公开(公告)号：US11049851B2

公开(公告)日：2021-06-29

申请号：US16001135

申请日：2018-06-06

Applicant: Luxtera, Inc.

Inventor： Kam-Yan Hon ,  Subal Sahni ,  Gianlorenzo Masini ,  Attila Mekis

IPC: H01L25/16 ,  F21V8/00 ,  G02B6/12

Abstract: Methods and systems for selectively illuminated integrated photodetectors with configured launching and adaptive junction profile for bandwidth improvement may include a photonic chip comprising an input waveguide and a photodiode. The photodiode comprises an absorbing region with a p-doped region on a first side of the absorbing region and an n-doped region on a second side of the absorbing region. An optical signal is received in the absorbing region via the input waveguide, which is offset to one side of a center axis of the absorbing region; an electrical signal is generated based on the received optical signal. The first side of the absorbing region may be p-doped. P-doped and n-doped regions may alternate on the first and second sides of the absorbing region along the length of the photodiode. The absorbing region may comprise germanium, silicon, silicon/germanium, or similar material that absorbs light of a desired wavelength.

公开(公告)号：US20200162166A1

公开(公告)日：2020-05-21

申请号：US16518916

申请日：2019-07-22

Applicant: Luxtera, Inc.

Inventor： Subal Sahni ,  Kam-Yan Hon ,  Attila Mekis ,  Gianlorenzo Masini ,  Lieven Verslegers

IPC: H04B10/548 ,  G02F1/025

Abstract: Methods and systems for a silicon-based optical phase modulator with high modal overlap may include, in an optical modulator having a rib waveguide in which a cross-shaped depletion region separates four alternately doped sections: receiving an optical signal at one end of the optical modulator, modulating the received optical signal by applying a modulating voltage, and communicating a modulated optical signal out of an opposite end of the modulator. The modulator may be in a silicon photonically-enabled integrated circuit which may be in a complementary-metal oxide semiconductor (CMOS) die. An optical mode may be centered on the cross-shaped depletion region. The four alternately doped sections may include: a shallow depth p-region, a shallow depth n-region, a deep p-region, and a deep n-region. The shallow depth p-region may be electrically coupled to the deep p-region periodically along the length of the modulator.

公开(公告)号：US20190327036A1

公开(公告)日：2019-10-24

申请号：US16502512

申请日：2019-07-03

Applicant: Luxtera, Inc.

Inventor： Steffen Gloeckner ,  Subal Sahni ,  Joseph Balardeta ,  Simon Pang ,  Stefan Barabas ,  Scott Denton

IPC: H04L1/24 ,  H04B10/80 ,  H04B10/40 ,  H04B10/077

Abstract: Methods and systems for an optoelectronic built-in self-test (BIST) system for silicon photonics optical transceivers may include an optoelectronic transceiver having a transmit (Tx) path and a receive (Rx) path, where the Rx path includes a main Rx path and a BIST loopback path. The system may generate a pseudo-random bit sequence (PRBS) signal, generate an optical signal in the Tx path by applying the PRBS signal to a modulator, communicate the optical signal to the BIST loopback path and convert the optical signal to an electrical signal utilizing a photodetector, where the photodetector is a replica of a photodetector in the main Rx path, and assess the performance of the Tx and Rx paths by extracting a PRBS signal from the electrical signal. The transceiver may be on a single complementary-metal oxide semiconductor (CMOS) die, or on two CMOS die where a first comprises electronic devices and a second comprises optical devices.

公开(公告)号：US20190113687A1

公开(公告)日：2019-04-18

申请号：US16159174

申请日：2018-10-12

Applicant: Luxtera, Inc.

