公开(公告)号：US20120008964A1

公开(公告)日：2012-01-12

申请号：US12834084

申请日：2010-07-12

申请人： James Costello ,  Rani Saravanan ,  Wee Sin Tan

发明人： James Costello ,  Rani Saravanan ,  Wee Sin Tan

IPC分类号： G03G15/00

CPC分类号： G03G15/6588 ,  G03G15/5062 ,  G03G2215/00721 ,  G03G2215/00734

摘要： Printable media sensing devices, systems and methods are disclosed herein. An array of light emitters projects light through a printable media sheet for detection by a corresponding array of light sensors. A processor is operably connected to the array of light emitters and light sensors, and is configured to activate the light emitters, and receive output signals from the light sensors, and permit the accurate detection and determination of the locations of top of form (TOF) and bottom of form (BOF) for a given printable media sheet, as well as multiple widths corresponding to such sheet. According to some embodiments, the locations of labels on a sheet may also be detected with heightened accuracy, as may regions having no labels disposed thereover.

摘要翻译： 本文公开了可打印介质感测装置，系统和方法。 光发射器阵列通过可印刷的介质片投射光，以便由相应的光传感器阵列进行检测。 处理器可操作地连接到光发射器和光传感器阵列，并且被配置为激活光发射器并且接收来自光传感器的输出信号，并且允许精确检测和确定形式顶部（TOF）的位置， 和用于给定的可打印介质片的形状底部（BOF），以及对应于这种片材的多个宽度。 根据一些实施例，也可以以更高的精度检测片材上的标签的位置，因为在其上没有设置标签的区域。

公开(公告)号：US20110297832A1

公开(公告)日：2011-12-08

申请号：US12796475

申请日：2010-06-08

申请人： Yufeng Yao ,  Sze Ping Ong ,  Wee Sin Tan

发明人： Yufeng Yao ,  Sze Ping Ong ,  Wee Sin Tan

IPC分类号： H01L31/16 ,  B29C65/00 ,  H05K3/00 ,  B23K31/02

CPC分类号： H01L25/167 ,  G01S7/4813 ,  G01S17/026 ,  H01L2924/0002 ,  H03K17/941 ,  H03K2017/9455 ,  H05K1/0216 ,  H05K1/183 ,  H05K2201/09827 ,  H05K2201/09845 ,  H05K2201/09981 ,  H05K2201/10106 ,  H05K2201/10151 ,  H01L2924/00

摘要： A proximity sensor includes a printed circuit board (PCB); a first cup and a second cup embedded in the PCB; an electromagnetic radiation transmitter operably mounted in the first cup; and an electromagnetic radiation receiver operably mounted in the second cup.

摘要翻译： 接近传感器包括印刷电路板（PCB）; 嵌入PCB中的第一杯和第二杯; 可操作地安装在第一杯中的电磁辐射发射器; 以及可操作地安装在第二杯中的电磁辐射接收器。

公开(公告)号：US20110057108A1

公开(公告)日：2011-03-10

申请号：US12557438

申请日：2009-09-10

申请人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

发明人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

IPC分类号： H01L27/14 ,  H01L31/167

CPC分类号： H01L31/173 ,  G01S7/4813 ,  G01S17/026 ,  G01S17/48 ,  H01L25/167 ,  H01L31/0203 ,  H01L2224/48091 ,  H01L2924/3025 ,  H03K17/941 ,  H03K2017/9455 ,  H01L2924/00014 ,  H01L2924/00

摘要： Various embodiments of a compact optical proximity sensor with a ball grid array and windowed or apertured substrate are disclosed. In one embodiment, the optical proximity sensor comprises a printed circuit board (“PCB”) substrate comprising an aperture and a lower surface having electrical contacts disposed thereon, an infrared light emitter and an infrared light detector mounted on an upper surface of the substrate, an integrated circuit located at least partially within the aperture, a molding compound being disposed between portions of the integrated circuit and substrate, an ambient light detector mounted on an upper surface of the integrated circuit, first and second molded infrared light pass components disposed over and covering the infrared light emitter and the infrared light detector, respectively, and a molded infrared light cut component disposed between and over portions of the first and second infrared light pass components.

摘要翻译： 公开了具有球栅阵列和窗口或有孔基板的紧凑型光学接近传感器的各种实施例。 在一个实施例中，光学接近传感器包括印刷电路板（“PCB”）基板，其包括孔和设置在其上的电触点的下表面，安装在基板的上表面上的红外光发射器和红外光检测器， 至少部分位于孔内的集成电路，设置在集成电路和衬底的部分之间的模制化合物，安装在集成电路的上表面上的环境光检测器，设置在其上的第一和第二模制红外光通过部件， 分别覆盖红外光发射器和红外光检测器，以及设置在第一和第二红外光通过部件的部分之间的模制的红外光切割部件。

