermal control interface and control a thermal actuator based on the target setpoint temperature.
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