Inventor： Shawn Wang ,  Subal Sahni ,  Gianlorenzo Masini

IPC: G02B6/293 ,  G02B6/32

Abstract: Near normal incidence MUX/DEMUX designs may include an optical demultiplexer coupled to a photonics die, where the optical demultiplexer comprises an input fiber, thin film filters at a first surface of a substrate, a first mirror at the first surface of the substrate, and a second mirror at a second surface of the substrate. The optical demultiplexer may receive an input optical signal comprising a plurality of wavelength optical signals, reflect the input optical signal from the first mirror to the second mirror, reflect the input optical signal from the second mirror to a first of the thin film filters, communicate an optical signal at a first wavelength to the photonics die while reflecting others to the second mirror, reflect the other signals to a second of the plurality of thin film filters, and communicate an optical signal at a second wavelength to the photonics die.

公开(公告)号：US20180358342A1

公开(公告)日：2018-12-13

申请号：US16001135

申请日：2018-06-06

Applicant: Luxtera, Inc.

Inventor： Kam-Yan Hon ,  Subal Sahni ,  Gianlorenzo Masini ,  Attila Mekis

IPC: H01L25/16 ,  F21V8/00 ,  G02B6/12

CPC classification number: H01L25/167 ,  G02B6/0006 ,  G02B6/12004 ,  G02B6/12007 ,  G02B2006/12111 ,  G02B2006/12126

Abstract: Methods and systems for selectively illuminated integrated photodetectors with configured launching and adaptive junction profile for bandwidth improvement may include a photonic chip comprising an input waveguide and a photodiode. The photodiode comprises an absorbing region with a p-doped region on a first side of the absorbing region and an n-doped region on a second side of the absorbing region. An optical signal is received in the absorbing region via the input waveguide, which is offset to one side of a center axis of the absorbing region; an electrical signal is generated based on the received optical signal. The first side of the absorbing region may be p-doped. P-doped and n-doped regions may alternate on the first and second sides of the absorbing region along the length of the photodiode. The absorbing region may comprise germanium, silicon, silicon/germanium, or similar material that absorbs light of a desired wavelength.

公开(公告)号：US20180062748A1

公开(公告)日：2018-03-01

申请号：US15694130

申请日：2017-09-01

Applicant: Luxtera, Inc.

Inventor： Michael Mack ,  Anders Dahl ,  Subal Sahni ,  Steffen Gloeckner

IPC: H04B10/40 ,  G02B6/028 ,  G02B6/42 ,  H04B10/2581

CPC classification number: H04B10/40 ,  G02B6/0288 ,  G02B6/124 ,  G02B6/4213 ,  G02B6/4214 ,  G02B6/422 ,  G02B6/4246 ,  G02B6/426 ,  G02B6/4295 ,  G02B2006/12147 ,  H04B10/2581

Abstract: Methods and systems for optical alignment to a silicon photonically-enabled integrated circuit may include aligning an optical assembly to a photonics die comprising a transceiver by, at least, communicating optical signals from the optical assembly into a plurality of grating couplers in the photonics die, communicating the one or more optical signals from the plurality of grating couplers to optical taps, with each tap having a first output coupled to the transceiver and a second output coupled to a corresponding output grating coupler, and monitoring an output optical signal communicated out of said photonic chip via said output grating couplers. The monitored output optical signal may be maximized by adjusting a position of the optical assembly. The optical assembly may include an optical source assembly comprising one or more lasers or the optical assembly may comprise a fiber array. Such a fiber array may include single mode optical fibers.

公开(公告)号：US20170357066A1

公开(公告)日：2017-12-14

申请号：US15688283

申请日：2017-08-28

Applicant: Luxtera, Inc.

Inventor： Michael Mack ,  Subal Sahni ,  Steffen Gloeckner

IPC: G02B6/42 ,  H04B10/079 ,  G02B6/34 ,  G02B6/32 ,  H04B10/25

CPC classification number: G02B6/4286 ,  G02B6/32 ,  G02B6/34 ,  G02B6/4206 ,  G02B6/4214 ,  H04B10/07955 ,  H04B10/25

Abstract: Methods and systems for optical power monitoring of a light source coupled to a silicon integrated circuit (chip) are disclosed and may include, in a system comprising an optical source coupled to the chip: emitting a primary beam from a front facet of a laser in the optical source assembly and a secondary beam from a back facet of the laser, directing the primary beam to an optical coupler in the chip, directing the secondary beam to a surface-illuminated photodiode in the chip, and monitoring an output power of the laser utilizing an output signal from the photodiode. The primary beam may comprise an optical source for a photonics transceiver in the chip. The focused primary beam and the secondary beam may be directed to the chip using reflectors in a lid of the optical source.

