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公开(公告)号:US12190498B2
公开(公告)日:2025-01-07
申请号:US18072605
申请日:2022-11-30
Applicant: KLA Corporation
Inventor: Nurmohammed Patwary , James A. Smith , Heonju Shin , Jusang Maeng , Kenong Wu , Xiaochun Li , Hucheng Lee
Abstract: Systems and methods for detecting defects on a reticle are provided. One system is configured for generating different stacked difference images for multiple instances of first patterned areas in different rows on a wafer based on images generated for the first patterned areas in the different rows. The system is also configured for performing double detection based on the different stacked difference images. The system then identifies defects on the reticle based on the defects detected by the double detection. As described further herein, the systems and methods detect defects from multiple reticle rows printed on a wafer, which can reduce noise and enable detection of substantially small repeater defects. The embodiments are particularly useful for high sensitivity repeater defect detection for extreme ultraviolet (EUV) reticles and multi-die reticles (MDR).
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公开(公告)号:US20240177294A1
公开(公告)日:2024-05-30
申请号:US18072605
申请日:2022-11-30
Applicant: KLA Corporation
Inventor: Nurmohammed Patwary , James A. Smith , Heonju Shin , Jusang Maeng , Kenong Wu , Xiaochun Li , Hucheng Lee
CPC classification number: G06T7/001 , G06T5/50 , G06V10/761 , G06T2207/20221 , G06T2207/20224 , G06T2207/30148
Abstract: Systems and methods for detecting defects on a reticle are provided. One system is configured for generating different stacked difference images for multiple instances of first patterned areas in different rows on a wafer based on images generated for the first patterned areas in the different rows. The system is also configured for performing double detection based on the different stacked difference images. The system then identifies defects on the reticle based on the defects detected by the double detection. As described further herein, the systems and methods detect defects from multiple reticle rows printed on a wafer, which can reduce noise and enable detection of substantially small repeater defects. The embodiments are particularly useful for high sensitivity repeater defect detection for extreme ultraviolet (EUV) reticles and multi-die reticles (MDR).
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公开(公告)号:US11803960B2
公开(公告)日:2023-10-31
申请号:US17355126
申请日:2021-06-22
Applicant: KLA Corporation
Inventor: Huan Jin , Xiaochun Li , Sangbong Park , Zhifeng Huang
CPC classification number: G06T7/001 , H01L22/12 , G06T2207/30148 , G06T2207/30168
Abstract: Global and local alignment energies are used in an image contrast metric. The image contrast metric can be used to find optical targets. Some pixels from a gradient magnitude image and a context range image from an optical image can be used to determine the image contrast metric. A heatmap from the image contrast metrics across part of a wafer can then be used to make a list of targets. Upper and lower confidence values can be applied to rank the available targets.
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公开(公告)号:US11783470B2
公开(公告)日:2023-10-10
申请号:US17722710
申请日:2022-04-18
Applicant: KLA CORPORATION
Inventor: Junqing Huang , Hucheng Lee , Sangbong Park , Xiaochun Li
CPC classification number: G06T7/0006 , G01N21/9501 , G01N21/956 , G06T7/11 , H10B12/01 , H10B41/27 , H10B43/27 , G06T2207/30148
Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.
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公开(公告)号:US11748872B2
公开(公告)日:2023-09-05
申请号:US17165826
申请日:2021-02-02
Applicant: KLA Corporation
Inventor: Hong Chen , Bjorn Brauer , Abdurrahman Sezginer , Sangbong Park , Ge Cong , Xiaochun Li
CPC classification number: G06T7/001 , G01N21/8806 , G01N21/8851 , G06T3/4007 , G01N2021/8861 , G01N2021/8887 , G06T2207/30148
Abstract: Methods and systems for setting up inspection of a specimen are provided. One system includes one or more computer subsystems configured for acquiring a reference image for a specimen and modifying the reference image to fit the reference image to a design grid thereby generating a golden grid image. The one or more computer subsystems are also configured for storing the golden grid image for use in inspection of the specimen. The inspection includes aligning a test image of the specimen generated from output of an inspection subsystem to the golden grid image.
