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30 条记录 (耗时 0.025 秒)

    Method and a system for solid freeform fabricating using non-reactive powder
    17.
    发明授权
    Method and a system for solid freeform fabricating using non-reactive powder 有权
    使用非反应性粉末的固体自由形成方法和系统

    公开(公告)号：US07120512B2

    公开(公告)日：2006-10-10

    申请号：US10648122

    申请日：2003-08-25

    申请人： Laura Kramer ,  Vladek P Kasperchik ,  Terry M. Lambright ,  Melissa D. Boyd

    发明人： Laura Kramer ,  Vladek P Kasperchik ,  Terry M. Lambright ,  Melissa D. Boyd

    IPC分类号： G06F19/00

    CPC分类号： B29C64/165 ,  B33Y10/00 ,  B33Y70/00

    摘要： A method for creating a three-dimensional solid freeform fabrication object with non-reactive powder includes spreading a non-reactive powder on a substrate, selectively dispensing a reactive resin onto the non-reactive powder forming a mixture of reactive resin and non-reactive powder, wherein the selective dispensing of the reactive resin defines the three-dimensional object, and curing the reactive resin thereby encapsulating the non-reactive powder.

    摘要翻译： 用非反应性粉末制造三维固体自由形成制造物体的方法包括将非反应性粉末涂布在基底上，选择性地将反应性树脂分配到非反应性粉末上，形成反应性树脂和非反应性粉末的混合物 其中反应性树脂的选择性分配限定三维物体，并固化反应性树脂，从而封装非反应性粉末。

    Hot-melt seal for nozzles on print cartridges and method
    18.
    发明授权
    Hot-melt seal for nozzles on print cartridges and method 有权
    打印墨盒上喷嘴的热熔密封和方法

    公开(公告)号：US06959976B2

    公开(公告)日：2005-11-01

    申请号：US09820427

    申请日：2001-03-28

    申请人： Veronica A. Nelson ,  Melanie J Feder ,  Terry M. Lambright

    发明人： Veronica A. Nelson ,  Melanie J Feder ,  Terry M. Lambright

    IPC分类号： B41J2/165 ,  B41J2/175

    CPC分类号： B41J2/16505 ,  B41J2/17593

    摘要： Hot-melt Seal For Nozzles on Print Cartridges And Method. A layer of hot-melt is adhesively bonded to a print cartridge to seal the nozzles through which ink is jetted. In another aspect, a layer of hot-melt seals the electrical contacts and leads mounted on the print cartridge. The hot-melt adhesive can be either laminated with a moisture retardant (preferably impermeable) base film or block coated on moisture retardant (preferably impermeable) pouch material. These materials are thereafter adhesively bonded to the print cartridge, sealing the nozzles and preferably the electrical contacts and leads as well.In one application process, a hot-melt moisture retardant laminate tape is cut to size, releasably captured, positioned over the nozzles, and heat staked to seal the nozzles of the print cartridge. In a second application process, a layer of hot-melt is directly applied over the nozzles and a layer of moisture retardant material is heat staked to the hot-melt. In a third application process, heat stakable pouch material is block coated with hot-melt, the block coated hot-melt is positioned over the nozzles and heat staked, and the print cartridge is thereafter flow wrapped. In a fourth application process a hot-melt, moisture retardant tape is cut to size and heat staked to seal the nozzles of a print cartridge. Thereafter a free-end of the tape is heat staked into a pouch material and then the print cartridge is flow wrapped with the pouch material.

    摘要翻译： 喷墨嘴喷嘴热熔密封及方法。 将一层热熔胶粘结到打印墨盒上，以密封喷射墨水的喷嘴。 另一方面，一层热熔胶密封安装在打印碳粉盒上的电气触点和引线。 该热熔粘合剂可以与涂覆有阻燃（优选不渗透的）袋材料的阻水剂（优选不渗透的）基膜或块层压。 然后将这些材料粘合到打印碳粉盒上，密封喷嘴，优选电接点和引线。 在一个应用过程中，将热熔性阻燃层压带切割成尺寸，可释放地捕获，定位在喷嘴上方，并且热铆接以密封打印碳粉盒的喷嘴。 在第二种施加方法中，将一层热熔胶直接施加在喷嘴上，并将一层阻燃材料热铆接到热熔体上。 在第三种施加方法中，热保护袋材料用热熔胶进行块状涂覆，将块状涂覆的热熔体定位在喷嘴上方并进行热定型，然后打印墨盒流动包裹。 在第四种施加方法中，将热熔性阻燃胶带切割成尺寸并加热固化以密封打印碳粉盒的喷嘴。 此后，带的自由端被热铆接成小袋材料，然后打印墨盒用袋材料流动包裹。

    Self-aligned interconnect and method for producing same
    19.
    发明授权
    Self-aligned interconnect and method for producing same 失效
    自对准互连及其制造方法

    公开(公告)号：US06457811B1

    公开(公告)日：2002-10-01

    申请号：US09843833

    申请日：2001-04-30

    申请人： Alfred I-Tsung Pan ,  Terry M. Lambright

    发明人： Alfred I-Tsung Pan ,  Terry M. Lambright

    IPC分类号： B41J214

    CPC分类号： B41J2/14024 ,  B41J2/14016 ,  B41J2202/19 ,  B41J2202/20

    摘要： A self-aligned interconnect significantly reduces manufacturing costs and provides important advantages in a number of specific applications begins with a single crystal substrate. The substrate is machined to accept microelectronic chips at various locations (openings) along the substrate. Corresponding chips are constructed to precisely fit the openings in the crystal substrate. To ensure precision fit, both the substrate and the chip are etched along the same crystal plane. As a result, the chips can be placed in the openings in the substrate with perfect or nearly perfect alignment in the x and y directions without expensive alignment tools. In effect, the chips and the substrate are self aligned.

    摘要翻译： 自对准互连显着降低了制造成本，并且在单晶衬底开始的许多具体应用中提供了重要的优点。 基板被加工成沿着基板在各种位置（开口）处接受微电子芯片。 相应的芯片被构造成精确地配合晶体衬底中的开口。 为了确保精密配合，衬底和芯片都沿相同的晶面蚀刻。 结果，芯片可以在x和y方向上以完美或几乎完美的对准方式放置在基板中的开口中，而不需要昂贵的对准工具。 实际上，芯片和衬底是自对准的。