摘要:
The present invention is generally related to integrated circuit devices, and more particularly, to methods and systems of a multi-chip package (MCP) containing a self-diagnostic scheme for detecting errors in the MCP. The MCP generally comprises a controller, at least one volatile memory chip having error detection logic, at least one non-volatile memory chip, and at least one fail signature register for storing fail signature data related to memory errors detected in the MCP. The controller can poll the fail signature register for fail signature data related to memory errors stored therein. Upon detection of fail signature data, the controller can store the fail signature data on a fail signature register located on a non-volatile memory.
摘要:
A multi-chip package is provided that has at least a first, second and third chip, each comprising a top and bottom surface. The multi-chip package also has a package substrate for interfacing with a printed circuit board (PCB). The chips and the package substrate are housed within an encapsulation material. The bottom surface of the first chip is attached to the package substrate. The top surface of the first chip has a first plurality of landing pads, which serve as a mechanical and electrical interface between the first and second chip. The bottom surface of the second chip has a second plurality of landing pads that serve as a mechanical and electrical interface between the second and first chip. Additionally, the top surface of the second chip has a third plurality of landing pads that serve as a mechanical and electrical interface between the second and third chip.
摘要:
A multi-chip package is provided that has at least a first, second and third chip, each comprising a top and bottom surface. The multi-chip package also has a package substrate for interfacing with a printed circuit board (PCB). The chips and the package substrate are housed within an encapsulation material. The bottom surface of the first chip is attached to the package substrate. The top surface of the first chip has a first plurality of landing pads, which serve as a mechanical and electrical interface between the first and second chip. The bottom surface of the second chip has a second plurality of landing pads that serve as a mechanical and electrical interface between the second and first chip. Additionally, the top surface of the second chip has a third plurality of landing pads that serve as a mechanical and electrical interface between the second and third chip.
摘要:
A mold unit manufacturing a plastic edged glass shelf includes a first mold including a first support frame forming groove; a second mold including a second support frame forming groove; a support frame forming portion formed by the first and second support frame forming grooves; a seating portion receiving a glass sheet; and support pins formed in the support frame forming portion forming the edge of the glass sheet.
摘要:
A pulse width modulator for use in a digital amplifier, includes a pop noise reducer for reducing pop noise by controlling a width and a phase of a pulse of a PWM signal output from the pulse width modulator, wherein the pop noise reducer contains: a PWM pulse register for storing a width and a phase values of a pulse of the PWM signal; and a pulse generator for outputting the PWM signal according to the values stored in the PWM pulse register. The pulse width modulator reduces pop noise generated when power supply to a digital amplifier is started and interrupted.
摘要:
A multiplexer for a semiconductor memory device which has at least two pads for inputting data signals from the outside. The multiplexer has at least two input lines for inputting the data signals from the at least two pads, respectively, at least two control lines for inputting control signals for switching the data signals from the at least two input lines, respectively, and at least two switching circuits, each of the at least two switching circuits transferring the data signal from a corresponding one of the at least two input lines to an output line in response to the control signal from a corresponding one of the at least two control lines and having a floating node formed to be electrically isolable from the output line and the corresponding input line to prevent a loss of the data signal on the output line. According to the present invention, the multiplexer can prevent a data loss due to a disturbance and accurately transfer the data signals from the at least two pads.
摘要:
The present invention relates to computing circuits and method for running an MPEG-2 AAC or MPEG-4 AAC algorithm efficiently, which is used as an audio compression algorithm in multi-channel high-quality audio systems, on programmable processors. In accordance with the present invention, the IMDCT process which takes large part of the amount of the operations in implementation of an MPEG-2/4 AAC algorithm can be performed in efficient. In addition, while the architecture of the existing digital signal processor is still used, the performance can be improved by means of the addition of the architecture of the address generator, Huffman decoder, and bit processing architecture. After all, to design and change the programmable processor is facilitated.
摘要:
An integrated circuit includes a data bus and a first memory device coupled to the data bus. The first memory device is configured to provide a first signal in response to completing a power-up sequence of the first memory device. The integrated circuit includes a second memory device coupled to the data bus. The second memory device is configured to provide a second signal in response to completing a power-up sequence of the second memory device. The integrated circuit includes a controller configured to access the first memory device and the second memory device based on the first signal and the second signal.
摘要:
A synchronous DRAM (SDRAM) terminates a write operation in response to detecting deactivation of a data strobe signal applied to it during the write operation. In one example, the SDRAM comprises a buffer circuit and an early write termination circuit. The buffer circuit is configured to sample input data responsive to a data strobe signal applied to the SDRAM during a write operation and direct the input data to one or more memory cells of the SDRAM for storing the input data. The early write termination circuit is configured to terminate the write operation at less than a programmed burst length by disabling access to one or more of the memory cells after storage of the sampled input data responsive to detecting deactivation of the data strobe signal.