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    FLEXIBLE CIRCUIT BOARD, COF MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME
    12.
    发明申请
    FLEXIBLE CIRCUIT BOARD, COF MODULE AND ELECTRONIC DEVICE INCLUDING THE SAME 有权

    公开(公告)号：US20210084755A1

    公开(公告)日：2021-03-18

    申请号：US17106039

    申请日：2020-11-27

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON ,  Min Hwan KIM

    IPC: H05K1/02 ,  H01L23/498 ,  H01L23/00 ,  H01L21/48 ,  H05K1/14 ,  H05K3/28 ,  H05K3/18

    Abstract: A flexible circuit board includes a substrate a, a wiring pattern layer provided on the first surface of the substrate, a plating layer provided on the wiring pattern layer and including an open area, and a protective layer that contacts parts of the wiring pattern layer, the plating layer, and the substrate. The protective layer has a larger thickness than a thickness of the plating layer. The first protective layer includes a first overlapping region in which the plating layer and protective layer are in contact with each and a second overlapping region in which the plating layer and the protective layer are in contact with each other. A width of the first overlapping region may be different from a width of the second overlapping region, and each of the widths of the first and second overlapping regions is larger than a thickness of the plating layer.

    FLEXIBLE CIRCUIT BOARD FOR ALL-IN-ONE CHIP ON FILM, CHIP PACKAGE INCLUDING SAME, AND ELECTRONIC DEVICE INCLUDING SAME
    13.
    发明申请
    FLEXIBLE CIRCUIT BOARD FOR ALL-IN-ONE CHIP ON FILM, CHIP PACKAGE INCLUDING SAME, AND ELECTRONIC DEVICE INCLUDING SAME 有权

    公开(公告)号：US20210045229A1

    公开(公告)日：2021-02-11

    申请号：US16614192

    申请日：2018-05-09

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jun Young LIM ,  Jong Seok PARK ,  Hyung Kyu YOON ,  Seong Hwan IM ,  Gi Uk YANG ,  Dae Sung YOO

    IPC: H05K1/02 ,  H05K3/28 ,  H05K3/46 ,  H05K1/14

    Abstract: A flexible circuit board for all-in-one chip on film according to an embodiment may include: a substrate; a conductive pattern part disposed on the substrate; and a protective layer partially disposed on the conductive pattern part, wherein the conductive pattern part includes a first conductive pattern part and a second conductive pattern part which are spaced apart from each other, each of the first conductive pattern part and the second conductive pattern part includes a wiring pattern layer, a first plating layer, and a second plating layer that are sequentially placed on the substrate, the first conductive pattern part includes a first open region in which the protective layer is open, the second conductive pattern part includes a second open region in which the protective layer is open, and a content of tin of the second plating layer in the first open region is greater than that of the second plating layer in the second open region.

    COMPOSITE SENSOR PACKAGE
    14.
    发明申请
    COMPOSITE SENSOR PACKAGE 审中-公开

    公开(公告)号：US20200300676A1

    公开(公告)日：2020-09-24

    申请号：US16089499

    申请日：2017-03-30

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jeong Gi SEO ,  Ki Chul CHANG ,  Sun Hwa LEE ,  Jun Young LIM

    IPC: G01D21/02 ,  B81B3/00

    Abstract: A composite sensor package includes: a substrate; a first sensor and a second sensor, which are arranged on the substrate with a predetermined gap therebetween; a signal processing device disposed on the substrate and processing a signal transmitted through the first and second sensors; and a cover disposed on the substrate, and including a package accommodation space enclosing the first sensor, the second sensor and the signal processing device, wherein the first sensor senses a state of air introduced from an outside and transmits the introduced air to the package accommodation space, and the second sensor senses the state of the air, which passes through the first sensor so as to flow into the package accommodation space.

