公开(公告)号：US20190326144A1

公开(公告)日：2019-10-24

申请号：US16388394

申请日：2019-04-18

Applicant: LG ELECTRONICS INC.

Inventor： Bongchu SHIM ,  Dohee KIM ,  Changseo PARK ,  Hyunwoo CHO

IPC: H01L21/67 ,  H01L25/075 ,  H01L33/62 ,  H01L33/00 ,  B65G47/92

Abstract: The present invention relates to a device and method for self-assembling semiconductor light-emitting diodes. Particularly, a method for manufacturing a display device according to the present invention includes: feeding a substrate to an assembly site and putting semiconductor light-emitting diodes having a magnetic material into a fluid chamber; applying a magnetic force to the semiconductor light-emitting diodes so that the semiconductor light-emitting diodes move in one direction within the fluid chamber; and guiding the semiconductor light-emitting diodes to preset positions on the substrate by applying an electric field, so that the semiconductor light-emitting diodes are mounted at the preset positions while in the process of being moved.

公开(公告)号：US20250040321A1

公开(公告)日：2025-01-30

申请号：US18576641

申请日：2021-07-05

Applicant: LG ELECTRONICS INC.

Inventor： Kitae AN ,  Bongchu SHIM ,  Hyunwoo CHO

IPC: H01L33/58 ,  H01L25/075 ,  H01L25/16 ,  H01L33/00 ,  H01L33/52 ,  H01L33/62

Abstract: The present invention can be applied to a technical field relating to display devices, and relates to a modular display device using, for example, light-emitting devices and to a method for manufacturing same. The present invention comprises: at least two display modules, each including a substrate having a first surface and a second surface, and a plurality of semiconductor light-emitting devices mounted on the first surface of the substrate; a light-absorbing layer positioned in a gap between the display modules; and an encapsulation layer positioned on the first surfaces of the display modules, wherein the light-absorbing layer may include: a first section positioned on the first surface of the substrate; a second section positioned in a gap between the display modules adjacent to each other; and a third section positioned on the second surface of the substrate.

公开(公告)号：US20240120218A1

公开(公告)日：2024-04-11

申请号：US18275548

申请日：2021-02-03

Applicant: LG ELECTRONICS INC.

Inventor： Kitae AN ,  Bongchu SHIM ,  Jinhyung JUN

IPC: H01L21/67 ,  H01L21/683

CPC classification number: H01L21/67144 ,  H01L21/67259 ,  H01L21/6833 ,  H01L25/0753

Abstract: Embodiments relate to an electrode structure of a transfer roller part of a semiconductor light emitting device and an intelligent assembly-transfer integration device including the same. Electrode structure of transfer roller part of semiconductor light emitting device according to an embodiment can include a roller rotating part, an assembly substrate mounted on the roller rotating part, an adhesive film disposed between the roller rotating part and the assembly substrate, penetration electrodes penetrating the assembly substrate and roller pad electrodes disposed on the roller rotating part and electrically connected to the penetration electrodes.

公开(公告)号：US20230059135A1

公开(公告)日：2023-02-23

申请号：US17784271

申请日：2020-01-31

Applicant: LG ELECTRONICS INC.

Inventor： Wonjae CHANG ,  Bongchu SHIM ,  Gunho KIM

IPC: H01L33/48 ,  H01L25/16

Abstract: A method for manufacturing a display device related to a micro-light-emitting diode (micro-LED) according to an embodiment of the present disclosure comprises the steps of: moving an assembly device comprising a magnetic body, while the assembly device is in contact or not in contact with an assembly substrate (a chamber filled with fluid is positioned below the assembly device and the assembly substrate, wherein a plurality of specific semiconductor light-emitting diodes are included in the chamber); on the basis of a magnetic field generated by the assembly device, moving the plurality of specific semiconductor light-emitting diodes in the chamber in a direction in which the assembly substrate is positioned; arranging, in first-type assembly grooves in the assembly substrate, a first group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes; and arranging, in second-type assembly grooves in the assembly substrate, a second group of semiconductor light-emitting diodes from among the plurality of specific semiconductor light-emitting diodes.

公开(公告)号：US20220352445A1

公开(公告)日：2022-11-03

申请号：US17619852

申请日：2019-07-09

Applicant: LG ELECTRONICS INC.

Inventor： Gunho KIM ,  Bongchu SHIM ,  Youngdo KIM

IPC: H01L33/62 ,  H01L33/00 ,  H01L27/15 ,  H01L33/38

Abstract: Discussed is an assembly board including a base portion; a plurality of assembly electrodes extending in one direction and disposed on the base portion at predetermined intervals; a dielectric layer stacked on the base portion to cover the plurality of assembly electrodes; barrier ribs stacked on the dielectric layer and defining cells in which semiconductor light emitting diodes are seated at the predetermined intervals along an extending direction of the plurality of assembly electrodes so as to overlap a portion of the plurality of assembly electrodes; and a voltage applying unit connected to at least opposite ends of the plurality of assembly electrodes to apply one or more voltage signals to the plurality of assembly electrodes, wherein a voltage signal of the same polarity is applied to the plurality of assembly electrodes from the voltage applying unit connected to the opposite ends.

公开(公告)号：US20220223437A1

公开(公告)日：2022-07-14

申请号：US17612881

申请日：2019-05-28

Applicant: LG ELECTRONICS INC.

