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公开(公告)号：US20240136123A1
公开(公告)日：2024-04-25
申请号：US18489039
申请日：2023-10-17
Applicant: KYOCERA AVX Components Corporation
Inventor： Ronald S. Demcko , Cory Nelson , Marianne Berolini , Jeff Borgman
CPC classification number: H01G4/33 , H01G4/1254 , H01G4/252 , H05K1/162 , H05K2201/09554
Abstract: A single layer capacitor can include a substrate having a first surface and a second surface opposite the first surface. A resistive layer can be formed over at least a portion of the first surface of the substrate. A first conductive layer can be formed over at least a portion of the resistive layer. A second conductive layer can be formed over at least a portion of the second surface of the substrate. As such, the single layer capacitor can include a resistor and a capacitor formed in series with one another.
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公开(公告)号：US20240032185A1
公开(公告)日：2024-01-25
申请号：US18350782
申请日：2023-07-12
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Marianne Berolini , Ronald Demcko
IPC: H05K1/02
CPC classification number: H05K1/021 , H05K2201/10757 , H05K2201/10537 , H05K2201/066
Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. At least one first terminal can be formed over a surface of the body. At least one second terminal can be formed over the surface of the body. A terminal spacing distance can be defined along the surface between the first terminal and the second terminal. A ratio of a length of the surface to the terminal spacing distance can be greater than about 10. Additionally or alternatively, a ratio of the area of the at least one body surface to the total terminal area can be less than 1.2. A component assembly can include a device having a plurality of terminals exposed on a top surface, and the heat source terminal and the heat sink terminal of the heat sink component can be connected with respective terminals of the device.
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公开(公告)号：US11837405B2
公开(公告)日：2023-12-05
申请号：US17537827
申请日：2021-11-30
Applicant: KYOCERA AVX Components Corporation
Inventor： Marianne Berolini , Cory Nelson , Seth Fuller , Alma Iris Cordova
CPC classification number: H01G4/008 , H01G4/1227 , H01G4/248 , H01G4/30
Abstract: The present invention is directed to a multilayer ceramic capacitor. The multilayer ceramic capacitor has a first end and a second end that is spaced apart from the first end in a longitudinal direction that is perpendicular to a lateral direction wherein the lateral direction and longitudinal direction are each perpendicular to a Z-direction. The multilayer ceramic capacitor comprises a monolithic body comprising a plurality of dielectric layers and a plurality of electrode layers parallel with the lateral direction. At least one electrode layer includes a first electrode comprising a connecting portion and a central portion extending from the connecting portion in the longitudinal direction wherein the central portion includes a Z-directional edge and the connecting portion includes an edge extending in both the longitudinal direction and the Z-direction and wherein the Z-directional edge of the central portion forms a first angle of from greater than 90° to less than 180° with the edge of the connecting portion. A first external termination disposed along the first end and a second external termination disposed along the second end.
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公开(公告)号：US20220278453A1
公开(公告)日：2022-09-01
申请号：US17676889
申请日：2022-02-22
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Gheorghe Korony
Abstract: A resistive splitter can include a monolithic substrate and a patterned resistive layer formed over the monolithic substrate. The resistive splitter can include a first terminal, a second terminal, and a third terminal each connected with the patterned resistive layer. The resistive splitter can include at least one frequency compensating conductive layer formed over a portion of the patterned resistive layer. In some embodiments, the resistive splitter can exhibit a first insertion loss response between the first terminal and the second terminal that is greater than about −10 dB for frequencies ranging from about 0 GHz up to about 30 GHz.
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公开(公告)号：US20240395656A1
公开(公告)日：2024-11-28
申请号：US18650179
申请日：2024-04-30
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Shelby Bartley , Thomas Delvaux
IPC: H01L23/367 , H01L21/3213 , H01L21/768 , H01L23/373
Abstract: A component assembly can include an electrical component disposed on a heat sink component to mechanically stabilize the electrical component such that the electrical component may be relatively thin. For example, the heat sink component can include a heat sink substrate comprising a thermally conductive material that is electrically non-conductive. The heat sink substrate can have a first surface and a second surface opposite the first surface, with an electrically conductive layer formed over the second surface of the heat sink substrate. The electrical component can include a component substrate having a first surface and a second surface opposite the first surface, and an electrically conductive pattern can be formed over the first surface of the component substrate. The second surface of the component substrate can be disposed adjacent the first surface of the heat sink substrate.
