公开(公告)号：US20120153779A1

公开(公告)日：2012-06-21

申请号：US13308896

申请日：2011-12-01

Applicant: Keiji Sato ,  Hitoshi Takeuchi ,  Takahiko Nakamura ,  Kiyoshi Aratake ,  Masashi Numata

Inventor： Keiji Sato ,  Hitoshi Takeuchi ,  Takahiko Nakamura ,  Kiyoshi Aratake ,  Masashi Numata

IPC: H01L41/053 ,  H05K5/06

CPC classification number: H03H9/1021 ,  H01L2924/0002 ,  H03H9/02133 ,  H01L2924/00

Abstract: An electronic component includes a glass substrate, a lid that is bonded to the glass substrate, an internal electrode, an external electrode, and a through electrode that is disposed in a through hole passing through the glass substrate and electrically connects the internal electrode to the external electrode. A sputtered metal layer is formed on the end face of a core member of the through electrode, which is made of a metal, by sputtering.

Abstract translation: 电子部件包括玻璃基板，与玻璃基板接合的盖，内部电极，外部电极和贯通电极，所述内部电极，外部电极和贯通电极配置在穿过玻璃基板的通孔中，并将内部电极电连接到 外部电极。 通过溅射在金属制的贯通电极芯体的端面上形成溅射金属层。

公开(公告)号：US20110285245A1

公开(公告)日：2011-11-24

申请号：US13196396

申请日：2011-08-02

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H01L41/00 ,  B32B38/10 ,  B32B37/06

CPC classification number: H03H9/21 ,  C03C27/06 ,  H01L21/50 ,  H01L23/10 ,  H01L2924/0002 ,  H01L2924/01079 ,  H01L2924/16152 ,  H01L2924/3011 ,  H03H9/1021 ,  Y10T156/1052 ,  H01L2924/00

Abstract: An anodic wafer bonding method according to the present invention is an anodic wafer bonding method for bonding a first substrate formed of an insulating material or a dielectric material and a second substrate which can be anodically bonded by applying a voltage to a bonding film formed of a conductive material formed between the substrates in a state in which the first substrate and the second substrate are laminated, in which the voltage is applied to the bonding film from a plurality of points at the time of anodic wafer bonding.

Abstract translation: 根据本发明的阳极晶片接合方法是用于将由绝缘材料或电介质材料形成的第一衬底和第二衬底接合的阳极晶片接合方法，所述第二衬底可以通过向由 在第一基板和第二基板被层叠的状态下在基板之间形成的导电材料，其中在阳极晶片接合时从多个点向接合膜施加电压。

公开(公告)号：US08032997B2

公开(公告)日：2011-10-11

申请号：US12857234

申请日：2010-08-16

Applicant: Masashi Numata ,  Kiyoshi Aratake ,  Osamu Onitsuka ,  Junya Fukuda ,  Kazuyoshi Sugama

Inventor： Masashi Numata ,  Kiyoshi Aratake ,  Osamu Onitsuka ,  Junya Fukuda ,  Kazuyoshi Sugama

IPC: H04R17/10 ,  H01L41/043

CPC classification number: H03H3/02 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42 ,  Y10T29/49165 ,  H01L2224/0401

Abstract: A process of manufacturing a piezoelectric vibrator comprises a base substrate; a lid substrate in which cavity recesses are formed and which is bonded to the base substrate in such a state that the recesses face the base substrate; a piezoelectric vibration member bonded to the upper face of the base substrate in such a state that it is housed in the cavity formed of the recess between the base substrate and the lid substrate; an external electrode formed on the lower face of the base substrate; a through- electrode formed in and through the base substrate and electrically connected with the external electrode with keeping the airtightness inside the cavity; and a routing electrode formed on the upper face of the base substrate to electrically connect the through-electrode to the bonded piezoelectric vibration member; wherein the through-electrode is formed in the base substrate by utilizing an electroconductive tack member having a tabular basis part and a core part extending from the basis part toward a direction perpendicular from a surface of the tabular basis part, where the core part is inserted into a through-hole formed in the base substrate and the basis part is removed by polishing the base substrate.

