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公开(公告)号：US09831406B2
公开(公告)日：2017-11-28
申请号：US14729771
申请日：2015-06-03
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
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公开(公告)号：US09842975B2
公开(公告)日：2017-12-12
申请号：US15082091
申请日：2016-03-28
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a first cavity and a second cavity, a pad disposed on a bottom surface of the first cavity, a light emitting device disposed on the second cavity electrically connected to the pad, a heat dissipation member inserted into the package body, the heat dissipation member including a body and expanded portions disposed at a partial edge region of the body and electrode patterns disposed at the package body, wherein the package body has an upper portion and a lower portion disposed under the upper portion, wherein the first cavity including side surfaces and a bottom surface, wherein the second cavity provided in the bottom surface of the first cavity.
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公开(公告)号：US08872195B2
公开(公告)日：2014-10-28
申请号：US14275725
申请日：2014-05-12
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.
Abstract translation: 一种发光器件封装，包括包括多个第一陶瓷层的封装体，放置在封装主体上的至少一个电极图案，与电极图形电连接的至少一个发光器件，以及设置在封装体中的散热构件 本体与发光器件热接触，其中散热构件在对应于不同第一陶瓷层的边界的区域处设置有扩展部分。
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公开(公告)号：US20180238532A1
公开(公告)日：2018-08-23
申请号：US15946420
申请日：2018-04-05
Applicant: LG INNOTEK CO., LTD.
Inventor： Chul Ho Jang , Bo Hee Kang , Ki Hyun Kim
IPC: F21V29/503 , F21K9/23 , F21K9/232 , F21V3/06 , F21V29/77 , F21V3/00 , F21V23/00 , F21V29/70 , F21K9/238 , F21Y101/00 , F21Y107/40 , F21Y107/30 , F21Y115/10
CPC classification number: F21V29/503 , F21K9/23 , F21K9/232 , F21K9/238 , F21V3/00 , F21V3/0625 , F21V23/006 , F21V29/70 , F21V29/77 , F21V29/777 , F21Y2101/00 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10
Abstract: A lighting device may be provided that includes: a heat sink which includes a top surface and a member which has a side and is disposed on the top surface; a light source which includes a substrate disposed on the side of the member and light emitting devices disposed on the substrate, and has a reference point; and a cover which is coupled to the heat sink and includes an upper portion and a lower portion, which are divided by an imaginary plane passing through the reference point and being parallel with the top surface of the heat sink, wherein a distance from the reference point of the light source to the upper portion of the cover is larger than a distance from the reference point of the light source to the lower portion of the cover.
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公开(公告)号：US09893259B2
公开(公告)日：2018-02-13
申请号：US13924167
申请日：2013-06-21
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Hiroshi Kodaira , Su Jung Jung , Bo Hee Kang , Young Jin No , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/642 , H01L33/486 , H01L33/58 , H01L2924/0002 , H01L2924/00
Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
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Patent Agency Ranking
公开(公告)号：US09557010B2
公开(公告)日：2017-01-31
申请号：US15052609
申请日：2016-02-24
Applicant: LG INNOTEK CO., LTD.
Inventor： Ki Hyun Kim , Eun Hwa Kim , Bo Hee Kang
IPC: F21V29/00 , F21K99/00 , F21V5/04 , F21V3/02 , F21V29/77 , F21V7/00 , F21V3/04 , F21V23/00 , F21V29/87 , F21V29/89 , F21Y101/00
CPC classification number: F21K9/64 , F21K9/23 , F21K9/232 , F21V3/02 , F21V3/062 , F21V3/08 , F21V3/10 , F21V5/04 , F21V5/048 , F21V7/0016 , F21V23/009 , F21V29/773 , F21V29/87 , F21V29/89 , F21Y2101/00 , F21Y2107/30 , F21Y2107/40 , F21Y2115/10
Abstract: A lighting device may be provided that includes: a heat sink; a member which has a polygonal pillar shape having at least three sides and is disposed on the heat sink, wherein the sides are inclined at a predetermined angle toward the center of the heat sink; and a light source which is disposed on at least one among the sides of the member, wherein the light source includes: a substrate; at least two light emitting devices which are symmetrically disposed on the substrate with respect to the center of the substrate; and at least two lens units which are disposed on the light emitting devices respectively, and consequently, it is possible to meet U.S. Energy Star and ANSI specifications, to remarkably improve rear light distribution characteristics and to remove a dark portion.
