利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

21 条记录 (耗时 0.018 秒)

    Face-down mounted surface acoustic wave device
    1.
    发明授权
    Face-down mounted surface acoustic wave device 失效
    面朝下安装的声表面波装置

    公开(公告)号：US06181015B2

    公开(公告)日：2001-01-30

    申请号：US09255018

    申请日：1999-02-22

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Hajime Kuwajima

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Hajime Kuwajima

    IPC分类号： H01L2348

    CPC分类号： H03H9/1085 ,  H01L23/3135 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/19041 ,  H03H9/059 ,  H03H9/1092

    摘要： In a chip device in which not only an electrode pattern 25 is provided on a main mounting surface 21a of a base 21 but also bump electrodes 22 are provided as external electrodes for face-down mounting, an electrically insulating layer 31 is provided to be put on at least a part of the main mounting surface 21a so as to remain edge portions which do not cover at least a part of the electrode pattern 25, and a protection layer 32 for protecting the main mounting surface is further provided at a distance from the main mounting surface 21a so as to be put on the electrically insulating layer 31, so that the bump electrodes 22 are connected to the electrode pattern 25 while being in contact with the edge portions of the electrically insulating layer 31 and the protection layer 32.

    摘要翻译： 在其中不仅在基座21的主安装表面21a上设置电极图案25，而且还设置凸起电极22作为面向下安装的外部电极的芯片装置中，提供电绝缘层31以放置 在主安装表面21a的至少一部分上，以便保留不覆盖电极图案25的至少一部分的边缘部分，并且还保护主安装表面的保护层32距离 主安装表面21a，以便放置在电绝缘层31上，使得凸起电极22在与电绝缘层31和保护层32的边缘部分接触的同时与电极图案25连接。

    Acoustic wave device face-down mounted on a substrate
    2.
    发明授权
    Acoustic wave device face-down mounted on a substrate 失效
    声波装置面朝下安装在基板上

    公开(公告)号：US06417026B2

    公开(公告)日：2002-07-09

    申请号：US09754327

    申请日：2001-01-05

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Hajime Kuwajima

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Hajime Kuwajima

    IPC分类号： H01L2148

    CPC分类号： H03H9/1085 ,  H01L23/3135 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/09701 ,  H01L2924/19041 ,  H03H9/059 ,  H03H9/1092

    摘要： In a chip device in which not only an electrode pattern 25 is provided on a main mounting surface 21a of a base 21 but also bump electrodes 22 are provided as external electrodes for face-down mounting, an electrically insulating layer 31 is provided to be put on at least a part of the main mounting surface 21a so as to remain edge portions which do not cover at least a part of the electrode pattern 25, and a protection layer 32 for protecting the main mounting surface is further provided at a distance from the main mounting surface 21a so as to be put on the electrically insulating layer 31, so that the bump electrodes 22 are connected to the electrode pattern 25 while being in contact with the edge portions of the electrically insulating layer 31 and the protection layer 32.

    摘要翻译： 在其中不仅在基座21的主安装表面21a上设置电极图案25，而且还设置凸起电极22作为面向下安装的外部电极的芯片装置中，提供电绝缘层31以放置 在主安装表面21a的至少一部分上，以便保留不覆盖电极图案25的至少一部分的边缘部分，并且还保护主安装表面的保护层32距离 主安装表面21a，以便放置在电绝缘层31上，使得凸起电极22在与电绝缘层31和保护层32的边缘部分接触的同时与电极图案25连接。

    Wiring board and process for the production thereof
    5.
    发明授权
    Wiring board and process for the production thereof 失效
    接线板及其生产工艺

    公开(公告)号：US06204454B1

    公开(公告)日：2001-03-20

    申请号：US09221124

    申请日：1998-12-28

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    IPC分类号： H05K322

    CPC分类号： H01L23/10 ,  H01L23/5383 ,  H01L23/5385 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/16315 ,  H05K1/111 ,  H05K3/062 ,  H05K3/243 ,  H05K3/28 ,  H05K3/383 ,  H05K2201/0989 ,  H05K2203/0307 ,  Y10T29/49155 ,  Y10T428/24917

    摘要： A wiring board having a conductor layer formed on a substrate and a connecting pad disposed in a connecting pad disposition portion provided in part of the conductor layer surface, the conductor layer having a resin inflow prevention portion which is provided adjacently to the said connecting pad disposition portion and which has a surface roughness greater than the surface roughness of the said connecting pad disposition portion, the resin inflow prevention portion being capable of overcoming the problem of prior art that an adhesive resin (resin layer) of a prepreg or an adhesive flows out onto the upper surface of the pad, due to its softening under heat and its being pressurized for bonding when a structure member such as a cover layer is bonded to the wiring board, and forms a cured resin which extremely inhibits the bonding property of a chip element onto the pad.