Abstract translation: 制造压电振动器的工艺包括：基底; 盖基板，其中形成有空腔凹部，并且在凹部面向基底基板的状态下结合到基底基板; 压电振动构件，其被接合到基底基板的上表面，其状态是将其容纳在由基底基板和盖基板之间的凹部形成的空腔中; 形成在所述基底基板的下表面上的外部电极; 形成在所述基底基板内并穿过所述基底基板的贯通电极，并与所述外部电极电连接，并保持所述空腔内的气密性; 以及布线电极，形成在所述基底基板的上表面上，以将所述通孔电连接到所述接合的压电振动部件; 其特征在于，所述贯通电极通过利用具有片状基部的导电性定位构件和从所述基部朝向与所述片状基部的表面垂直的方向延伸的芯部形成在所述基底基板中，所述芯部插入 进入形成在基底基板中的通孔中，并且通过抛光基底来去除基础部分。

公开(公告)号：US20110228643A1

公开(公告)日：2011-09-22

申请号：US13050284

申请日：2011-03-17

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H01L41/053 ,  H01L41/08 ,  H03B1/00 ,  G04C11/02 ,  H01L41/22

CPC classification number: H03H9/1021 ,  H03H9/02 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42

Abstract: Provided are a vacuum package and a method for manufacturing the vacuum package having excellent airtightness and capable of improving mounting strength, and a piezoelectric vibrator, an oscillator, an electronic device, and a radio-controlled timepiece. The package includes a base substrate and a lid substrate bonded to each other, a cavity formed between the base substrate and the lid substrate and configured to be capable of sealing a piezoelectric vibrating reed, and penetration electrodes penetrating through the base substrate in the thickness direction so as to make the inner side of the cavity and the outer side conductive. Portions of the base substrate and the lid substrate in the vicinity of the cavity form bonding regions in which the two substrates are bonded. A notch portion through which the bonding surface of the lid substrate is exposed as seen from the thickness direction of the base substrate is formed on the corner portions of the base substrate.

Abstract translation: 提供一种具有优异的气密性并且能够提高安装强度的真空封装和制造方法，以及压电振动器，振荡器，电子设备和无线电控制的钟表。 该封装包括：基板和盖基板，其形成在基底基板和盖基板之间，并且能够密封压电振动片，穿透电极在基板的厚度方向上贯通 以使空腔的内侧和外侧导电。 基底基板和盖基板在空腔附近的部分形成两个基板结合的接合区域。 在基底基板的角部形成有从基底基板的厚度方向观察盖基板的接合面露出的切口部。

公开(公告)号：US08020264B2

公开(公告)日：2011-09-20

申请号：US12794180

申请日：2010-06-04

Applicant: Kiyoshi Aratake ,  Yasuo Kawada

Inventor： Kiyoshi Aratake ,  Yasuo Kawada

IPC: H04R17/00 ,  H05K3/10

CPC classification number: H03H9/1021 ,  H03H9/21 ,  Y10T29/42 ,  Y10T29/49126 ,  Y10T29/49165 ,  Y10T29/49798

Abstract: There is provided a method of manufacturing piezoelectric vibrators 1. The method includes a process for through holes 35 and 36, which pass through a base substrate wafer, so that openings of the through holes are opened to the outside of the recesses for cavities C; a process for patterning a bonding layer 30, pairs of mounting layers, and pairs of extraction electrode layers 33 and 34 on the upper surface of the base substrate wafer with the same conductive material; and a process for electrically isolating the extraction electrode layers 34 in the middle by irradiating a part (area S2) of the extraction electrode layers 34, which are formed between the bonding layer and openings of through holes 36, with laser light after both the wafers are anodically bonded to each other. The bonding layer 30 surrounds the recesses, the pairs of mounting layers are in the recesses, and the pairs of extraction electrode layers 33 and 34 electrically connect the pairs of mounting layers to the bonding layer.

Abstract translation: 提供了制造压电振动器1的方法。该方法包括通孔35和36的方法，其通过基底晶片，使得通孔的开口朝向空腔C的凹部的外侧开口; 用相同的导电材料在基底晶片的上表面上构图接合层30，成对安装层和成对的引出电极层33和34的工艺; 以及通过在两个晶片之后用激光照射形成在通孔36的接合层和开口之间的引出电极层34的部分（区域S2），使中间的引出电极层34电隔离的工艺 相互阳极结合。 接合层30围绕凹部，这些安装层位于凹部中，并且成对的引出电极层33和34将成对的安装层电连接到接合层。

公开(公告)号：US20110048633A1

公开(公告)日：2011-03-03

申请号：US12869098

申请日：2010-08-26

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: B29C65/14

CPC classification number: H03H3/02 ,  H03H9/1014

Abstract: Providing an anodic bonding method capable of suppressing uneven quality between the central and outer sides of a bonding surface being anodically bonded. There is provided an anodic bonding method of anodically bonding a base wafer 10 and a lid wafer 11, the method including: a superimposition step of superimposing the base wafer 10 and the lid wafer 11 onto each other in a direction where a bonding film 9 faces a cavity C; a pressurizing step of, subsequent to the superimposition step, pressurizing and holding the base wafer 10 and the lid wafer 11 in a vacuum state in the superimposition direction; and a voltage application step of, subsequent to the pressurizing step, partitioning and setting a plurality of intended bonding areas A1, A2, A3 and A4 in a concentric form on a contacting surface where the base wafer 10 and the lid wafer 11 are in contact with each other and applying a DC voltage to each of the plurality of intended bonding areas A1, A2, A3 and A4 while sequentially switching the intended bonding areas A1, A2, A3 and A4 from a central side of the intended bonding areas A1, A2, A3 and A4 towards an outer side in a diameter direction thereof, wherein in the voltage application step, an application time of the DC voltage corresponding to each of the plurality of intended bonding areas A1, A2, A3 and A4 is set to be constant for each of the intended bonding areas A1, A2, A3 and A4.

