Lens and light emitting diode package including same

    公开(公告)号:US09997681B2

    公开(公告)日:2018-06-12

    申请号:US15541926

    申请日:2016-01-15

    Inventor: Ki Hyun Kim

    Abstract: One embodiment relates to a lens comprising: a lower end portion having an incident surface to which light is incident; and an upper end portion having an emitting surface allowing the light having passed through the incident surface to pass therethrough, wherein the ratio of an incidence angle and an emission angle on a first plane and/or the ratio of an incidence angle and an emission angle on a second plane is smaller than the ratio of an incidence angle and an emission angle on a third plane, the incidence angle is an angle of the light incident to the incident surface with respect to a center axis, the emission angle is an angle of the light emitted from the emitting surface with respect to the center axis, each of the first to third planes is a plane passing the center axis and is parallel to a first direction, the first plane is perpendicular to the second plane, the third plane is positioned between the first plane and the second plane, the center axis passes the center of the lens and is parallel to the first direction, and the first direction is a direction facing the lower end portion from the upper end portion.

    Lighting device
    3.
    发明授权
    Lighting device 有权
    照明设备

    公开(公告)号:US09557010B2

    公开(公告)日:2017-01-31

    申请号:US15052609

    申请日:2016-02-24

    Abstract: A lighting device may be provided that includes: a heat sink; a member which has a polygonal pillar shape having at least three sides and is disposed on the heat sink, wherein the sides are inclined at a predetermined angle toward the center of the heat sink; and a light source which is disposed on at least one among the sides of the member, wherein the light source includes: a substrate; at least two light emitting devices which are symmetrically disposed on the substrate with respect to the center of the substrate; and at least two lens units which are disposed on the light emitting devices respectively, and consequently, it is possible to meet U.S. Energy Star and ANSI specifications, to remarkably improve rear light distribution characteristics and to remove a dark portion.

    Abstract translation: 可以提供照明装置,其包括:散热器; 具有至少三个侧面并且设置在所述散热器上的多边形柱状的构件,其中所述侧面朝向所述散热器的中心以预定角度倾斜; 以及设置在所述构件的所述侧面中的至少一个中的光源,其中所述光源包括:基板; 至少两个相对于衬底的中心对称地设置在衬底上的发光器件; 以及分别设置在发光装置上的至少两个透镜单元,因此,可以满足美国能源之星和ANSI规格,以显着改善后分布特性并去除暗部分。

    Lighting device
    4.
    发明授权
    Lighting device 有权
    照明设备

    公开(公告)号:US09347658B2

    公开(公告)日:2016-05-24

    申请号:US14258851

    申请日:2014-04-22

    Abstract: A lighting device may be provided that comprises: a heat sink comprising a top surface and coupling structures which comprise a first coupling structure and a second coupling structure formed on a side surface of the heat sink; a light source disposed on the top surface of the heat sink; a lens unit disposed on the light source and comprising a first coupling portion which is coupled to the first coupling structure of the heat sink; and a cover unit comprising an optical member which is disposed on the lens unit, and a second coupling portion which is coupled to the second coupling structure of heat sink.

    Abstract translation: 可以提供照明装置,其包括:散热器,其包括顶表面和耦合结构,所述耦合结构包括形成在散热器的侧表面上的第一耦合结构和第二耦合结构; 设置在散热器的顶表面上的光源; 透镜单元,设置在所述光源上并且包括耦合到所述散热器的所述第一耦合结构的第一耦合部分; 以及包括设置在透镜单元上的光学构件的盖单元和耦合到散热器的第二耦合结构的第二耦合部分。

    LIGHT EMITTING PACKAGE
    6.
    发明申请
    LIGHT EMITTING PACKAGE 有权
    发光包

    公开(公告)号:US20150054005A1

    公开(公告)日:2015-02-26

    申请号:US14378214

    申请日:2013-01-24

    Abstract: A light emitting device package may be provided that includes: a substrate; a first light emitting chip disposed on the substrate; a plurality of second light emitting chips disposed on the outer circumference of the first light emitting chip; and a lens formed on the first and the second light emitting chips.

    Abstract translation: 可以提供发光器件封装,其包括:衬底; 设置在所述基板上的第一发光芯片; 设置在第一发光芯片的外周上的多个第二发光芯片; 以及形成在第一和第二发光芯片上的透镜。

    Light emitting device package
    8.
    发明授权

    公开(公告)号:US10236427B2

    公开(公告)日:2019-03-19

    申请号:US14817732

    申请日:2015-08-04

    Inventor: Ki Hyun Kim

    Abstract: Embodiments provide a light emitting device package including a first lead frame and a second lead frame, a light emitting device electrically connected to each of the first lead frame and the second lead frame, the light emitting device having a first electrode pad asymmetrically formed on a top surface thereof, and a reflective member disposed around the light emitting device to reflect light emitted from the light emitting device. The reflective member is configured such that a standard deviation of tilts of a reflective surface of a first area, in which the first electrode pad is disposed, is greater than a standard deviation of tilts of a reflective surface of a second area opposite to the first area.

    Light-emitting element package and light-emitting element module comprising same

    公开(公告)号:US10103306B2

    公开(公告)日:2018-10-16

    申请号:US15740714

    申请日:2016-05-20

    Inventor: Ki Hyun Kim

    Abstract: Provided is a light-emitting element package, one embodiment comprising: a substrate; a light-emitting element disposed on the substrate; and a molded part surrounding the side surfaces and the top surface of the light-emitting element and having patterns on a surface from which the light incident thereto from the light-emitting element is output, wherein a part of the patterns correspond to a first area corresponding to the light-emitting element, and to a second area around the first area and are arranged at an angular range of 120 to 130 degrees on the surface of the molded part.

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