公开(公告)号：US10260724B2

公开(公告)日：2019-04-16

申请号：US15946420

申请日：2018-04-05

Applicant: LG INNOTEK CO., LTD.

Inventor： Chul Ho Jang ,  Bo Hee Kang ,  Ki Hyun Kim

IPC: F21V33/00 ,  F21V29/503 ,  F21V3/00 ,  F21V23/00 ,  F21V29/77 ,  F21V29/70 ,  F21K9/232 ,  F21K9/23 ,  F21K9/238 ,  F21V3/06 ,  F21Y115/10 ,  F21Y107/30 ,  F21Y107/40 ,  F21Y101/00

Abstract: A lighting device may be provided that includes: a heat sink which includes a top surface and a member which has a side and is disposed on the top surface; a light source which includes a substrate disposed on the side of the member and light emitting devices disposed on the substrate, and has a reference point; and a cover which is coupled to the heat sink and includes an upper portion and a lower portion, which are divided by an imaginary plane passing through the reference point and being parallel with the top surface of the heat sink, wherein a distance from the reference point of the light source to the upper portion of the cover is larger than a distance from the reference point of the light source to the lower portion of the cover.

公开(公告)号：US09970644B2

公开(公告)日：2018-05-15

申请号：US15633294

申请日：2017-06-26

Applicant: LG INNOTEK CO., LTD.

Inventor： Chul Ho Jang ,  Bo Hee Kang ,  Ki Hyun Kim

IPC: F21V33/00 ,  F21V29/503 ,  F21V3/00 ,  F21V23/00 ,  F21V29/77 ,  F21V29/70 ,  F21K9/232 ,  F21V3/04 ,  F21K9/23 ,  F21K9/238 ,  F21Y115/10 ,  F21Y107/30 ,  F21Y107/40 ,  F21Y101/00

CPC classification number: F21V29/503 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V3/0625 ,  F21V23/006 ,  F21V29/70 ,  F21V29/77 ,  F21V29/777 ,  F21Y2101/00 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: A lighting device may be provided that includes: a heat sink which includes a top surface and a member which has a side and is disposed on the top surface; a light source which includes a substrate disposed on the side of the member and light emitting devices disposed on the substrate, and has a reference point; and a cover which is coupled to the heat sink and includes an upper portion and a lower portion, which are divided by an imaginary plane passing through the reference point and being parallel with the top surface of the heat sink, wherein a distance from the reference point of the light source to the upper portion of the cover is larger than a distance from the reference point of the light source to the lower portion of the cover.

公开(公告)号：US09719671B2

公开(公告)日：2017-08-01

申请号：US15096992

申请日：2016-04-12

Applicant: LG INNOTEK CO., LTD.

Inventor： Chul Ho Jang ,  Bo Hee Kang ,  Ki Hyun Kim

IPC: F21V29/503 ,  F21V3/00 ,  F21V23/00 ,  F21V29/77 ,  F21V29/70 ,  F21K9/232 ,  F21V3/04 ,  F21K9/23 ,  F21K9/238 ,  F21Y115/10 ,  F21Y107/30 ,  F21Y107/40 ,  F21Y101/02 ,  F21Y111/00

CPC classification number: F21V29/503 ,  F21K9/23 ,  F21K9/232 ,  F21K9/238 ,  F21V3/00 ,  F21V3/0625 ,  F21V23/006 ,  F21V29/70 ,  F21V29/77 ,  F21V29/777 ,  F21Y2101/00 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: A lighting device may be provided that includes: a heat sink which includes a top surface and a member which has a side and is disposed on the top surface; a light source which includes a substrate disposed on the side of the member and light emitting devices disposed on the substrate, and has a reference point; and a cover which is coupled to the heat sink and includes an upper portion and a lower portion, which are divided by an imaginary plane passing through the reference point and being parallel with the top surface of the heat sink, wherein a distance from the reference point of the light source to the upper portion of the cover is larger than a distance from the reference point of the light source to the lower portion of the cover.

公开(公告)号：US09303822B2

公开(公告)日：2016-04-05

申请号：US14812843

申请日：2015-07-29

Applicant: LG INNOTEK CO., LTD.

Inventor： Ki Hyun Kim ,  Eun Hwa Kim ,  Bo Hee Kang

IPC: F21V29/00 ,  F21K99/00 ,  F21V29/77 ,  F21V3/02 ,  F21V3/04 ,  F21Y101/02 ,  F21Y111/00

CPC classification number: F21K9/64 ,  F21K9/23 ,  F21K9/232 ,  F21V3/02 ,  F21V3/062 ,  F21V3/08 ,  F21V3/10 ,  F21V5/04 ,  F21V5/048 ,  F21V7/0016 ,  F21V23/009 ,  F21V29/773 ,  F21V29/87 ,  F21V29/89 ,  F21Y2101/00 ,  F21Y2107/30 ,  F21Y2107/40 ,  F21Y2115/10

Abstract: A lighting device may be provided that includes: a heat sink; a member which has a polygonal pillar shape having at least three sides and is disposed on the heat sink, wherein the sides are inclined at a predetermined angle toward the center of the heat sink; and a light source which is disposed on at least one among the sides of the member, wherein the light source includes: a substrate; at least two light emitting devices which are symmetrically disposed on the substrate with respect to the center of the substrate; and at least two lens units which are disposed on the light emitting devices respectively, and consequently, it is possible to meet U.S. Energy Star and ANSI specifications, to remarkably improve rear light distribution characteristics and to remove a dark portion.

公开(公告)号：US09076949B2

公开(公告)日：2015-07-07

申请号：US14496486

申请日：2014-09-25

Applicant: LG Innotek Co., Ltd.

Inventor： Byung Mok Kim ,  Bo Hee Kang ,  Ha Na Kim ,  Hiroshi Kodaira ,  Yuichiro Tanda ,  Satoshi Ozeki

IPC: H01L33/64 ,  A61L2/08 ,  F21V31/00 ,  H01L33/62 ,  A61L2/10

CPC classification number: H01L33/62 ,  A61L2/08 ,  A61L2/10 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

Abstract: A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.

Abstract translation: 一种发光器件封装，包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件;散热构件，其布置在封装主体中以与第 发光装置和放置在散热构件上的抗断裂层，其中散热构件的宽度在封装体的不同高度处不同。

公开(公告)号：US20150048262A1

公开(公告)日：2015-02-19

申请号：US14496486

申请日：2014-09-25

Applicant: LG Innotek Co., Ltd.

Inventor： Byung Mok Kim ,  Bo Hee Kang ,  Ha Na Kim ,  Hiroshi Kodaira ,  Yuichiro Tanda ,  Satoshi Ozeki

IPC: H01L33/64 ,  A61L2/10

CPC classification number: H01L33/62 ,  A61L2/08 ,  A61L2/10 ,  H01L33/38 ,  H01L33/483 ,  H01L33/486 ,  H01L33/641 ,  H01L33/642 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2924/15174 ,  H01L2924/00014

Abstract: A light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, and an anti-fracture layer placed on the heat dissipation member, wherein a width of the heat dissipation member is different at different heights of the package body.

Abstract translation: 一种发光器件封装，其包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件;散热构件，其布置在封装主体中以与第 发光装置和放置在散热构件上的抗断裂层，其中散热构件的宽度在封装体的不同高度处不同。