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21 条记录 (耗时 0.022 秒)

    Resin package fabrication process
    11.
    发明授权
    Resin package fabrication process 失效
    树脂包装制造工艺

    公开(公告)号：US06282781B1

    公开(公告)日：2001-09-04

    申请号：US09212863

    申请日：1998-12-17

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    IPC分类号： H05K332

    CPC分类号： H01L21/50 ,  H01L21/4803 ,  H01L23/10 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/16195 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T29/53174 ,  H01L2224/81

    摘要： A resin package fabrication processes comprises three steps. At the first step, a thermosetting resin-containing resin substrate is machined. At the second step carried out after the first step, the resin substrate is heated to an original glass transition temperature that the resin substrate has or a temperature that is higher than the glass transition temperature so that the glass transition temperature that the resin substrate has is elevated to a new glass transition temperature. At the third step, a resin layer is placed on at least a portion of the resin substrate to which the new glass transition temperature is imparted, and the resin substrate with the resin layer placed on that portion is then heated to the original glass transition temperature or a temperature between the original glass transition temperature and the new glass transition temperature, thereby fixing the resin layer to the resin substrate.

    摘要翻译： 树脂封装制造工艺包括三个步骤。 在第一步骤中，加工含热固性树脂的树脂基材。 在第一步骤后进行的第二步骤中，将树脂基板加热到树脂基板具有的原始玻璃化转变温度或高于玻璃化转变温度的温度，使得树脂基板具有的玻璃化转变温度为 升高到新的玻璃化转变温度。 在第三步骤中，将树脂层放置在施加新玻璃化转变温度的树脂基板的至少一部分上，然后将树脂层放置在该部分上的树脂基板加热到原始玻璃化转变温度 或原玻璃化转变温度与新玻璃化转变温度之间的温度，从而将树脂层固定在树脂基板上。

    Face-down mounted surface acoustic wave device
    12.
    发明授权
    Face-down mounted surface acoustic wave device 失效
    面朝下安装的声表面波装置

    公开(公告)号：US06181015B2

    公开(公告)日：2001-01-30

    申请号：US09255018

    申请日：1999-02-22

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Hajime Kuwajima

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Hajime Kuwajima

    IPC分类号： H01L2348

    CPC分类号： H03H9/1085 ,  H01L23/3135 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/19041 ,  H03H9/059 ,  H03H9/1092

    摘要： In a chip device in which not only an electrode pattern 25 is provided on a main mounting surface 21a of a base 21 but also bump electrodes 22 are provided as external electrodes for face-down mounting, an electrically insulating layer 31 is provided to be put on at least a part of the main mounting surface 21a so as to remain edge portions which do not cover at least a part of the electrode pattern 25, and a protection layer 32 for protecting the main mounting surface is further provided at a distance from the main mounting surface 21a so as to be put on the electrically insulating layer 31, so that the bump electrodes 22 are connected to the electrode pattern 25 while being in contact with the edge portions of the electrically insulating layer 31 and the protection layer 32.

    摘要翻译： 在其中不仅在基座21的主安装表面21a上设置电极图案25，而且还设置凸起电极22作为面向下安装的外部电极的芯片装置中，提供电绝缘层31以放置 在主安装表面21a的至少一部分上，以便保留不覆盖电极图案25的至少一部分的边缘部分，并且还保护主安装表面的保护层32距离 主安装表面21a，以便放置在电绝缘层31上，使得凸起电极22在与电绝缘层31和保护层32的边缘部分接触的同时与电极图案25连接。

    Electronic part and manufacturing method therefor
    13.
    发明授权
    Electronic part and manufacturing method therefor 失效
    电子零件及其制造方法