公开(公告)号：US20110057104A1

公开(公告)日：2011-03-10

申请号：US12631804

申请日：2009-12-04

申请人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

发明人： Yufeng Yao ,  Chi Boon Ong ,  Wee Sin Tan

IPC分类号： H01J40/14 ,  G01J5/00 ,  H05K3/36

CPC分类号： G01J1/32 ,  G01J1/44 ,  H01L2224/48465 ,  H01L2924/3025 ,  Y10T29/49126 ,  H01L2924/00

摘要： Various embodiments of a miniaturized optical proximity sensor are disclosed. In one embodiment, an ambient light sensor and a light detector are mounted on first and second spacers, which in turn are mounted to a top surface of an integrated circuit die-attached to a substrate. An optically-transmissive infrared pass compound is molded over the ambient light sensor, the light detector, the integrated circuit, alight emitter and peripheral portions of the substrate. Next, an optically non-transmissive infrared cut compound is molded to over the optically-transmissive infrared pass compound to provide a miniaturized optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

摘要翻译： 公开了一种小型化光学接近传感器的各种实施例。 在一个实施例中，环境光传感器和光检测器安装在第一和第二间隔件上，第一和第二间隔件依次安装到附接到基板的集成电路芯片的顶表面。 在环境光传感器，光检测器，集成电路，发射器和衬底的周边部分上模制透光的红外线通过化合物。 接下来，将光学上不透光的红外线切割化合物模制到透光性红外线通过化合物上方，以提供不具有金属屏蔽但呈现非常低串扰特性的小型化光学接近传感器。

公开(公告)号：US07495204B2

公开(公告)日：2009-02-24

申请号：US11552036

申请日：2006-10-23

申请人： Jing Zhang ,  Pak Hong Yee ,  Wee Sin Tan

发明人： Jing Zhang ,  Pak Hong Yee ,  Wee Sin Tan

IPC分类号： G01J1/44 ,  H04B10/00 ,  H04B10/06

CPC分类号： G08C23/04

摘要： An RC receiver device and an ambient light photosensor (ALPS) device are mounted on a single mounting device (e.g., circuit board or lead frame substrate) such that they are part of a single composite assembly. This reduces the amount of space that is consumed in electronic devices in which the assemblies are installed, which allows the electronic devices to be made smaller in size. In addition, implementing both the RC receiver device and the ALPS device in a single composite assembly lowers costs associated with manufacturing, assembling and shipping the composite assembly.

摘要翻译： RC接收器装置和环境光光传感器（ALPS）装置安装在单个安装装置（例如，电路板或引线框架基板）上，使得它们是单个复合组件的一部分。 这减少了在其中安装组件的电子设备中消耗的空间量，这允许电子设备的尺寸更小。 此外，在单个复合组件中实现RC接收器装置和ALPS装置降低了与制造，组装和运输复合组件相关的成本。

公开(公告)号：US20080011940A1

公开(公告)日：2008-01-17

申请号：US11552036

申请日：2006-10-23

申请人： Jing Zhang ,  Pak Hong Yee ,  Wee Sin Tan

发明人： Jing Zhang ,  Pak Hong Yee ,  Wee Sin Tan

IPC分类号： G01J1/44 ,  H04B10/06 ,  H05B37/02

CPC分类号： G08C23/04

摘要： An RC receiver device and an ambient light photosensor (ALPS) device are mounted on a single mounting device (e.g., circuit board or lead frame substrate) such that they are part of a single composite assembly. This reduces the amount of space that is consumed in electronic devices in which the assemblies are installed, which allows the electronic devices to be made smaller in size. In addition, implementing both the RC receiver device and the ALPS device in a single composite assembly lowers costs associated with manufacturing, assembling and shipping the composite assembly.

摘要翻译： RC接收器装置和环境光光传感器（ALPS）装置安装在单个安装装置（例如，电路板或引线框架基板）上，使得它们是单个复合组件的一部分。 这减少了在其中安装组件的电子设备中消耗的空间量，这允许电子设备的尺寸更小。 此外，在单个复合组件中实现RC接收器装置和ALPS装置降低了与制造，组装和运输复合组件相关的成本。

公开(公告)号：US09733357B2

公开(公告)日：2017-08-15

申请号：US12623767

申请日：2009-11-23

申请人： James Costello ,  Wee Sin Tan

发明人： James Costello ,  Wee Sin Tan

IPC分类号： G01J5/00 ,  G01S17/02 ,  G01S7/481 ,  H03K17/945

CPC分类号： G01S17/026 ,  G01S7/4813 ,  H01L2224/48091 ,  H01L2224/48247 ,  H03K17/945 ,  Y10T29/49002 ,  H01L2924/00014

摘要： Disclosed are various embodiments of an infrared proximity sensor package comprising an infrared transmitter die, an infrared receiver die, a housing comprising sidewalls, a first recess, a second recess, a partitioning divider disposed between the first and second recesses, and an overlying shield comprising an infrared-absorbing material. The transmitter die is positioned in the first recess, and the receiver die is positioned within the second recess. The partitioning divider comprises liquid crystal polymer (LCP) such that the partitioning divider and the infrared-absorbing material of the shield cooperate together to substantially attenuate and absorb undesired infrared light that might otherwise become internally-reflected within the housing or incident upon the receiver as a false proximity or object detection signal.

