公开(公告)号：US09944831B2

公开(公告)日：2018-04-17

申请号：US15021094

申请日：2014-09-24

Applicant: LINTEC CORPORATION

Inventor： Wataru Morita ,  Kunihisa Kato ,  Tsuyoshi Mutou

IPC: C09J7/00 ,  C09J9/02 ,  H01L35/32 ,  C09J9/00 ,  C09J11/04 ,  C09J175/04 ,  C09J183/04 ,  C09J201/00 ,  H01L35/30 ,  H01L35/34 ,  C08G18/62 ,  C08G18/81 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K3/38

CPC classification number: C09J7/00 ,  C08G18/6229 ,  C08G18/6254 ,  C08G18/8116 ,  C08K3/08 ,  C08K3/22 ,  C08K3/28 ,  C08K2003/385 ,  C08K2201/001 ,  C09J7/10 ,  C09J9/00 ,  C09J9/02 ,  C09J11/04 ,  C09J175/04 ,  C09J183/04 ,  C09J201/00 ,  C09J2201/40 ,  C09J2203/326 ,  C09J2205/102 ,  C09J2475/00 ,  C09J2483/00 ,  H01L35/30 ,  H01L35/32 ,  H01L35/34

Abstract: The present invention provides a thermally conductive adhesive sheet that can be easily laminated on an electronic device without an adhesive layer therebetween and can further selectively dissipate heat in a particular direction to provide a sufficient temperature difference to the inside of the electronic device, a method for producing the same, and an electronic device using the same. The present invention includes a thermally conductive adhesive sheet comprising a high thermally conductive portion and a low thermally conductive portion, wherein the high thermally conductive portion and the low thermally conductive portion have adhesiveness, and the high thermally conductive portion and the low thermally conductive portion each independently constitute an entire thickness of the thermally conductive adhesive sheet, or at least either the high thermally conductive portion or the low thermally conductive portion constitutes a portion of a thickness of the thermally conductive adhesive sheet, and a method for producing the thermally conductive adhesive sheet, and an electronic device using the thermally conductive adhesive sheet.

公开(公告)号：US09431593B2

公开(公告)日：2016-08-30

申请号：US14428141

申请日：2014-07-25

Applicant: LINTEC CORPORATION

Inventor： Kunihisa Kato ,  Tsuyoshi Mutou ,  Takeshi Kondo

IPC: H01L35/16 ,  H01L35/34 ,  H01L35/26

CPC classification number: H01L35/16 ,  H01L35/26 ,  H01L35/34

Abstract: The present invention provides a thermoelectric conversion material capable of being produced in a simplified manner and at a low cost and excellent in thermoelectric conversion characteristics and flexibility, and provides a method for producing the material. The thermoelectric conversion material has, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid. The method for producing a thermoelectric conversion material having, on a support, a thin film of a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid comprises a step of applying a thermoelectric semiconductor composition containing thermoelectric semiconductor fine particles, a heat-resistant resin and an ionic liquid onto a support and drying it to form a thin film thereon, and a step of annealing the thin film.

Abstract translation: 本发明提供能够以简单的方式制造并且成本低且热电转换特性和柔性优异的热电转换材料，并且提供了一种制造该材料的方法。 热电转换材料在载体上具有含有热电半导体微粒，耐热树脂和离子液体的热电半导体组合物的薄膜。 在载体上具有含有热电半导体微粒，耐热树脂和离子液体的热电半导体组合物的薄膜的热电转换材料的制造方法包括：将含有热电半导体精细的热电半导体组合物 颗粒，耐热树脂和离子液体涂布到载体上并干燥以在其上形成薄膜，以及退火薄膜的步骤。

公开(公告)号：US20150075578A1

公开(公告)日：2015-03-19

申请号：US14396527

申请日：2013-04-17

Applicant: LINTEC CORPORATION

Inventor： Kunihisa Kato ,  Tsuyoshi Mutou

IPC: H01L35/08 ,  H01L35/34

CPC classification number: H01L35/08 ,  H01L35/16 ,  H01L35/32 ,  H01L35/34

Abstract: The present invention provides a thermoelectric conversion material having a reduced thermal conductivity and having an improved figure of merit, and a method for producing the material. The thermoelectric conversion material has, as formed on a resin substrate having recesses, a thermoelectric semiconductor layer formed of a thermoelectric semiconductor material, wherein the resin substrate comprises one formed by curing a resin layer of a curable resin composition. The production method for the thermoelectric conversion material comprises a resin substrate formation step of transcribing a protruding structure from an original plate having the protruding structure onto a resin layer of a curable resin composition and curing the layer, and a film formation step of forming a thermoelectric semiconductor layer of a thermoelectric semiconductor material on the resin substrate.

Abstract translation: 本发明提供具有降低的热导率并具有改善的品质因数的热电转换材料及其制造方法。 如果在具有凹部的树脂基板上形成由热电半导体材料形成的热电半导体层，则热电转换材料具有通过固化树脂组合物的树脂层而形成的树脂基板。 所述热电转换材料的制造方法包括将突出结构从具有突出结构的原版转印到固化性树脂组合物的树脂层上并使其固化的树脂基板形成工序，以及形成热电转换材料的热电转换材料的成膜工序 在树脂基板上的热电半导体材料的半导体层。