    摘要翻译： 一种布线板，其具有形成在基板上的导体层和布置在设置在所述导体层表面的一部分中的连接焊盘布置部分中的连接焊盘，所述导体层具有邻近所述连接焊盘布置设置的树脂流入防止部分 并且其表面粗糙度大于所述连接垫布置部分的表面粗糙度，树脂流入防止部分能够克服现有技术的问题，即预浸料或粘合剂的粘合树脂（树脂层）流出 由于其在加热时软化，并且当诸如覆盖层的结构构件结合到布线板上时，其被加压以进行接合，并且形成极其抑制芯片的接合性能的固化树脂 元素到垫上。

    Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same
    6.
    发明授权
    Method of manufacturing a substrate having electrode arcs for connecting to surface-mounted electronic parts and substrate manufactured by same 失效
    制造具有用于连接到由表面安装的电子部件和由其制造的基板的电极弧的基板的方法

    公开(公告)号：US06263565B1

    公开(公告)日：2001-07-24

    申请号：US09103392

    申请日：1998-06-24

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto ,  Kenji Honda

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto ,  Kenji Honda

    IPC分类号： H01K310

    CPC分类号： H05K3/403 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/42 ,  H05K2201/09181 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49789 ,  Y10T29/49792

    摘要： A through hole 5 formed in a substrate and having an electrode film on an inner surface thereof is cut and divided into two through holes or blind holes each of substantially semicircular arc shape through dicing processing using a rotating blade, and one of the-divided through holes 5 of substantially semicircular arc shape is used as an external connection terminal 3 of substantially semicircular concave arc shape thereby to form a surface mounted electronic parts having a plurality of the external connection terminals 3. The height H of the substantially semicircular arc formed at an inner surface of each of the external connection terminals is set to be equal to or smaller than a value obtained by subtracting twice a thickness t of the electrode film from a radius R of a curvature of the arc.

    摘要翻译： 形成在基板中并且在其内表面上具有电极膜的通孔5通过使用旋转叶片的切割处理被分割成基本上半圆弧形的两个通孔或盲孔，并且其中一个分割通孔 使用大致半圆弧形的孔5作为大致半圆形的凹弧形状的外部连接端子3，从而形成具有多个外部连接端子3的表面安装的电子部件。大致半圆弧的高度H形成在 每个外部连接端子的内表面被设定为等于或小于从电弧曲率的半径R减去电极膜的厚度t的两倍所获得的值。

    Resin package fabrication process
    7.
    发明授权
    Resin package fabrication process 失效
    树脂包装制造工艺

    公开(公告)号：US06282781B1

    公开(公告)日：2001-09-04

    申请号：US09212863

    申请日：1998-12-17

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    IPC分类号： H05K332

    CPC分类号： H01L21/50 ,  H01L21/4803 ,  H01L23/10 ,  H01L24/97 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01065 ,  H01L2924/01073 ,  H01L2924/16195 ,  H01L2924/3511 ,  Y10T29/4913 ,  Y10T29/49146 ,  Y10T29/49147 ,  Y10T29/49158 ,  Y10T29/53174 ,  H01L2224/81

    摘要： A resin package fabrication processes comprises three steps. At the first step, a thermosetting resin-containing resin substrate is machined. At the second step carried out after the first step, the resin substrate is heated to an original glass transition temperature that the resin substrate has or a temperature that is higher than the glass transition temperature so that the glass transition temperature that the resin substrate has is elevated to a new glass transition temperature. At the third step, a resin layer is placed on at least a portion of the resin substrate to which the new glass transition temperature is imparted, and the resin substrate with the resin layer placed on that portion is then heated to the original glass transition temperature or a temperature between the original glass transition temperature and the new glass transition temperature, thereby fixing the resin layer to the resin substrate.