Abstract translation: 提供能够抑制阳极结合的接合面的中央和外侧之间的不均匀质量的阳极接合方法。 提供了一种阳极接合基底晶片10和盖子晶片11的阳极接合方法，该方法包括：将基底晶片10和盖子晶片11沿接合薄膜9所面向的方向彼此重叠的叠加步骤 腔C; 在叠加步骤之后的加压步骤中，将基底晶片10和盖子晶片11以叠加方向加压并保持在真空状态; 以及电压施加步骤，在所述加压步骤之后，在所述基底晶片10和所述盖子晶片11接触的接触表面上以同心形式分割和设置多个预定的接合区域A1，A2，A3和A4 彼此相对并且将多个预定粘合区域A1，A2，A3和A4中的每一个施加直流电压，同时从预期粘合区域A1，A2的中心侧依次切换预期的接合区域A1，A2，A3和A4 ，A3和A4朝向其直径方向的外侧，其中在电压施加步骤中，将与多个预定粘合区域A1，A2，A3和A4中的每一个相对应的DC电压的施加时间设定为恒定 对于每个预定的接合区域A1，A2，A3和A4。

公开(公告)号：US20100236038A1

公开(公告)日：2010-09-23

申请号：US12791286

申请日：2010-06-01

Applicant: Kiyoshi Aratake ,  Yasuo Kawada

Inventor： Kiyoshi Aratake ,  Yasuo Kawada

IPC: H04R17/00 ,  H01L41/053

CPC classification number: H03H3/02 ,  H03H9/1021 ,  H03H9/21 ,  H03H2003/026 ,  Y10T29/42

Abstract: There is There is provided a method of manufacturing a package 1 having a base substrate 10 and a lid substrate 20 bonded to each other and both formed of a glass base material; and a cavity C formed between the both substrates for storing an encapsulated object 2 in a state of being hermetically encapsulated, including: a depression forming step for forming a depression C1 for a cavity which defines the cavity when the both substrates are superimposed to each other on at least one of the both substrates; and a bonding step for superimposing the both substrates so as to store the encapsulated object in the depression and then bonding the both substrates to encapsulate the encapsulated object in the cavity, characterized in that in the depression forming step, printed layers 12 are laminated on an upper surface of a flat plate-shaped glass base material 11 in a frame shape in plan view by screen printing, and then the printed layers and the glass base material are baked at the same time to form the depression.

Abstract translation: 提供了一种制造包装1的方法，该包装1具有彼此接合并且都由玻璃基材形成的基底10和盖基底20; 以及形成在两个基板之间的空腔C，用于以密封的状态存储被封装物体2，包括：凹陷形成步骤，用于在两个基板彼此叠置时形成限定空腔的空腔的凹陷C1 在两个基材中的至少一个上; 以及结合步骤，用于叠加两个基板，以将封装物体存储在凹陷中，然后将两个基板接合以将封装物体封装在空腔中，其特征在于，在凹陷形成步骤中，将印刷层12层压在 通过丝网印刷在平面图中以平板状的平板状玻璃基材11的上表面，然后同时烘烤印刷层和玻璃基材以形成凹陷。

公开(公告)号：US07459334B2

公开(公告)日：2008-12-02

申请号：US11341745

申请日：2006-01-27

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H01L21/00

CPC classification number: H03H3/02 ,  C30B29/18 ,  C30B33/08 ,  G04F5/063 ,  G04G21/04 ,  G04R20/10

Abstract: A method of manufacturing a quartz crystal vibrating piece is provided. Etching masks of different sizes are each arranged on respective front and rear surfaces of a quartz crystal wafer such that the etching mask on one of the surfaces (e.g., the rear surface) is larger than the other etching mask. The quartz crystal wafer is etched using the etching masks so that a projection is formed on a side of the quartz crystal wafer due to the difference in size of the etching masks, and is overetched to remove the projection.