    公开(公告)号：US06320739B1

    公开(公告)日：2001-11-20

    申请号：US09292735

    申请日：1999-04-16

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    IPC分类号： H05K118

    CPC分类号： H01L21/50 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00

    摘要： An electronic part in which a chip 2 having bump electrodes is sealed in a cavity 14 of a resin container 10, wherein the resin container having: a mounting board 1 having a conductor pattern 4 for bump-mounting the chip 2; an intermediate board 5 overlaid on the mounting board 1 and having a window for forming an inner wall apart from the chip 2 for predetermined distances; a cover board overlaid on the intermediate board 5 to cover the window; a first adhesive layer 8 which is interposed between overlaid portions of the mounting board 1 and the intermediate board 5; and a second adhesive layer 9 which is interposed between overlaid portion of the intermediate board 5 and the cover board 7, wherein the first and second adhesive layers 8 and 9 between which the intermediate board 5 is interposed are heated and pressed at a time in a direction of the thickness of each of the mounting board 1 and the cover board 7, and the mounting board 1, the intermediate board 5 and the cover board 7 are brought into intimate contact with one another so as to seal and form the cavity 14 defined by the inner wall of the window.

    摘要翻译： 其中具有凸起电极的芯片2被密封在树脂容器10的空腔14中的电子部件，其中树脂容器具有：安装板1，具有用于凸块安装芯片2的导体图案4; 覆盖在安装板1上并具有用于形成与芯片2隔开预定距离的内壁的窗口的中间板5; 覆盖在中间板5上以覆盖窗户的盖板; 介于安装板1和中间板5的重叠部分之间的第一粘合剂层8; 以及介于中间板5的重叠部分和盖板7之间的第二粘合剂层9，其中插入有中间板5的第一和第二粘合剂层8和9一次加热并按压 安装板1和盖板7以及安装板1，中间板5和盖板7的厚度方向彼此紧密接触，以便密封和形成限定的空腔14 由窗户的内壁。

    Production method of electronic parts and water treatment apparatus
    15.
    发明授权
    Production method of electronic parts and water treatment apparatus 失效
    电子零件和水处理设备的生产方法

    公开(公告)号：US06749183B2

    公开(公告)日：2004-06-15

    申请号：US10238868

    申请日：2002-09-11

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    IPC分类号： B01F304

    CPC分类号： C01B5/00 ,  C02F1/20 ,  C02F2103/12 ,  Y10S134/902

    摘要： A water treatment apparatus including a mixing bath having an open portion where a carbonic acid gas intermixed with water to be treated by the water treatment apparatus and dissolved oxygen excluded from the water to be treated are discharged. The water treatment apparatus also includes water storage tank separate from the mixing bath and in which treated water from the mixing bath is stored.

    摘要翻译： 一种水处理装置，其包括具有开放部分的混合浴，其中与被处理水处理的水和待处理的水排除的溶解氧混合的碳酸气体被排出。 水处理装置还包括与混合槽分离的储水箱，其中储存来自混合槽的处理水。

    Production method of electronic parts and water treatment apparatus
    17.
    发明授权
    Production method of electronic parts and water treatment apparatus 失效
    电子零件和水处理设备的生产方法

    公开(公告)号：US06471783B1

    公开(公告)日：2002-10-29

    申请号：US09314117

    申请日：1999-05-19

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    IPC分类号： B08B304

    CPC分类号： C01B5/00 ,  C02F1/20 ,  C02F2103/12 ,  Y10S134/902

    摘要： A production method of an electronic part comprising a step o working a substrate having formed thereon a metal thin-film conductor using water, wherein said water satisfies the relations 3.5≦pH≦6.5 and DO≦0.5 pH2−6.5 pH+22 [wherein DO represents a dissolved oxygen amount (unit ppm)]. By using the water in the case of working substrates in the production steps of electronic parts, the generations of the static electricity and the oxidation caused by water used for working are restrained. The present invention is particularly effective in working of an electronic part wherein a metal thin-film conductor containing at least two kinds of metals including Al on a substrate having a pyroelectric property.

