公开(公告)号：US20240105884A1

公开(公告)日：2024-03-28

申请号：US18470478

申请日：2023-09-20

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Daiki ISONO

IPC: H01L33/48 ,  H01L25/075 ,  H01L33/20 ,  H01L33/62

CPC classification number: H01L33/486 ,  H01L25/0753 ,  H01L33/20 ,  H01L33/62 ,  H01L2933/0066

Abstract: Performance of an electronic device is improved. A substrate for transfer includes a substrate having a surface and made of a visible light transmitting material, and an elastic deformation portion fixed on the surface of the substrate, transmitting visible light, and made of an elastically deformable material. The elastic deformation portion includes a plurality of element holding portions, and a plurality of protrusions arranged at positions not overlapping with the plurality of element holding portions, and protruding higher than the plurality of element holding portions when the surface of the substrate is a reference plane.

公开(公告)号：US20240021757A1

公开(公告)日：2024-01-18

申请号：US18350774

申请日：2023-07-12

Applicant: Japan Display Inc.

Inventor： Keisuke ASADA ,  Kazuyuki YAMADA ,  Kenichi TAKEMASA ,  Daiki ISONO

IPC: H01L33/38 ,  H01L21/66 ,  H01L33/00 ,  H01L33/56

CPC classification number: H01L33/38 ,  H01L22/12 ,  H01L33/005 ,  H01L33/56 ,  H01L2933/0016

Abstract: A display device includes a substrate, a first electrode and a second electrode on the substrate, and an LED chip disposed on the first electrode and the second electrode and having an n-side pad electrode and a p-side pad electrode. The n-side pad electrode has a first protruding portion, the first protruding portion protruding toward the substrate and in contact with the first electrode, and the p-side pad electrode has a second protruding portion, the second protruding portion protruding toward the substrate and in contact with the second electrode.

公开(公告)号：US20220375895A1

公开(公告)日：2022-11-24

申请号：US17746263

申请日：2022-05-17

Applicant: Japan Display Inc.

Inventor： Keisuke ASADA ,  Kazuyuki YAMADA ,  Kenichi TAKEMASA ,  Daiki ISONO

IPC: H01L23/00 ,  H01L33/00 ,  H01L25/16

Abstract: According to an aspect, a manufacturing method of a display device includes: obtaining a first reference position on a surface of a holding substrate based on positions of a plurality of first alignment marks of the holding substrate; and aligning the holding substrate with a transfer destination substrate such that the first reference position on the holding substrate and a second reference position on a surface of the transfer destination substrate coincide. The holding substrate is sectioned into a plurality of first sections and a plurality of second sections when viewed from one direction. Each of the first sections is provided in a part of a gap between the second sections when viewed from the one direction, has a light transmission rate higher than a light transmission rate of the second sections, and forms the first alignment mark through which light passes when viewed from the one direction.

公开(公告)号：US20220320041A1

公开(公告)日：2022-10-06

申请号：US17706612

申请日：2022-03-29

Applicant: Japan Display Inc.

Inventor： Kenichi TAKEMASA ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Daiki ISONO

IPC: H01L23/00 ,  H01L25/075

Abstract: According to one embodiment, a method of mounting electronic components, includes placing a workpiece comprising an insulating substrate including a first surface, a circuit board including a terminal portion and a spacer, a sapphire substrate including a second surface and a wafer including the electronic components, bringing the pressure jig into contact with a part of the sapphire substrate to apply a load on a contact part between a part of an upper surface of the spacer and the second surface, pressing the sapphire substrate toward the circuit board with the pressure jig, to bring other part of the upper surface of the spacer into contact with the second surface and flatten the sapphire substrate.

公开(公告)号：US20220209081A1

公开(公告)日：2022-06-30

申请号：US17696927

申请日：2022-03-17

Applicant: Japan Display Inc.

Inventor： Hideaki ABE ,  Kazuyuki YAMADA ,  Keisuke ASADA ,  Kota UOGISHI ,  Kenichi TAKEMASA ,  Daiki ISONO

IPC: H01L33/60 ,  H01L33/62

Abstract: An LED module has a first layer including a first plane, an LED chip arranged on the first plane, a second layer surrounding the LED chip and including a convex part on the first plane, and a third layer arranged outside the LED chip and overlapping an upper surface of the first layer, a side surface of the second layer, and a part of the upper surface of the second layer. In the LED module, a height of the convex part of the second layer is lower than a height of the upper surface of the LED chip, and the first layer, the second layer and the third layer include conductive films.