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    Lamp with metal grid radiator for heat dissipation
    11.
    发明申请
    Lamp with metal grid radiator for heat dissipation 审中-公开
    带金属散热器的散热器用于散热

    公开(公告)号：US20050200262A1

    公开(公告)日：2005-09-15

    申请号：US10800207

    申请日：2004-03-15

    Applicant: Jiahn-Chang Wu

    Inventor： Jiahn-Chang Wu

    IPC: F21V9/00

    CPC classification number: F21V11/06 ,  F21V3/061 ,  F21V3/062 ,  F21V7/0008 ,  F21V29/773 ,  F21V29/83 ,  F21V29/89

    Abstract: A metal grid is placed in the open end of a cup-shaped light bulb as a radiator to dissipate the heat generated from the light emitting device. One or more light emitting devices can be placed on the inner side surface of the metal grid, and the light emitted from the light emitting devices is reflected by the inner surface of the cup and transmitted through the windows in the metal grid. The horizontal plates of the metal grid and the vertical walls of the grid can be insulated from each other to serve as electrodes for the light emitting device. The cup can be back-filled with glass or other transparent polymer composite to prevent dust from entering the cup. Alternatively, a single light emitting device is place near the bottom of the cup

    Abstract translation: 将金属格栅放置在杯形灯泡的开口端作为辐射器以散发从发光器件产生的热量。 一个或多个发光器件可以放置在金属栅格的内侧表面上，并且从发光器件发射的光被杯的内表面反射并且透过金属栅格中的窗口。 金属网格的水平板和栅格的垂直壁可以彼此绝缘以用作发光器件的电极。 杯子可以用玻璃或其他透明聚合物复合材料填充以防止灰尘进入杯子。 或者，在杯的底部附近放置单个发光装置

    Semiconductor matrix formation
    14.
    发明授权
    Semiconductor matrix formation 有权
    半导体矩阵形成

    公开(公告)号：US06277711B1

    公开(公告)日：2001-08-21

    申请号：US09756611

    申请日：2001-01-08

    Applicant: Jiahn-Chang Wu

    Inventor： Jiahn-Chang Wu

    IPC: H01L2146

    CPC classification number: H01L21/6835 ,  H01L24/83 ,  H01L2221/68354 ,  H01L2221/68363 ,  Y10S156/93 ,  Y10T29/49815 ,  Y10T29/49821 ,  Y10T29/49822 ,  Y10T29/49824 ,  Y10T29/53274 ,  Y10T156/11

    Abstract: Semiconductor dice from a scribed wafer are first separated by a stretched cloth. The dice on the stretchable cloth are then lined up with a target unit and transferred by pressure to a target unit to form a matrix. The pressure can be exerted by pressing individually the dice from the stretchable cloth to the target unit. Alternatively, the dice from the stretchable cloth can first be transferred to a transfer unit before being compressed to the target unit. The transfer unit may also be a perforated board to the hold the dice in place before the dice are soldered to the target unit.

    Abstract translation: 首先用拉伸的布将来自刻划的晶片的半导体晶片分开。 然后将可伸缩布上的骰子与目标单元排成一列，并通过压力转移到目标单元以形成矩阵。 可以通过将骰子从伸缩布单独地按压到目标单元来施加压力。 或者，来自可拉伸布的骰子可以在被压缩到目标单元之前首先被转移到转印单元。 转移单元也可以是穿孔板，以在将骰子焊接到目标单元之前将骰子保持在适当位置。

    LED package with top and bottom electrodes
    15.
    发明授权
    LED package with top and bottom electrodes 有权
    LED封装，顶部和底部电极

    公开(公告)号：US08247835B2

    公开(公告)日：2012-08-21

    申请号：US12554189

    申请日：2009-09-04

    Applicant: Jiahn-Chang Wu

    Inventor： Jiahn-Chang Wu

    IPC: H01L29/22 ,  H01L23/495

    CPC classification number: H01L33/62 ,  H01L33/52 ,  H01L2224/48091 ,  H01L2924/00014

    Abstract: An LED package with an extended top electrode and an extended bottom electrode is made from a single metal sheet, one manufacturing process embodiment includes: preparing a piece of single metal sheet, forming a first metal and a coplanar second metal, mounting an LED on an inner end of the first metal, wire-bonding top electrode to an inner end of the second metal, encapsulating at least the LED and the bonding wire with a protection glue, bending an outer end of the first metal upward twice 90 degrees to form a top flat as an extended top electrode of the package, and bending an outer end of the second metal downward twice 90 degrees to form a bottom flat as an extended bottom electrode of the package.