    摘要翻译： 一种电子部件的制造方法，包括使用水在其上形成有金属薄膜导体的基板的工序，其中，所述水满足关系3.5 <= pH <= 6.5且DO <= 0.5 pH2-6.5 pH + 22 [其中DO表示溶解氧量（单位ppm）]，通过在电子零件的制造工序中使用工作基板的情况下的水，能够抑制由用于工作的水造成的静电和氧化。 本发明在电子部件的工作中特别有效，其中在具有热电性质的基板上含有包含Al的至少两种金属的金属薄膜导体。

    Acoustic wave device face-down mounted on a substrate
    18.
    发明授权
    Acoustic wave device face-down mounted on a substrate 失效
    声波装置面朝下安装在基板上

    公开(公告)号：US06417026B2

    公开(公告)日：2002-07-09

    申请号：US09754327

    申请日：2001-01-05

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Hajime Kuwajima

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Hajime Kuwajima

    IPC分类号： H01L2148

    CPC分类号： H03H9/1085 ,  H01L23/3135 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/19041 ,  H03H9/059 ,  H03H9/1092

    摘要： In a chip device in which not only an electrode pattern 25 is provided on a main mounting surface 21a of a base 21 but also bump electrodes 22 are provided as external electrodes for face-down mounting, an electrically insulating layer 31 is provided to be put on at least a part of the main mounting surface 21a so as to remain edge portions which do not cover at least a part of the electrode pattern 25, and a protection layer 32 for protecting the main mounting surface is further provided at a distance from the main mounting surface 21a so as to be put on the electrically insulating layer 31, so that the bump electrodes 22 are connected to the electrode pattern 25 while being in contact with the edge portions of the electrically insulating layer 31 and the protection layer 32.

    摘要翻译： 在其中不仅在基座21的主安装表面21a上设置电极图案25，而且还设置凸起电极22作为面向下安装的外部电极的芯片装置中，提供电绝缘层31以放置 在主安装表面21a的至少一部分上，以便保留不覆盖电极图案25的至少一部分的边缘部分，并且还保护主安装表面的保护层32距离 主安装表面21a，以便放置在电绝缘层31上，使得凸起电极22在与电绝缘层31和保护层32的边缘部分接触的同时与电极图案25连接。

    Encapsulated surface mounting electronic part
    20.
    发明授权
    Encapsulated surface mounting electronic part 失效
    封装表面安装电子部件

    公开(公告)号：US06281436B1

    公开(公告)日：2001-08-28

    申请号：US09499299

    申请日：2000-02-07

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Shuichiro Yamamoto

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Shuichiro Yamamoto

    IPC分类号： H05K506

    CPC分类号： H05K3/403 ,  H01L23/10 ,  H01L23/49805 ,  H01L23/49827 ,  H01L2224/16 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/3025 ,  H03H9/1071 ,  H05K3/0052 ,  H05K3/244 ,  H05K3/284 ,  H05K3/3442 ,  H05K3/42 ,  H05K2201/09181 ,  H05K2201/10727 ,  H05K2203/0723 ,  H01L2224/0401

    摘要： An electronic element is mounted on a resin wiring substrate and a cover member is bonded to the wiring substrate so as to cover the electronic element and constitute an encapsulation region. The encapsulation region houses the electronic element and has a cavity inside. A side electrode is formed of an electronically conductive through groove provided in a cover-member-bonding surface on the wiring substrate. A plating layer inside the electrically conductive through groove includes at least two metal layers including an Au plating layer and a Cu plating layer. The plating layer has conductors connected to circumferential peripheries of the electrically conductive through groove on upper and lower surfaces of the wiring substrate. Only the Cu plating layer is formed on the conductor on the upper surface of the wiring substrate to improve the reliability of bonding. The reliability of bonding of the resin wiring substrate and cover member which constitute the encapsulation region is improved, and therefore the reliability of the air-tight seal of the cavity inside the encapsulation region is improved.

    摘要翻译： 电子元件安装在树脂布线基板上，并且盖构件被接合到布线基板以覆盖电子元件并构成封装区域。 封装区域容纳电子元件并且在其内部具有空腔。 侧面电极由配置在配线基板的盖部件接合面上的电子导电贯通槽形成。 导电通槽内的镀层包括至少两个包括Au镀层和Cu镀层的金属层。 电镀层具有连接到布线基板的上表面和下表面上的导电通孔的周向周边的导体。 在布线基板的上表面的导体上仅形成Cu镀层，以提高接合的可靠性。 提高了构成封装区域的树脂布线基板和盖部件的接合的可靠性，因此提高了封装区域内的空腔密封性的可靠性。