    CAMERA MODULE AND VEHICLE COMPRISING SAME
    15.
    发明申请
    CAMERA MODULE AND VEHICLE COMPRISING SAME 有权

    公开(公告)号：US20240369800A1

    公开(公告)日：2024-11-07

    申请号：US18560873

    申请日：2022-05-13

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Se Yeon CHOI ,  Sung Jin PARK ,  Seung Won SEOK ,  Jun Young LIM

    IPC: G02B7/02 ,  H04N23/55

    Abstract: The camera module disclosed in the embodiment of the invention includes a lens barrel having a through hole therein; and a lens part disposed in the through hole of the lens barrel and having first to third lenses in which optical axis are aligned from the object side toward the sensor side, and an image sensor. The materials of the second lens and the first lens are different, the refractive index of the second lens is lower than that of the first lens. Each of the first to third lenses includes first to third flange portions extending from the optical axis toward the inner surface of the lens barrel, an outer diameter of the lens barrel at a position where an upper portion of the first flange and the lens barrel are in contact is a first outer diameter, an outer diameter of the lens barrel at a position where an upper portion of the second flange portion and the lens barrel are in contact is a second outer diameter, an outer diameter of the lens barrel at a position where an upper portion of the third flange and the lens barrel are in contact is a third outer diameter, an outer diameter of the lens barrel at a position where an upper portion of the image sensor and the lens barrel are in contact is a four outer diameter, and the third outer diameter is smaller than the fourth outer diameter and greater than the second outer diameter.

    LENS DRIVING DEVICE
    17.
    发明申请
    LENS DRIVING DEVICE 有权

    公开(公告)号：US20230065237A1

    公开(公告)日：2023-03-02

    申请号：US17908351

    申请日：2021-03-19

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Deok Ki HWANG ,  Jun Young LIM ,  Jae Hoon JUN

    IPC: G03B3/10

    Abstract: The present embodiment relates to a lens driving device comprising: a lens barrel; a lens disposed in the lens barrel; and a driving unit disposed in the lens barrel, wherein: the driving unit includes a piezoelectric element expanding or contracting in a direction perpendicular to an optical axis direction of the lens when a voltage is applied thereto, a first member disposed on the piezoelectric element, and a second member coupled to the first member and disposed in the lens barrel; the lens barrel moves in the optical axis direction of the lens when the voltage is applied to the piezoelectric element; and a first length in the lengthwise direction of the first member is shorter than a second length in the lengthwise direction of the second member.

    CAMERA MODULE AND VEHICLE COMPRISING SAME
    19.
    发明申请
    CAMERA MODULE AND VEHICLE COMPRISING SAME 有权

    公开(公告)号：US20250060557A1

    公开(公告)日：2025-02-20

    申请号：US18721044

    申请日：2022-12-16

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jun Young LIM ,  Sung Jin PARK ,  Se Yeon CHOI

    IPC: G02B7/02 ,  G03B30/00

    Abstract: The camera module disclosed in the embodiment of the invention includes a lens barrel having an opening; and a lens portion disposed within the opening and having a plurality of lenses which an optical axis is aligned from an object side toward a sensor side, wherein the lens barrel includes a lens fixing portion to which the plurality of lenses is fixed; a holder coupling portion spaced apart from the lens fixing portion; a connection frame connected between the lens fixing portion and the holder coupling portion; and a buffer space disposed between the lens fixing portion and the holder coupling portion and disposed at a lower portion of the connection frame, wherein the buffer space overlaps a flange portion of one or two lenses adjacent to the sensor side among the plurality of lenses in a horizontal direction, and the horizontal direction may be a direction orthogonal to the optical axis.

    FLEXIBLE CIRCUIT BOARD
    20.
    发明申请
    FLEXIBLE CIRCUIT BOARD 有权

    公开(公告)号：US20240414842A1

    公开(公告)日：2024-12-12

    申请号：US18811400

    申请日：2024-08-21

    Applicant: LG INNOTEK CO., LTD.

    Inventor： Jun Young LIM ,  Woong Sik KIM ,  Hyung Kyu YOON

    IPC: H05K1/09 ,  H05K1/02 ,  H05K1/03 ,  H05K1/11 ,  H05K1/18 ,  H05K3/24 ,  H05K3/28 ,  H05K3/34

    Abstract: A flexible printed circuit board (FPCB), which is applied to various electronic display devices, may include a base, a first metal layer and a second metal layer on both surfaces of the base, a first plating layer on the first metal layer, a second plating layer on the second metal layer, and a first insulating pattern and a second insulating pattern respectively disposed on some region of the first plating layer and the second plating layer, wherein the first plating layer and the second plating layer may have different thicknesses.

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