摘要:
Method for creating a flexible, multistable element (5): a silicon component (S) is etched with a beam (P) connecting two ends (E1, E2) of a rigid mass (MU) having a cross-section more than ten times that of said beam (P), SiO2 is grown at 1100° C. for a duration adjusted to obtain, on said beam (P), a first ratio (RA) of more than 1 between the section of a first peripheral layer (CP1) of SiO2, and that of a first silicon core (A1), and, on said mass (MU), a second ratio (RB) between the section of a second peripheral layer (CP2) of SiO2 and that of a second silicon core (A2), which is less than a hundredth of said first ratio (RA); cooling to ambient temperature is performed, to deform said beam (P) by buckling when said mass (MU) cools and contracts more than said beam (P).
摘要:
Crystals having a modified regular tetrahedron shape are provided. Crystals preferably have four substantially identical triangular faces that define four truncated vertices and six chamfered edges. The six chamfered edges can have an average length of l, and an average width of w, and 8≦l/w≦9.5.
摘要:
A pallet lever mechanism for an escapement mechanism including a structure carrying a balance and an escape wheel, the pallet lever including pallet stones cooperating with the escape wheel, and a flexible, multistable element, and the pallet lever cooperates with the balance with horns of a first portion of the pallet lever connected by one such flexible element to the structure or to a second portion of the pallet lever carrying the pallet stones connected by one such flexible element to the fixed structure or to the first portion. One flexible element includes a prestressed beam buckled in an S or Z shape, the pallet lever mechanism including a pivot forcing the beam to have a node at the middle thereof.
摘要:
The present invention is directed to a single-crystal silicon pulling silica container, the silica container including a straight body portion, a curved portion, and a bottom portion, wherein the OH group concentration in the straight body portion is 30 to 300 ppm by mass, the OH group concentration in the bottom portion is 30 ppm by mass or less, and the difference in the OH group concentration between the straight body portion and the bottom portion is 30 ppm by mass or more. As a result, a low-cost single-crystal silicon pulling silica container, the silica container that can reduce cavity defects called voids and pinholes in pulled single crystal silicon, is provided.
摘要:
An object of the present invention is to provide an artificial quartz member inhibited from suffering the decrease in transmittance in a laser light wavelength region which is caused by long-term irradiation with a laser light having a wavelength of 200 nm or shorter; and a process for producing the artificial quartz member. The invention provides an artificial quartz member for use as an optical element to be irradiated with a laser light having a wavelength of 200 nm or shorter, having an aluminum content of 200 ppb or lower.
摘要:
A method of manufacturing a spherical crystal blank in which the crystal axis is determined by a simple work with a high degree of accuracy includes the steps of: cutting out a cube from a crystal blank provided with crystal axes including a Z axis, and X and Y axes orthogonal to the Z axis, the cube including the Z axis as a side and being of a size capable of including the spherical crystal blank to be manufactured; then forming a reference hole for Z axis extending along the Z axis direction in reference to the side of the cube in the cube; and thereafter, forming the cube into a sphere so as to include a portion of the reference hole for Z axis.
摘要:
A method of manufacturing a thin quartz crystal wafer from a quartz crystal block which is cut from a crystal body of synthetic quartz crystal and has a flat principal surface, comprises the steps of (a) converging a laser beam at a region in said quartz crystal block at a predetermined depth from the principal surface thereof to cause multiphoton phenomenon state, thereby breaking Si—O—Si bonds of quartz crystal in said region to form voids in said region, and (b) peeling said thin quartz crystal wafer from a body of said quartz crystal block along said voids. The above process is repeatedly performed on one quartz crystal block to peel off a plurality of thin quartz crystal wafers successively from the principal surface of the quartz crystal block. Each of the thin quartz crystal wafers is divided into individual quartz crystal blanks for making quartz crystal units.
摘要:
To provide a manufacturing method of a small-sized quartz crystal vibrating piece, which can decrease processing variations due to accuracy of matching a front and a rear of a mask in etching of a quartz crystal wafer. According to a manufacturing method of a quartz crystal vibrating piece to be processed by etching a quartz crystal wafer from a front and a rear, a size of a mask used for etching is changed depending on a front and a rear of the quartz crystal wafer, a mask of a small size is defined as a reference mask, and a mask of a large size is defined as a relative mask so as to perform etching. The mask is unified to the size to be processed from the reference mask by over etching, even processing accuracy can be obtained, the small-sized quartz crystal vibrating piece can be manufactured, and the quartz crystal vibrating piece can be provided inexpensively and stably.
摘要:
In a state in which respective portions of a quartz wafer have been masked by a plurality of kinds of mask layers that have respectively different etching rates, the quartz wafer is subjected to an etching process. Since the etching operation is started earlier at a first portion which is masked by the mask layer having a high etching rate, the amount of etching is increased at the first portion. In contrast, the start of the etching operation is delayed at a second portion which is masked by the mask layer having a low etching rate, and the amount of etching is reduced at the second portion. Thus, it becomes possible to form the quartz wafer into a desired shape.
摘要:
A method of smoothly processing a surface of crystal material, particularly a quartz crystal, to attain a good surface roughness and degree of eveness without substantial hillocks or micro-projections, without performing grinding or polishing processing. After lapping the surface of the crystal material, the lapped surface is etched with hydrofluoric acid. Finish etching is performed on the crystal material by buffer hydrofluoric acid as needed. In the manufacture of a crystal piece used in a crystal device, after the crystal wafer cut out from the rough crystal stone to the specified thickness is lapped, it is roughly etched to the desired thickness by hydrofluoric acid. Then, after ultrasonic washing by pure water, the crystal wafer is processed to the desired high quality of surface roughness, level of smoothness and thickness. The surface processing can be performed more easily, in less time, and with less labor than conventional methods, the cost is decreased, and productivity rises. In the manufacture of crystal resonator pieces, a rise in yield can be achieved.