    摘要翻译： 树脂封装制造工艺包括三个步骤。 在第一步骤中，加工含热固性树脂的树脂基材。 在第一步骤后进行的第二步骤中，将树脂基板加热到树脂基板具有的原始玻璃化转变温度或高于玻璃化转变温度的温度，使得树脂基板具有的玻璃化转变温度为 升高到新的玻璃化转变温度。 在第三步骤中，将树脂层放置在施加新玻璃化转变温度的树脂基板的至少一部分上，然后将树脂层放置在该部分上的树脂基板加热到原始玻璃化转变温度 或原玻璃化转变温度与新玻璃化转变温度之间的温度，从而将树脂层固定在树脂基板上。

    Electronic part and manufacturing method therefor
    8.
    发明授权
    Electronic part and manufacturing method therefor 失效
    电子零件及其制造方法

    公开(公告)号：US06320739B1

    公开(公告)日：2001-11-20

    申请号：US09292735

    申请日：1999-04-16

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    IPC分类号： H05K118

    CPC分类号： H01L21/50 ,  H01L24/97 ,  H01L2224/16225 ,  H01L2224/97 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/16195 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H01L2924/351 ,  H01L2224/81 ,  H01L2924/00

    摘要： An electronic part in which a chip 2 having bump electrodes is sealed in a cavity 14 of a resin container 10, wherein the resin container having: a mounting board 1 having a conductor pattern 4 for bump-mounting the chip 2; an intermediate board 5 overlaid on the mounting board 1 and having a window for forming an inner wall apart from the chip 2 for predetermined distances; a cover board overlaid on the intermediate board 5 to cover the window; a first adhesive layer 8 which is interposed between overlaid portions of the mounting board 1 and the intermediate board 5; and a second adhesive layer 9 which is interposed between overlaid portion of the intermediate board 5 and the cover board 7, wherein the first and second adhesive layers 8 and 9 between which the intermediate board 5 is interposed are heated and pressed at a time in a direction of the thickness of each of the mounting board 1 and the cover board 7, and the mounting board 1, the intermediate board 5 and the cover board 7 are brought into intimate contact with one another so as to seal and form the cavity 14 defined by the inner wall of the window.

    摘要翻译： 其中具有凸起电极的芯片2被密封在树脂容器10的空腔14中的电子部件，其中树脂容器具有：安装板1，具有用于凸块安装芯片2的导体图案4; 覆盖在安装板1上并具有用于形成与芯片2隔开预定距离的内壁的窗口的中间板5; 覆盖在中间板5上以覆盖窗户的盖板; 介于安装板1和中间板5的重叠部分之间的第一粘合剂层8; 以及介于中间板5的重叠部分和盖板7之间的第二粘合剂层9，其中插入有中间板5的第一和第二粘合剂层8和9一次加热并按压 安装板1和盖板7以及安装板1，中间板5和盖板7的厚度方向彼此紧密接触，以便密封和形成限定的空腔14 由窗户的内壁。

    Production method of electronic parts and water treatment apparatus
    10.
    发明授权
    Production method of electronic parts and water treatment apparatus 失效
    电子零件和水处理设备的生产方法

    公开(公告)号：US06749183B2

    公开(公告)日：2004-06-15

    申请号：US10238868

    申请日：2002-09-11

    申请人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    发明人： Masashi Gotoh ,  Jitsuo Kanazawa ,  Syuichiro Yamamoto

    IPC分类号： B01F304

    CPC分类号： C01B5/00 ,  C02F1/20 ,  C02F2103/12 ,  Y10S134/902

    摘要： A water treatment apparatus including a mixing bath having an open portion where a carbonic acid gas intermixed with water to be treated by the water treatment apparatus and dissolved oxygen excluded from the water to be treated are discharged. The water treatment apparatus also includes water storage tank separate from the mixing bath and in which treated water from the mixing bath is stored.

    摘要翻译： 一种水处理装置，其包括具有开放部分的混合浴，其中与被处理水处理的水和待处理的水排除的溶解氧混合的碳酸气体被排出。 水处理装置还包括与混合槽分离的储水箱，其中储存来自混合槽的处理水。