公开(公告)号：US06800946B2

公开(公告)日：2004-10-05

申请号：US10328326

申请日：2002-12-23

Applicant: Marc Chason ,  Jan Danvir

Inventor： Marc Chason ,  Jan Danvir

IPC: H01L310203

CPC classification number: B81C1/00333 ,  H01L21/563 ,  H01L23/48 ,  H01L24/17 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L31/0203 ,  H01L33/62 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29011 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2224/83194 ,  H01L2224/83856 ,  H01L2924/00014 ,  H01L2924/01033 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/15787 ,  H01L2924/19041 ,  H01L2924/19043 ,  Y10T29/49146 ,  H01L2924/00 ,  H01L2224/05599

Abstract: The invention provides a method for attaching a flip chip to a printed wiring board. A bumped opto-electronic or electromechanical flip chip is provided. An underfill material is applied to a first portion of the flip chip, wherein a second portion of the flip chip is free of the underfill material. The flip chip is positioned on a printed wiring board, and a bumped portion of the flip chip is heated to electrically connect the flip chip to the printed wiring board. The second portion of the flip chip remains free of the underfill material when the flip chip is electrically connected to the printed wiring board.

公开(公告)号：US5847920A

公开(公告)日：1998-12-08

申请号：US937430

申请日：1997-09-25

Applicant: Changming Li ,  Robert H. Reuss ,  Marc Chason

Inventor： Changming Li ,  Robert H. Reuss ,  Marc Chason

IPC: H01G9/02 ,  H01G9/025 ,  H01G9/04

CPC classification number: H01G9/025 ,  Y10T29/417

Abstract: A capacitor (100) includes first and second electrodes (102, 103) an adhesive electrolyte (125) positioned therebetween. The adhesive electrolyte (125) includes an organic polymer and an inorganic component, which is either a polyacid or a polysalt.

Abstract translation: 电容器（100）包括位于其间的粘合剂电解质（125）的第一和第二电极（102,103）。 粘合剂电解质（125）包括有机聚合物和无机组分，其是多酸或多糖。

公开(公告)号：US20130174410A1

公开(公告)日：2013-07-11

申请号：US13736753

申请日：2013-01-08

Applicant: Blake Stevens ,  Max Sorenson ,  Marc Chason

Inventor： Blake Stevens ,  Max Sorenson ,  Marc Chason

IPC: H05K13/00

CPC classification number: H05K13/0495 ,  C08G61/025 ,  C08G2261/312 ,  H05K3/28 ,  H05K3/282 ,  H05K3/341 ,  H05K13/00 ,  H05K13/0465 ,  Y10T29/49002 ,  Y10T29/49885 ,  Y10T29/53187

Abstract: A system for assembling electronic devices includes at least one coating element for applying a moisture-resistant coating to surfaces of a device under assembly, or an electronic device under assembly. As components and one or more moisture-resistant coatings are added to the electronic device under assembly to form a finished electronic device, at least one surface on which the coating resides and, thus, at least a portion of the coating itself, is located internally within the finished electronic device. Methods for assembling electronic devices that include internally confined moisture-resistant coatings are also disclosed.

Abstract translation: 一种用于组装电子装置的系统包括至少一个用于在组装装置的表面上施加耐湿涂层或组装电子装置的涂层元件。 随着组件和一个或多个防潮涂层被加入到组装的电子器件中以形成成品电子器件，涂层所在的至少一个表面，因此涂层本身的至少一部分位于内部 在完成的电子设备内。 还公开了用于组装包括内部限制的防潮涂层的电子装置的方法。

公开(公告)号：US06649852B2

公开(公告)日：2003-11-18

申请号：US09929750

申请日：2001-08-14

Applicant: Marc Chason ,  Andrew Skipor ,  Aroon Tungare ,  Daniel Gamota ,  Sanjar Ghaem

Inventor： Marc Chason ,  Andrew Skipor ,  Aroon Tungare ,  Daniel Gamota ,  Sanjar Ghaem

IPC: H01H3900

CPC classification number: H05K3/4092 ,  H01H59/0009 ,  H01H2001/0073

Abstract: The organic MEMS according to the present invention comprises a polymeric substrate comprising a substrate surface including a first region and a second region. A polymer coating is applied to the first region to provide a coating surface that is spaced apart from the substrate surface. A terminal is disposed on the second region. A metallic trace is affixed to the coating surface such that the metallic trace forms a flexible extension over the second region. The extension has a rest position where the extension is spaced apart from the terminal, and a flexed position where the extension is disposed towards the terminal. An actuator is used to provide an electric field to deflect the extension from the rest position to the flexed position. By changing the spacing between the extension and the terminal, it is possible to change the electrical condition provided by the MEMS.

Abstract translation: 根据本发明的有机MEMS包括聚合物基材，其包括包含第一区域和第二区域的基材表面。 将聚合物涂层施加到第一区域以提供与基底表面间隔开的涂层表面。 端子设置在第二区域上。 金属痕迹附着在涂层表面上，使得金属迹线在第二区域上形成柔性延伸。 延伸部具有静止位置，其中延伸部与端子间隔开，以及弯曲位置，其中延伸部朝向端子设置。 致动器用于提供电场以将延伸部从静止位置偏转到弯曲位置。 通过改变延伸部和端子之间的间距，可以改变由MEMS提供的电气条件。

公开(公告)号：US5838214A

公开(公告)日：1998-11-17

申请号：US676611

申请日：1996-07-08

Applicant: Sanjay Goel ,  Darioush Keyvani ,  Girish R. Harshe ,  John E. Nerz ,  Marc Chason

Inventor： Sanjay Goel ,  Darioush Keyvani ,  Girish R. Harshe ,  John E. Nerz ,  Marc Chason

IPC: H03H7/01 ,  H03H7/09

CPC classification number: H03H7/09 ,  H03H7/0115

Abstract: A capacitor (14) is disposed in, for example, a ferrite shell (12). A winding (20) is formed around the shell, thereby providing an inductive component. Additional windings may be provided to form a transformer. In combining the two components into a unitary package, a space savings is realized, and assembly efficiency is increased.

Abstract translation: 电容器（14）设置在例如铁氧体壳（12）中。 围绕壳体形成绕组（20），从而提供感应部件。 可以提供额外的绕组以形成变压器。 将两个组件组合成一体的封装，实现了节省空间，并提高了组装效率。