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公开(公告)号:US20220067898A1
公开(公告)日:2022-03-03
申请号:US17165826
申请日:2021-02-02
Applicant: KLA Corporation
Inventor: Hong Chen , Bjorn Brauer , Abdurrahman Sezginer , Sangbong Park , Ge Cong , Xiaochun Li
Abstract: Methods and systems for setting up inspection of a specimen are provided. One system includes one or more computer subsystems configured for acquiring a reference image for a specimen and modifying the reference image to fit the reference image to a design grid thereby generating a golden grid image. The one or more computer subsystems are also configured for storing the golden grid image for use in inspection of the specimen. The inspection includes aligning a test image of the specimen generated from output of an inspection subsystem to the golden grid image.
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17.
公开(公告)号:US20210090229A1
公开(公告)日:2021-03-25
申请号:US17013264
申请日:2020-09-04
Applicant: KLA Corporation
Inventor: Bjorn Brauer , Nurmohammed Patwary , Sangbong Park , Xiaochun Li
Abstract: An optical characterization system and a method of using the same are disclosed. The system comprises a controller configured to be communicatively coupled with one or more detectors configured to receive illumination from a sample and generate image data. One or more processors may be configured to receive images of dies on the sample, calculate dissimilarity values for all combinations of the images, perform a cluster analysis to partition the combinations of the images into two or more clusters, generate a reference image for a cluster of the two or more clusters using two or more of the combinations of the images in the cluster; and detect one or more defects on the sample by comparing a test image in the cluster to the reference image for the cluster.
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公开(公告)号:US20210049755A1
公开(公告)日:2021-02-18
申请号:US16542376
申请日:2019-08-16
Applicant: KLA CORPORATION
Inventor: Junqing Huang , Hucheng Lee , Sangbong Park , Xiaochun Li
IPC: G06T7/00 , H01L27/108 , H01L27/11556 , H01L27/11582 , G06T7/11 , G01N21/95 , G01N21/956
Abstract: With the disclosed systems and methods for DRAM and 3D NAND inspection, an image of the wafer is received based on the output for an inspection tool. Geometric measurements of a design of a plurality of memory devices on the wafer are received. A care area with higher inspection sensitivity is determined based on the geometric measurements.
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公开(公告)号:US12190500B2
公开(公告)日:2025-01-07
申请号:US18178519
申请日:2023-03-05
Applicant: KLA Corporation
Inventor: Chunwei Song , Siqing Nie , Weifeng Zhou , Xiaochun Li , Sangbong Park
Abstract: Methods and systems for detecting defects on a specimen are provided. One system computes different candidate reference images from different combinations of images of the specimen generated by an inspection subsystem and combines different portions of the candidate reference images without modification to thereby generate a final reference image. The final reference image is then used for defect detection, which may be single or double detection. The embodiments are particularly useful for defect detection in areas of specimens including only non-resolvable, repeating device patterns, like cell regions, but may be used for inspection of other types of areas as well.
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20.
公开(公告)号:US11431976B2
公开(公告)日:2022-08-30
申请号:US16744301
申请日:2020-01-16
Applicant: KLA Corporation
Inventor: Nurmohammed Patwary , Richard Wallingford , James A. Smith , Xiaochun Li , Vladimir Tumakov , Bjorn Brauer
IPC: G06K9/00 , H04N19/126 , H04N19/60 , G01N21/95
Abstract: A sample characterization system is disclosed. In embodiments, the sample characterization system includes a controller communicatively coupled to an inspection sub-system, the controller including one or more processors configured to execute a set of program instructions stored in memory, the set of program instructions configured to cause the one or more processors to: acquire one or more target image frames of a sample; generate a target tensor with the one or more acquired target image frames; perform a first set of one or more decomposition processes on the target tensor to generate one or more reference tensors including one or more reference image frames; identify one or more differences between the one or more target image frames and the one or more reference image frames; and determine one or more characteristics of the sample based on the one or more identified differences.
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