SEQUENTIAL VOLTAGE RAMP-DOWN OF ACCESS LINES OF NON-VOLATILE MEMORY DEVICE

    公开(公告)号:US20220392533A1

    公开(公告)日:2022-12-08

    申请号:US17888041

    申请日:2022-08-15

    Abstract: Some embodiments include apparatuses and methods of operating the apparatuses. One of the apparatuses includes a memory cell string having first, second, third, fourth, and fifth memory cells; access lines including first, second, third, fourth, and fifth access lines coupled to the first, second, third, fourth, and fifth memory cells, respectively, and a module. The first memory cell is between the second and third memory cells. The second memory cell is between the first and fourth memory cells. The third memory cell is between the first and fifth memory cells. The module is to couple the first access line to a ground node at a first time of a memory operation, couple the second and third access lines to the ground node at a second time of the operation after the first time, and couple the fourth and fifth access lines to the ground node at a third time of the operation after the second time.

    APPARATUSES INCLUDING MULTIPLE CHANNEL MATERIALS WITHIN A TIER STACK

    公开(公告)号:US20220359767A1

    公开(公告)日:2022-11-10

    申请号:US17814164

    申请日:2022-07-21

    Abstract: An apparatus comprises a stack comprising an alternating sequence of dielectric structures and conductive structures, a first channel material extending vertically through the stack, and a second channel material adjacent the first channel material and extending vertically through the stack. The first channel material has a first band gap and the second channel material has a second band gap that is relatively larger than the first band gap. The apparatus further comprises a conductive plug structure adjacent to each of the first channel material and the second channel material, and a conductive line structure adjacent to the conductive plug structure. Methods of forming the apparatus, memory devices, and electronic systems are also described.

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