摘要:
A method for processing integrated circuit devices including forming self aligned contact regions. The method includes providing a partially completed semiconductor wafer, the wafer including one or more semiconductor chips, where each of the chips including a plurality of MOS gate structures. Each of the gate structures is formed on a substrate and having a first layer of silicon nitride formed overlying portions including a contact region between the gate structures. Each of the chips has conformal layer of doped silicon glass of a predetermined thickness overlying the silicon nitride layer and the gate structures. The method then applies a plasma etching process to the doped silicon glass to expose a portion of the first silicon nitride layer using an anisotropic etching component to vertically remove portions of the doped silicon glass. A step of cleaning the exposed portion of silicon nitride using an isotropic component is also included. The method forms a second silicon nitride layer on the exposed portion of the second silicon nitride layer and removes the second silicon nitride layer and exposed portion of the first silicon nitride layer to expose the contract region on the substrate. The method processes the exposed contact region using a soft etching technique.
摘要:
Provided is a CMOS image sensor including a pinned photodiode and a transfer transistor. The CMOS image sensor includes: a substrate; a gate electrode disposed on the substrate and electrically isolated from the substrate by a gate insulating layer; a first floating region disposed in the substrate of one side of the gate electrode; a first impurity region for a photodiode disposed in the substrate of the other side of the gate electrode; a second floating region disposed in the substrate between the first impurity region for the photodiode and the gate electrode; and a second impurity region for the photodiode disposed in a surface portion of the substrate including the first impurity region for the photodiode and the second floating region.
摘要:
Provided are an NMOS device, a PMOS device and a SiGe HBT device which are implemented on an SOI substrate and a method of fabricating the same. In manufacturing a Si-based high speed device, a SiGe HBT and a CMOS are mounted on a single SOI substrate. In particular, a source and a drain of the CMOS are formed of SiGe and metal, and thus leakage current is prevented and low power consumption is achieved. Also, heat generation in a chip is suppressed, and a wide operation range may be obtained even at a low voltage.
摘要:
An optoelectronic device and a method of manufacturing the same which the optoelectronic effect such as light emission or light reception can be increased by forming a dual-structural nano dot to enhance the confinement density of electrons and holes are provided. The optoelectronic device comprises an electron injection layer, a nano dot, and a hole injection layer. The nano dot has a dual structure composed of an external nano dot and an internal dot. The method of manufacturing the optoelectronic device comprises the steps of forming an electron injection layer on a semiconductor substrate; growing nano dot layer on the electron injection layer by an epi-growth method; heating the nano dot layer so that the nano dot has a dual structure composed of an external nano dot and an internal nano dot; and forming a hole injection layer on the overall structure.
摘要:
A method for calibrating a Fourier domain optical coherence tomography system includes receiving spectral data from an optical detector comprising a linear array of detector elements, each detector element having a position labeled n, wherein detected light was wavelength-dispersed across the linear array of detector elements; determining parameters of a preselected functional relationship between wave number, kn, corresponding to detector element n as a function of optical detector element n based on the spectral data; further receiving subsequent spectral data subsequent to the first-mentioned receiving, wherein detected light was wavelength-dispersed across the linear array of detector elements; converting the subsequent spectral data using the preselected functional relationship between wave number kn and optical detector element n to obtain converted spectral data; and performing an inverse Fourier transform of the converted spectral data to obtain a depth profile.
摘要:
There is provided a feedback amplifier capable of easily controlling its dynamic range without a separate gain control signal generation circuit. The feedback amplifier includes an input terminal detecting an input voltage from input current, a feedback amplification unit amplifying the input voltage to generate an output signal, and an output terminal outputting a signal amplified by the feedback amplification unit. The feedback amplification unit includes a feedback circuit unit including a feedback resistor located between the input terminal and the output terminal, and a feedback transistor connected in parallel to the feedback resistor; and a bias circuit unit supplying a predetermined bias voltage to the feedback transistor of the feedback circuit unit and merged in the feedback amplification unit.
摘要:
Provided are bipolar transistor, BiCMOS device and method of fabricating thereof, in which an existing sub-collector disposed beneath a collector of a SiGe HBT is removed and a collector plug disposed at a lateral side of the collector is approached to a base when fabricating a Si-based very high-speed device, whereby it is possible to fabricate the SiGe HBT and an SOI CMOS on a single substrate, reduce the size of the device and the number of masks to be used, and implement the device of high density, low power consumption, and wideband performance.
摘要:
A method for calibrating a Fourier domain optical coherence tomography system includes receiving spectral data from an optical detector comprising a linear array of detector elements, each detector element having a position labeled n, wherein detected light was wavelength-dispersed across the linear array of detector elements; determining parameters of a preselected functional relationship between wave number, kn, corresponding to detector element n as a function of optical detector element n based on the spectral data; further receiving subsequent spectral data subsequent to the first-mentioned receiving, wherein detected light was wavelength-dispersed across the linear array of detector elements; converting the subsequent spectral data using the preselected functional relationship between wave number kn and optical detector element n to obtain converted spectral data; and performing an inverse Fourier transform of the converted spectral data to obtain a depth profile.
摘要:
An interventional photoacoustic imaging system and method for cancer treatment comprises an optical source for applying laser energy to optically excite a treatment area, a needle, ablation tool or catheter for inserting the optical source into a body of a patient adjacent the treatment area, and an ultrasonic transducer for detecting the acoustic waves. A processor receives the raw data from the ultrasound system and processes it to thereby form a photoacoustic image of the tissue in real time. As such, image formation may be performed preoperatively, intraoperatively, and postoperatively.
摘要:
A method for processing integrated circuit devices including forming self aligned contact regions. The method includes providing a partially completed semiconductor wafer, the wafer including one or more semiconductor chips, where each of the chips including a plurality of MOS gate structures. Each of the gate structures is formed on a substrate and having a first layer of silicon nitride formed overlying portions including a contact region between the gate structures. Each of the chips has conformal layer of doped silicon glass of a predetermined thickness overlying the silicon nitride layer and the gate structures. The method then applies a plasma etching process to the doped silicon glass to expose a portion of the first silicon nitride layer using an anisotropic etching component to vertically remove portions of the doped silicon glass. A step of cleaning the exposed portion of silicon nitride using an isotropic component is also included. The method forms a second silicon nitride layer on the exposed portion of the second silicon nitride layer and removes the second silicon nitride layer and exposed portion of the first silicon nitride layer to expose the contract region on the substrate. The method processes the exposed contact region using a soft etching technique.