Abstract translation: 提供一种制造石英振动片的方法。 不同尺寸的蚀刻掩模各自布置在石英晶片的相应的前表面和后表面上，使得其中一个表面（例如，后表面）上的蚀刻掩模大于另一个蚀刻掩模。 使用蚀刻掩模蚀刻石英晶片，使得由于蚀刻掩模的尺寸的差异而在石英晶片的一侧上形成突起，并且被过蚀刻以去除突起。

公开(公告)号：US07439658B2

公开(公告)日：2008-10-21

申请号：US11506055

申请日：2006-08-17

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H01L41/053

CPC classification number: H03H9/1021 ,  H03H9/21

Abstract: To provide a piezoelectric vibrator, an oscillator, an electronic part, an electronic apparatus, a method of fabricating a piezoelectric vibrator and a method of fabricating an electronic part capable of swiftly and easily providing a plurality of electrodes for applying a voltage to a piezoelectric vibrating piece while maintaining airtightness at inside of a hermetically sealed vessel, there is provided a piezoelectric vibrator including a hermetically sealed vessel 2 constituted by overlapping a lid member 6 and a base member 7 in a plate-like shape, a piezoelectric vibrating piece 3 provided at inside of the hermetically sealed vessel 2, a lead-out electrode 16 provided at an overlapping face 6a of the lid member 6, electrically connected to the piezoelectric vibrating piece 3 by way of a connecting portion, and extending the connecting portion 15 to an edge portion of the overlapping face 6a of the lid member 6, an external electrode 27 electrically connected to the lead-out electrode 16 from a side face of the hermetically sealed vessel 2, and a bonding film 20 comprising a metal or silicone provided between the overlapping face 6a of the lid member 6 and an overlapping face 7a of the base member 7, in which an insulating film 22 is provided between the lead-out electrode 16 and the bonding film 20.

Abstract translation: 提供压电振动器，振荡器，电子部件，电子设备，制造压电振动器的方法和制造电子部件的方法，其能够快速且容易地提供用于向压电振动器施加电压的多个电极 同时保持密封容器内部的气密性，提供了一种压电振动器，其包括通过将盖构件6和基座构件7重叠成板状而构成的气密密封容器2，压电振动片3设置在 在密封容器2的内部，设置有盖构件6的重叠面6a的引出电极16，其通过连接部与压电振动片3电连接，并且将连接部15延伸到 盖构件6的重叠面6a的边缘部分，与导出件电连接的外部电极27 电极16从密封容器2的侧面，以及接合膜20，其包括设置在盖构件6的重叠面6a和基部构件7的重叠面7a之间的金属或硅酮，其中 绝缘膜22设置在引出电极16和接合膜20之间。

公开(公告)号：US20070046151A1

公开(公告)日：2007-03-01

申请号：US11505693

申请日：2006-08-17

Applicant: Kiyoshi Aratake

Inventor： Kiyoshi Aratake

IPC: H01L41/053

CPC classification number: H03H9/1035 ,  H01L2924/0002 ,  H03H9/0542 ,  H03H9/0595 ,  H03H9/215 ,  H01L2924/00

Abstract: To provide a quartz crystal vibrator, an oscillator and an electronic apparatus capable of preventing a bonding electrode from being corroded and easily maintaining soundness of the bonding electrode over a long period of time, a quartz crystal vibrator is provided with a quartz crystal vibrating plate formed by surrounding a quartz crystal vibrating piece by a frame-like portion, a hermetically closed vessel including a lid member and a base member in a plate-like shape for interposing the quartz crystal vibrating plate in a thickness direction, bonding electrodes provided between the lid member and the quartz crystal vibrating plate and between the base member and the quartz crystal vibrating plate and electrically connected to an inner electrode, and a protecting film for protecting the bonding electrode, provided with a recess portion recessed to an inner side of the hermetically closed vessel from an outer edge portion between the lid member and the quartz crystal vibrating plate and an outer edge portion between the base member and the quartz crystal vibrating plate, the protecting film is provided at the recess portion and the bonding electrode is disposed on the inner side of the recess portion.

Abstract translation: 为了提供能够防止接合电极被腐蚀并且容易保持接合电极的长时间稳定性的石英晶体振子，振荡器和电子设备，石英振子具有形成的石英振动板 通过围绕石英晶体振动片由框状部分，密封容器，其包括盖构件和板状形状的底座构件，用于在厚度方向插入石英振动板，接合电极设置在盖 构件和石英晶体振动板，并且在基底构件和石英振动板之间并且电连接到内部电极，以及用于保护接合电极的保护膜，设置有凹陷到密封的内侧的凹部 容器从盖构件和石英振动板之间的外边缘部分 以及在所述基座部件和所述石英振动板之间的外缘部，所述保护膜设置在所述凹部，所述接合电极配置在所述凹部的内侧。