Abstract translation: 可以提供照明装置，其包括：散热器; 具有至少三个侧面并且设置在所述散热器上的多边形柱状的构件，其中所述侧面朝向所述散热器的中心以预定角度倾斜; 以及设置在所述构件的所述侧面中的至少一个中的光源，其中所述光源包括：基板; 至少两个相对于衬底的中心对称地设置在衬底上的发光器件; 以及分别设置在发光装置上的至少两个透镜单元，因此，可以满足美国能源之星和ANSI规格，以显着改善后分布特性并去除暗部分。
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公开(公告)号：US09437791B2
公开(公告)日：2016-09-06
申请号：US14105439
申请日：2013-12-13
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Young Jin No , Bo Hee Kang , Hiroshi Kodaira
IPC: H01L31/12 , H01L27/32 , H01L33/00 , H01L33/62 , H01L23/00 , H01L23/367 , H01L23/498
CPC classification number: H01L33/62 , H01L23/3677 , H01L23/49822 , H01L23/49827 , H01L24/45 , H01L24/48 , H01L2224/32245 , H01L2224/45015 , H01L2224/48091 , H01L2224/48227 , H01L2224/48235 , H01L2224/48455 , H01L2224/48997 , H01L2224/73265 , H01L2224/85951 , H01L2924/00014 , H01L2924/01322 , H01L2924/12035 , H01L2924/12041 , H01L2924/12042 , H01L2924/15174 , H01L2924/15183 , H01L2924/15787 , H01L2924/181 , H01L2224/45099 , H01L2924/20752 , H01L2924/20753 , H01L2924/00 , H01L2924/00012 , H01L2224/85399 , H01L2224/05599
Abstract: Disclosed is a light emitting device package including a package body including at least one electrode pad disposed on a surface thereof, a light emitting device disposed on the package body, the light emitting device being electrically connected to the electrode pad through a wire, and a via hole electrode passing through the package body, wherein the wire forms a stitch on at least one of the light emitting device and the electrode pad, the light emitting device package further includes a bonding ball disposed on the stitch, and the via hole electrode non-overlaps the stitch and the bonding ball in a vertical direction.
Abstract translation: 公开了一种发光器件封装，其包括：封装体，其包括设置在其表面上的至少一个电极焊盘;发光器件，其布置在封装主体上，所述发光器件通过导线电连接到所述电极焊盘;以及 通孔电极通过封装体，其中，所述线在所述发光器件和所述电极焊盘中的至少一个上形成针迹，所述发光器件封装还包括设置在所述线圈上的接合球，并且所述通孔电极非 在垂直方向上重新缝合线圈和接合球。
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公开(公告)号：US20140246604A1
公开(公告)日：2014-09-04
申请号：US14275725
申请日：2014-05-12
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na KIM , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: A light emitting device package including a package body including a plurality of first ceramic layers, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, and a heat dissipation member disposed in the package body to thermally come into contact with the light emitting device, wherein the heat dissipation member is provided with an expanded portion at a region corresponding to a boundary of different first ceramic layers.
Abstract translation: 一种发光器件封装，包括包括多个第一陶瓷层的封装体，放置在封装主体上的至少一个电极图案，与电极图形电连接的至少一个发光器件，以及设置在封装体中的散热构件 本体与发光器件热接触，其中散热构件在对应于不同第一陶瓷层的边界的区域处设置有扩展部分。
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公开(公告)号：US08754423B2
公开(公告)日：2014-06-17
申请号：US14035700
申请日：2013-09-24
Applicant: LG Innotek Co., Ltd.
Inventor： Byung Mok Kim , Bo Hee Kang , Ha Na Kim , Hiroshi Kodaira , Yuichiro Tanda , Satoshi Ozeki
IPC: H01L25/075 , H01L33/02 , H01L33/44
CPC classification number: H01L33/62 , A61L2/08 , A61L2/10 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/641 , H01L33/642 , H01L2224/48091 , H01L2224/48227 , H01L2924/15174 , H01L2924/00014
Abstract: Embodiments provide a light emitting device package including a package body, at least one electrode pattern placed on the package body, at least one light emitting device electrically connected to the electrode pattern, a heat dissipation member inserted into the package body to thermally come into contact with the light emitting device, and a anti-fracture layer placed on the heat dissipation member. The anti-fracture layer vertically overlaps with at least a partial peripheral region of the heat dissipation member.
Abstract translation: 实施例提供了一种发光器件封装，其包括封装体，至少一个放置在封装主体上的电极图案，至少一个电连接到电极图案的发光器件，插入封装主体中以热接触的散热构件 和发光装置，以及设置在散热构件上的抗断裂层。 抗断裂层与散热构件的至少一部分周边区域垂直重叠。
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公开(公告)号：US10388841B2
公开(公告)日：2019-08-20
申请号：US15863146
申请日：2018-01-05
Applicant: LG INNOTEK CO., LTD.
Inventor： Byung Mok Kim , Hiroshi Kodaira , Su Jung Jung , Bo Hee Kang , Young Jin No , Yuichiro Tanda , Satoshi Ozeki
Abstract: A light emitting device may include a substrate; a body which is disposed on the substrate and has a first hole having a predetermined size and a light emitting chip which is disposed within a cavity formed by the substrate and the first hole of the body. A cap may be disposed on the body and may have a second hole having a predetermined size. A transparent window may be disposed in the second hole. A lower portion of the cap is divided into a first surface and a second surface more projecting downwardly than the first surface, and at least a portion of the first surface is attached and fixed to the body.
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