Inventor： Hyunho LEE ,  Bongchu SHIM ,  Gunho KIM

IPC: H01L21/67 ,  H01L25/075

Abstract: A self-assembly apparatus and method of the present invention for semiconductor light-emitting devices can separate semiconductor light-emitting devices attached to each other by vibrating a fluid during self-assembly to thereby prevent mis-assembly and, for smooth assembly of the semiconductor light emitting devices, generate a flow of the fluid along the movement direction of a magnet. The self-assembly apparatus comprises: a chamber in which a plurality of semiconductor light-emitting devices comprising a magnetic substance and a fluid are accommodated; a transfer unit for transferring, to an assembly location, a substrate on which the semiconductor light-emitting devices are to be assembled; a magnet spaced apart from the chamber to apply a magnetic force to the semiconductor light-emitting devices; a location control unit for controlling a location of the magnet; and a vibration generation unit for generating vibration in the fluid to thereby separate the semiconductor light-emitting devices from each other.

公开(公告)号：US20220115361A1

公开(公告)日：2022-04-14

申请号：US17558309

申请日：2021-12-21

Applicant: LG ELECTRONICS INC.

Inventor： Juchan CHOI ,  Changseo PARK ,  Bongchu SHIM ,  Kiseong JEON

IPC: H01L25/075 ,  H01L25/16

Abstract: Discussed is a display device, including a substrate having an assembly region and a non-assembly region, semiconductor light emitting devices arranged on the substrate, a first wiring electrode and a second wiring electrode extended from each of the semiconductor light emitting devices, respectively, to supply an electric signal to the semiconductor light emitting devices, pair electrodes arranged on the substrate to generate an electric field when an electric current is supplied, and provided with first and second pair electrodes disposed on an opposite side to the first and second wiring electrodes with respect to the semiconductor light emitting devices, a dielectric layer disposed on the pair electrodes, and bus electrodes electrically connected to the pair electrodes, wherein the pair electrodes are arranged in parallel to each other along a direction in the assembly region, and wherein the bus electrodes are disposed in the non-assembly region.

公开(公告)号：US20190326477A1

公开(公告)日：2019-10-24

申请号：US16415583

申请日：2019-05-17

Applicant: LG ELECTRONICS INC.

Inventor： Junghoon KIM ,  Changseo PARK ,  Bongchu SHIM ,  Byoungkwon CHO ,  Hyunwoo CHO

IPC: H01L33/38 ,  H01L33/20 ,  H01L33/40 ,  H01L33/62 ,  H01L33/44 ,  H01L25/075 ,  H01L33/00

Abstract: The present disclosure relates a display device including a semiconductor light emitting device, and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed at an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer, and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction, wherein when the semiconductor light emitting device is assembled into the receiving groove, the first conductive semiconductor layer has an asymmetrical shape with respect to at least one direction so that the first conductive electrode and the second conductive electrode are arranged at preset positions.

公开(公告)号：US20160240517A1

公开(公告)日：2016-08-18

申请号：US14794305

申请日：2015-07-08

Applicant: LG ELECTRONICS INC.

Inventor： Chisun KIM ,  Byungjoon RHEE ,  Bongchu SHIM

IPC: H01L25/075 ,  H01L33/62 ,  H01L33/38

CPC classification number: H01L25/0753 ,  G09F9/33 ,  H01L33/20 ,  H01L33/62 ,  H01L2224/95 ,  H05K1/189 ,  H05K3/323 ,  H05K3/4682 ,  H05K2201/10106 ,  H05K2201/10128

Abstract: A display device including a wiring substrate having a wiring electrode; a plurality of semiconductor light emitting devices which form pixels; and a conductive adhesive layer configured to electrically connect the wiring electrode with the plurality of semiconductor light emitting devices. Further, the conductive adhesive layer includes a body provided with a resin having an adhesive property; and a metallic aggregation part disposed in the body, and formed as metallic atoms precipitated from a metal-organic compound and aggregated with each other.

Abstract translation: 一种显示装置，包括具有布线电极的布线基板; 多个形成像素的半导体发光器件; 以及导电性粘合剂层，其被配置为将所述布线电极与所述多个半导体发光器件电连接。 此外，导电性粘合剂层包括具有粘合性的树脂的本体; 金属凝集体，其设置在体内，形成为从金属有机化合物析出的金属原子，并且彼此聚集。

公开(公告)号：US20140057256A1

公开(公告)日：2014-02-27

申请号：US13892820

申请日：2013-05-13

Applicant: KOREA ADVANCED INSTITUTE OF SCIENCE AND TECHNOLOGY ,  LG ELECTRONICS INC.

Inventor： Bongchu SHIM ,  Hyungyu PARK ,  Songyi BAEK ,  Byoungyeon WON ,  Jitae KIM ,  Seongmoon CHO

IPC: C12Q1/68

CPC classification number: C12Q1/689 ,  C12Q1/6816 ,  C12Q2525/205 ,  C12Q2525/301 ,  C12Q2563/113 ,  C12Q2563/137

Abstract: The present invention relates to a hairpin-type probe for detecting a target substance and a method for detecting a target substance using the probe. The hairpin-type probe comprises a loop comprising a target substance recognition site, and a stem comprising an aptamer having an electrochemical signaling material bound thereto. The hairpin structure is broken when it is hybridized to the target substance, and thus the signaling material is separated from the aptamer and can freely move to the electrode. Based on the change in the electrochemical signal generated from the signaling material, the amount of the target substance can be accurately detected in real-time.

Abstract translation: 本发明涉及用于检测目标物质的发夹型探针和使用探针检测目标物质的方法。 发夹型探针包括包含靶物质识别位点的环，和包含具有结合于其上的电化学信号材料的适体的茎。 当与靶物质杂交时，发夹结构断裂，因此信号传导材料与适体分离并可自由移动至电极。 基于从信号材料产生的电化学信号的变化，可以实时准确地检测目标物质的量。