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Patent Agency Ranking
公开(公告)号：US20230071682A1
公开(公告)日：2023-03-09
申请号：US17891197
申请日：2022-08-19
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson
Abstract: A surface mount component can include a first substrate and a second substrate arranged adjacent the first substrate to form a monolithic body. At least one of the first substrate or the second substrate can include a thermally conductive material that is electrically insulating. A thin film component can be arranged between the first substrate and the second substrate. A first terminal can be formed over a first end of the monolithic body. A second terminal can be formed over a second end of the monolithic body that is opposite the first end. A heat sink terminal can contact the thermally conductive material of the at least one of the first substrate or the second substrate.
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公开(公告)号：US20230070808A1
公开(公告)日：2023-03-09
申请号：US17891208
申请日：2022-08-19
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Marianne Berolini
Abstract: A heat sink component can include a body including a thermally conductive material that is electrically non-conductive. The body can have a top surface, a bottom surface opposite the top surface, and a plurality of side surfaces. The heat sink component also can include a heat source terminal formed over the bottom surface of the body. The heat source terminal can be spaced apart from the plurality of side surfaces. The heat sink component further can include a heat sink terminal formed over the bottom surface of the body. The heat sink terminal can be spaced apart from the plurality of side surfaces.
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公开(公告)号：US20220367732A1
公开(公告)日：2022-11-17
申请号：US17740412
申请日：2022-05-10
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Jeff Borgman
Abstract: A semiconductor-based capacitor can include a substrate including a semiconductor material, an oxide layer formed on a surface of the substrate, a conductive layer formed over at least a portion of the oxide layer, a plurality of distinct coplanar upper terminals, and at least one lower terminal formed. Each of the upper terminals and the at least one lower terminal can be exposed along the top and bottom surfaces of the substrate, respectively, for embedding the capacitor in a substrate such as a circuit board. The semiconductor-based capacitor can be sufficiently miniaturized to be embeddable within a circuit board while providing superior capacitance values. For example, a ratio of the length to the width of the substrate can be in a range from about 3:1 to about 1:3 and an area of the substrate can be less than about 3 mm2.
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公开(公告)号：US20220312593A1
公开(公告)日：2022-09-29
申请号：US17702927
申请日：2022-03-24
Applicant: KYOCERA AVX Components Corporation
Inventor： Cory Nelson , Gheorghe Korony , Jonathan Herr , Marianne Berolini
Abstract: A surface mount component can include a monolithic substrate, an input terminal, an output terminal, and a DC bias terminal. Each terminal can be formed over the monolithic substrate. A conductive trace can be formed over a surface of the monolithic substrate included in a signal path between the input terminal and the output terminal. A thin-film resistor can be connected in a DC bias path between the DC bias terminal and the signal path. The DC bias path can have, at one or more locations along the DC bias path between the DC bias terminal and the signal path, a cross-sectional area in a plane that is perpendicular to the surface of the monolithic substrate. The cross-sectional area of the DC bias path can be less than about 1,000 square microns.
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公开(公告)号：US20250079419A1
公开(公告)日：2025-03-06
申请号：US18805603
申请日：2024-08-15
Applicant: KYOCERA AVX Components Corporation
Inventor： Jonathan Herr , Cory Nelson , Marianne Berolini , Joseph Hock
IPC: H01L25/16 , H01L23/00 , H01L23/48 , H01L23/538 , H01L25/00
Abstract: Vertically oriented component stacks, assemblies, and methods are provided. For example, a vertically oriented component stack includes a plurality of components that each include a first side surface opposite a second side surface along a vertical direction. The first and second side surfaces each extend along a longitudinal direction from a first end surface to a second end surface. Each component has a first external termination and a second external termination formed on the first side surface. The first external termination is spaced apart from the second external termination along the longitudinal direction. The plurality of components are stacked along the lateral direction such that the first external terminations of the plurality of components are generally aligned with one another along the lateral direction and the second external terminations of the plurality of components are generally aligned with one another along the lateral direction.
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