公开(公告)号：US08841597B2

公开(公告)日：2014-09-23

申请号：US12979071

申请日：2010-12-27

申请人： James Costello ,  Wee Sin Tan ,  Kai Koon Lee ,  Rani Saravanan

发明人： James Costello ,  Wee Sin Tan ,  Kai Koon Lee ,  Rani Saravanan

IPC分类号： H01J40/14 ,  H05K5/02 ,  G01J5/20

CPC分类号： G01D11/245

摘要： An optical proximity sensor and housing for the same are disclosed. The housing is provided with at least two support structures and at least two modules. A first of the support structures transfers vertical forces applied to one end of a module to an opposite end of the opposite module. A second of the support structures inhibits a pivoting of the modules about the first support structure.

摘要翻译： 公开了一种用于其的光学接近传感器和壳体。 壳体设置有至少两个支撑结构和至少两个模块。 支撑结构中的第一个将施加到模块的一端的垂直力传递到相对模块的相对端。 支撑结构中的第二个阻止了模块围绕第一支撑结构的枢转。

公开(公告)号：US08502151B2

公开(公告)日：2013-08-06

申请号：US12697276

申请日：2010-01-31

申请人： Yufeng Yao ,  Junhua He ,  Wee Sin Tan

发明人： Yufeng Yao ,  Junhua He ,  Wee Sin Tan

IPC分类号： G01J5/20 ,  G01J5/02 ,  H01L27/146 ,  H01L31/0232 ,  H01L31/0203 ,  H01L21/00

CPC分类号： H01L31/0203 ,  G01S7/4813 ,  G01S17/026 ,  H01L31/173 ,  H01L2224/48247 ,  H01L2224/49171 ,  H01L2924/3025 ,  H01L2924/00

摘要： Various embodiments of an optical proximity sensor having a lead frame and no overlying metal shield are disclosed. In one embodiment, a light emitter and a light detector are mounted on a lead frame comprising a plurality of discrete electrically conductive elements having upper and lower surfaces, at least some of the elements not being electrically connected to one another. An integrated circuit is die-attached to an underside of the lead frame. An optically-transmissive infrared pass compound is molded over the light detector and the light emitter and portions of the lead frame. Next, an optically non-transmissive infrared cut compound is molded over the optically-transmissive infrared pass compound to provide an optical proximity sensor having no metal shield but exhibiting very low crosstalk characteristics.

摘要翻译： 公开了具有引线框并且没有上覆金属屏蔽的光学接近传感器的各种实施例。 在一个实施例中，光发射器和光检测器安装在引线框架上，该引线框架包括具有上表面和下表面的多个分立的导电元件，至少一些元件不彼此电连接。 集成电路芯片附着在引线框架的下侧。 在光检测器和光发射器和引线框架的部分上模制光学透射的红外通过化合物。 接下来，在透光性红外线通过化合物上模制光学上不透光的红外线切割化合物，以提供没有金属屏蔽但具有非常低的串扰特性的光学接近传感器。

公开(公告)号：US20110204233A1

公开(公告)日：2011-08-25

申请号：US13098436

申请日：2011-04-30

申请人： James Costello ,  Rani Saravanan ,  Wee Sin Tan

发明人： James Costello ,  Rani Saravanan ,  Wee Sin Tan

IPC分类号： G01J5/20 ,  G01J5/10 ,  B23P11/00

CPC分类号： G01S7/4813 ,  G01S17/026 ,  H03K17/941 ,  H03K2017/9455 ,  H03K2217/94108 ,  Y10T29/49826

摘要： An optical proximity sensor is provided that comprises an infrared light emitter an infrared light detector, a first molded optically transmissive infrared light pass component disposed over and covering the light emitter and a second molded optically transmissive infrared light pass component disposed over and covering the light detector. Located in-between the light emitter and the first molded optically transmissive infrared light pass component, and the light detector and the second molded optically transmissive infrared light pass component is a gap. Layers of infrared opaque, attenuating or blocking material are disposed on at least some of the external surfaces forming the gap to substantially attenuate or block the transmission of undesired direct, scattered or reflected light between the light emitter and the light detector, and thereby minimize optical crosstalk and interference between the light emitter and the light detector.

摘要翻译： 提供了一种光学接近传感器，其包括红外光发射器，红外光检测器，设置在光发射器上方并覆盖光发射器的第一模制透光红外光通过部件和设置在光检测器上方并覆盖光检测器的第二模制透光红外光通过部件 。 位于光发射器和第一模制透光型红外光通过部件之间，光检测器和第二模制光透射型红外光通过部件是间隙。 红外不透明，衰减或阻挡材料的层设置在形成间隙的至少一些外表面上，以基本上衰减或阻挡光发射器和光检测器之间的不期望的直接，散射或反射光的透射，从而最小化光 光发射器和光检测器之间的串扰和干扰。