Abstract:
In one embodiment, the invention is a method and apparatus for fabricating a high-performance band-edge complementary metal-oxide-semiconductor device. One embodiment of a method for fabricating a complementary metal-oxide-semiconductor device includes fabricating an n-type metal-oxide-semiconductor device using a gate first process, and fabricating a p-type metal-oxide-semiconductor device using a gate last process.
Abstract:
A method of forming a field effect transistor (FET) includes forming a carbon-containing region over a substrate. An epitaxial layer is formed over the carbon-containing region. The epitaxial layer has a lower doping concentration than the substrate. A body region of a first conductivity type is formed in the epitaxial layer. The epitaxial layer is of a second conductivity type and forms a p-n junction with the body region. Gate electrodes are formed adjacent to but insulated from the body regions. Source regions of the second conductivity type are formed in the body regions. The source regions form p-n junctions with the body regions.
Abstract:
A method for forming a shielded gate trench field effect transistor (FET) includes forming trenches in a semiconductor region, forming a shield electrode in a bottom portion of each trench, and forming an inter-electrode dielectric (IED) extending over the shield electrode. The IED may comprise a low-k dielectric. The method also includes forming a gate electrode in an upper portion of each trench over the IED.
Abstract:
A vertically-conducting planar-gate field effect transistor includes a silicon region of a first conductivity type, a silicon-germanium layer extending over the silicon region, a gate electrode laterally extending over but being insulated from the silicon-germanium layer, a body region of the second conductivity type extending in the silicon-germanium layer and the silicon region, and source region of the first conductivity type extending in the silicon-germanium layer. The gate electrode laterally overlaps both the source and body regions such that a portion of the silicon germanium layer extending directly under the gate electrode between the source region and an outer boundary of the body region forms a channel region.
Abstract:
A shielded gate trench field effect transistor (FET) comprises trenches extending into a semiconductor region. A shield electrode is disposed in a bottom portion of each trench. The shield electrode is insulated from the semiconductor region by a shield dielectric. A gate electrode is disposed in each trench over the shield electrode, and an inter-electrode dielectric (IED) comprising a low-k dielectric extends between the shield electrode and the gate electrode.
Abstract:
A trench-gate field effect transistor includes trenches extending into a silicon region of a first conductivity type, and a gate electrodes in each trench. Body regions of second conductivity type extend over the silicon region between adjacent trenches. Each body region forms a first PN junction with the silicon region, and each body region includes a silicon-germanium layer of the second conductivity type laterally extending between adjacent trenches. Source regions of the first conductivity flank the trenches, and each source region forms a second PN junction with one of the body regions. Channel regions extend in the body regions along sidewalls of the trenches between the source regions and a bottom surface of the body regions. The silicon-germanium layers extend into corresponding channel regions to thereby reduce the channel resistance.
Abstract:
A field effect transistor (FET) includes a pair of trenches extending into a semiconductor region. Each trench includes a first shield electrode in a lower portion of the trench and a gate electrode in an upper portion of the trench over but insulated from the shield electrode. First and second well regions of a first conductivity type laterally extend in the semiconductor region between the pair of trenches and abut sidewalls of the pair of trenches. The first and second well regions are vertically spaced from one another by a first drift region of a second conductivity type. The gate electrode and the first shield electrode are positioned relative to the first and second well regions such that a channel is formed in each of the first and second well regions when the FET is biased in the on state.
Abstract:
A field effect transistor includes body regions of a first conductivity type over a semiconductor region of a second conductivity type such that the body regions form p-n junctions with the semiconductor region. Trenches extend through the body region and terminate within the semiconductor region. Source regions of the second conductivity type extend over the body regions adjacent the trenches such that the source regions form p-n junctions with the body regions. A gate dielectric layer lines sidewalls of each trench. A metal liner lines the gate dielectric layer in each trench. A gate electrode comprising metallic material is disposed in each trench.
Abstract:
Methods are provided for reducing the aspect ratio of contacts to bit lines in fabricating an IC including logic and memory. The method includes the steps of forming a first group of device regions to be contacted by a first level of metal and a second group of memory bit lines to be contacted by a second level of metal, the first level separated from the second level by at least one layer of dielectric material. Conductive material is plated by electroless plating on the device regions and bit lines and first and second conductive plugs are formed overlying the conductive material. The first conductive plugs are contacted by the first level of metal and the second conductive plugs are contacted by the second level of metal. The thickness of the plated conductive material provides a self aligned process for reducing the aspect ratio of the conductive plugs.
Abstract:
A trench-gate field effect transistor includes trenches extending into a silicon region of a first conductivity type, and a gate electrodes in each trench. Body regions of second conductivity type extend over the silicon region between adjacent trenches. Each body region forms a first PN junction with the silicon region, and each body region includes a silicon-germanium layer of the second conductivity type laterally extending between adjacent trenches. Source regions of the first conductivity flank the trenches, and each source region forms a second PN junction with one of the body regions. Channel regions extend in the body regions along sidewalls of the trenches between the source regions and a bottom surface of the body regions. The silicon-germanium layers extend into corresponding channel regions to thereby reduce the channel resistance.