    Abstract translation: 具有扩展的顶部电极和延伸的底部电极的LED封装由单个金属片制成，一个制造工艺实施例包括：准备一片单一金属片，形成第一金属和共面第二金属，将LED安装在 将第一金属的内端，引线接合顶部电极连接到第二金属的内端，至少用保护胶封装LED和接合线，将第一金属的外端向上弯曲两次90度以形成 顶部平坦，作为包装的延伸顶部电极，并且将第二金属的外端向下弯曲两次90度，以形成作为包装的延伸底部电极的底部平面。

    Light emitting diode package with coaxial leads
    16.
    再颁专利
    Light emitting diode package with coaxial leads 有权
    带同轴引线的发光二极管封装

    公开(公告)号：USRE42179E1

    公开(公告)日：2011-03-01

    申请号：US11902931

    申请日：2007-09-26

    Applicant: Jiahn-Chang Wu

    Inventor： Jiahn-Chang Wu

    IPC: H01L33/00 ,  H01L27/15 ,  H01L31/12

    CPC classification number: H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    Abstract: The leads of a light emitting diode are made coaxial. The inner lead protrudes lower than the outer lead. The package is inserted into a spongy display panel for power supply. The display panel has three layers: a lower conducting layer for contacting said inner lead and a top conducting layer for contacting said outer layer, and an insulating layer between the top and the bottom layer. For LED with a bottom electrode and a top electrode, the LED can be mounted on the planar tops of the inner lead and the top electrode wire bonded to the outer lead, or the LED can be mounted on the side surface of the inner lead and the top electrode wire bonded to the outer lead. For LED with two bottom electrode, the LED electrodes can straddle over the planar tops of the inner lead and the outer lead, or the LED electrodes can straddle over the telescopic side surfaces of the two leads.

    Abstract translation: 发光二极管的引线是同轴的。 内引线比外引线突出。 将包装插入海绵状显示面板供电。 显示面板具有三层：用于接触所述内引线的下导电层和用于接触所述外层的顶导电层，以及顶层和底层之间的绝缘层。 对于具有底部电极和顶部电极的LED，LED可以安装在内部引线和连接到外部引线的顶部电极引线的平面顶部上，或者LED可以安装在内部引线的侧表面上， 顶部电极引线接合到外部引线。 对于具有两个底部电极的LED，LED电极可以跨越内部引线和外部引线的平面顶部，或者LED电极可跨越两个引线的伸缩侧表面。

    Light unit display
    17.
    发明授权
    Light unit display 有权
    灯单元显示

    公开(公告)号：US07798702B2

    公开(公告)日：2010-09-21

    申请号：US11893161

    申请日：2007-08-16

    Applicant: Jiahn-Chang Wu

    Inventor： Jiahn-Chang Wu

    IPC: H01L29/22

    CPC classification number: H01L33/62 ,  H01L33/483 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/12041 ,  H01L2924/00014

    Abstract: A light emitting device with a top electrode and a bottom electrode is pushed by a plug to make contacts with either an upper metal plate or a lower metal plate each serving as one of the leads for an electrode of the light emitting devices. The plug is inserted through an opening larger than the light emitting device in the metal plate not in contact with the light emitting device but serving as another lead for the light emitting device. The plug is locked in place by means of threaded screw heads, snug-fit, snap-on buttons or an elastic sleeve. Thus, the light emitting device can be easily replaced without any wire bonding. A plurality of the light unit can be sandwiched between the upper metal plate and the lower metal plate.

    Abstract translation: 具有顶部电极和底部电极的发光器件被插头推动以与用作发光器件的电极的引线之一的上金属板或下金属板接触。 插头插入大于不与发光器件接触的金属板中的发光器件的开口，但是用作发光器件的另一引线。 插头通过螺纹螺钉头，贴合，卡扣式按钮或弹性套筒锁定在适当的位置。 因此，可以容易地更换发光器件而没有任何引线接合。 多个光单元可夹在上金属板和下金属板之间。

    Replaceable light emitting diode module
    20.
    发明授权
    Replaceable light emitting diode module 有权
    可更换发光二极管模块

    公开(公告)号：US06998650B1

    公开(公告)日：2006-02-14

    申请号：US11082131

    申请日：2005-03-17

    Applicant: Jiahn-Chang Wu

    Inventor： Jiahn-Chang Wu

    IPC: H01L33/00 ,  H01L23/34

    CPC classification number: H01L33/483 ,  F21K9/00 ,  F21K9/20 ,  F21V19/001 ,  F21V19/004 ,  F21V19/04 ,  F21V19/042 ,  F21Y2115/10 ,  F21Y2115/30 ,  H01L24/72 ,  H01L33/62 ,  H01L2924/12041 ,  H01L2924/00

    Abstract: A clip is used to clamp a LED in place in a LED module. The clip has pliable conducting cover and can be latched to the upper lead metal of the LED module. The clip can be lifted for replacing a defective or color LED. A plurality of replaceable LEDs can be mounted a common metal substrate to form a display panel, and each LED can be clamped in position with clips straddling between parallel upper lead metal for electrical coupling to the top electrodes of the LED.

    Abstract translation: 一个夹子用于将LED固定在LED模块中。 夹子具有柔韧的导电盖，可以锁定到LED模块的上引线金属。 可以提起夹子以更换有缺陷或彩色LED。 可以将多个可更换的LED安装在共同的金属基板上以形成显示面板，并且每个LED可以被钳夹在适当的位置，夹子跨在平行的上引线金属之间，用于电耦合到LED的顶部电极。

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