公开(公告)号：US20170201813A1

公开(公告)日：2017-07-13

申请号：US15401337

申请日：2017-01-09

Applicant: Luxtera, Inc.

Inventor： Subal Sahni

IPC: H04Q11/00 ,  H04B10/548 ,  G02B6/42 ,  H04B10/80 ,  G02B6/124 ,  H04B10/40 ,  H04B10/66

CPC classification number: H04B10/0731 ,  G02B6/30 ,  G02B6/34 ,  G02B6/4246 ,  H04B10/07 ,  H04B10/40 ,  H04B10/801

Abstract: Methods and systems for a connectionless integrated optical receiver and transmitter test are disclosed and may include an optoelectronic transceiver comprising a transmit (Tx) path and a receive (Rx) path, with each path comprising optical switches. The transceiver may be operable to: generate a first modulated optical signal utilizing a modulator in the Tx path, couple the first modulated optical signal to a first optical switch in the Rx path via a second optical switch in the Tx path when the optoelectronic transceiver is configured in a self-test mode, receive a second modulated optical signal via a grating coupler in the Rx path when the optoelectronics transceiver is configured in an operational mode, and communicate the second modulated optical signal to a photodetector in the Rx path via the first optical switch. The first modulated optical signal may be communicated to a grating coupler in the Tx path via the second optical switch.

公开(公告)号：US20200162185A1

公开(公告)日：2020-05-21

申请号：US16512983

申请日：2019-07-16

Applicant: Luxtera, Inc.

Inventor： Mark Peterson ,  Subal Sahni ,  Peter De Dobbelaere

IPC: H04J14/02 ,  H04B10/40 ,  G02B6/42 ,  G02B6/293

Abstract: Methods and systems for a free space CWDM MUX/DEMUX for integration with a grating coupler based silicon platform may include an optical assembly coupled to a photonic chip. The optical assembly includes a lens array on the top surface of the chip, an angled mirror, a transparent spacer, and a plurality of thin film filters. The optical assembly may receive an input optical signal comprising a plurality of optical signals at different wavelengths via an optical fiber coupled to the optical assembly, communicate the plurality of optical signals through the transparent spacer, pass a first of the plurality of optical signals through a corresponding one of the plurality of thin film filters while reflecting others of the plurality of optical signals back into the transparent spacer, and reflect the others of the plurality of signals towards a second of the plurality of thin film filters.

公开(公告)号：US20200083959A1

公开(公告)日：2020-03-12

申请号：US16519533

申请日：2019-07-23

Applicant: Luxtera, Inc.

Inventor： Michael Mack ,  Anders Dahl ,  Subal Sahni ,  Steffen Gloeckner

IPC: H04B10/40 ,  H05K13/04 ,  H01L21/68 ,  H04B10/2581 ,  G02B6/42 ,  G02B6/028 ,  G02B6/124

Abstract: Methods and systems for optical alignment to a silicon photonically-enabled integrated circuit may include aligning an optical assembly to a photonics die comprising a transceiver by, at least, communicating optical signals from the optical assembly into a plurality of grating couplers in the photonics die, communicating the one or more optical signals from the plurality of grating couplers to optical taps, with each tap having a first output coupled to the transceiver and a second output coupled to a corresponding output grating coupler, and monitoring an output optical signal communicated out of said photonic chip via said output grating couplers. The monitored output optical signal may be maximized by adjusting a position of the optical assembly. The optical assembly may include an optical source assembly comprising one or more lasers or the optical assembly may comprise a fiber array. Such a fiber array may include single mode optical fibers.