摘要:
A nonvolatile memory including a plurality of memory transistors in series, wherein source/drain and channel regions therebetween are of a first type and a select transistor, at each end of the plurality of memory transistors in series, wherein channels regions of each of the select transistors is of the first type. The first type may be n-type or p-type. The nonvolatile memory may further include a first dummy select transistor at one end of the plurality of memory transistors in series between one of the select transistors and the plurality of memory transistors in series and a second dummy select transistor at the other end of the plurality of memory transistors in series between the other select transistor and the plurality of memory transistors in series.
摘要:
A nonvolatile memory device in which an electrically conductive "program assist plate" is formed over the nonvolatile memory cells. Appropriate voltages are applied to the program assist plate to greatly increase the cell coupling ratio, thereby reducing the program and erase voltages, and increasing the speed of operation. The manufacturing process is simple, and it results in a more planar structure which facilitates subsequent manufacturing processes.
摘要:
An integrated circuit memory device includes a plurality of wordlines, a plurality of program inhibition lines, a plurality of serially connected memory cell transistors, and a plurality of program inhibition capacitors. Each of the memory cell transistors includes a gate connected to a respective one of the wordlines. Each of the program inhibition capacitors has a first terminal connected to a source/drain of a respective one of the memory cell transistors, and a second terminal connected to a respective one of the program inhibition lines. Related methods are also disclosed.
摘要:
A semiconductor device includes a substrate having a logic device region including logic devices thereon, and an input/output (I/O) device region including I/O devices thereon adjacent the logic device region. A first fin field-effect transistor (FinFET) on the logic device region includes a first semiconductor fin protruding from the substrate, and a triple-gate structure having a first gate dielectric layer and a first gate electrode thereon. A second FinFET on the I/O device region includes a second semiconductor fin protruding from the substrate, and a double-gate structure having a second gate dielectric layer and a second gate electrode thereon. The first and second gate dielectric layers have different thicknesses. Related devices and fabrication methods are also discussed.
摘要:
A nonvolatile memory including a plurality of memory transistors in series, wherein source/drain and channel regions therebetween are of a first type and a select transistor, at each end of the plurality of memory transistors in series, wherein channels regions of each of the select transistors is of the first type. The first type may be n-type or p-type. The nonvolatile memory may further include a first dummy select transistor at one end of the plurality of memory transistors in series between one of the select transistors and the plurality of memory transistors in series and a second dummy select transistor at the other end of the plurality of memory transistors in series between the other select transistor and the plurality of memory transistors in series.
摘要:
A method of fabricating a semiconductor device, in which an interference effect between word lines is substantially reduced or eliminated, includes forming a plurality of gate patterns on a substrate; forming a first insulating layer between the gate patterns, the first insulating layer filling a region between the gate patterns; etching the first insulating layer to remove a portion of the first insulating layer to a predetermined depth; and forming a second insulating layer on the gate patterns and the first insulating layer. A low-dielectric-constant material is formed between the gate patterns.
摘要:
A memory device includes a substrate, a semiconductor column extending perpendicularly from the substrate and a plurality of spaced-apart charge storage cells disposed along a sidewall of the semiconductor column. Each of the storage cells includes a tunneling insulating layer disposed on the sidewall of the semiconductor column, a polymer layer disposed on the tunneling insulating layer, a plurality of quantum dots disposed on or in the polymer layer and a blocking insulating layer disposed on the polymer layer.
摘要:
A nonvolatile memory including a plurality of memory transistors in series, wherein source/drain and channel regions therebetween are of a first type and a select transistor, at each end of the plurality of memory transistors in series, wherein channels regions of each of the select transistors is of the first type. The first type may be n-type or p-type. The nonvolatile memory may further include a first dummy select transistor at one end of the plurality of memory transistors in series between one of the select transistors and the plurality of memory transistors in series and a second dummy select transistor at the other end of the plurality of memory transistors in series between the other select transistor and the plurality of memory transistors in series.
摘要:
A nonvolatile memory device in which an electrically conductive "program assist plate" is formed over the nonvolatile memory cells. Appropriate voltages are applied to the program assist plate to greatly increase the cell coupling ratio, thereby reducing the program and erase voltages, and increasing the speed of operation. The manufacturing process is simple, and it results in a more planar structure which facilitates subsequent manufacturing processes.
摘要:
Integrated circuit memory devices having reduced susceptibility to inadvertent programming and erasure include an array of memory cells arranged as a plurality of NAND strings of EEPROM cells which share common control lines (e.g., SSL1, SSL2) and word lines (e.g., WL1-WLn). These NAND strings preferably comprise a linear array or chain of EEPROM cells having first and second ends and first and second select transistors (ST1, ST2) coupled (directly or indirectly) to (he first and second ends, respectively. To provide improved program and erase capability, a pair of NAND strings are provided in antiparallel and share a common bit line. However, the pair of NAND strings are formed in respective nonoverlapping well regions in a substrate so that the channel regions of the EEPROM cells in respective NAND strings can be individually controlled (e.g., raised) to prevent inadvertent programming or erasing when cells in adjacent strings are being programmed or erased, respectively.