Abstract:
Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, portions of the rivet structures extend through the movable layer and contact underlying layers. In other embodiments, the material used to form the rigid support structures may also be used to passivate otherwise exposed electrical leads in electrical connection with the MEMS devices, protecting the electrical leads from damage or other interference.
Abstract:
A light modulator is arranged as an array of rows and columns of interferometric display elements. Each element is divided into sub-rows of sub-elements. Array connection lines transmit operating signals to the display elements, with one connection line corresponding to one row of display elements in the array. Sub-array connection lines electrically connect to each array connection line. Switches transmit the operating signals from each array connection line to the sub-rows to effect gray scale modulation.
Abstract:
A light modulator is arranged as an array of rows and columns of interferometric display elements. Each element is divided into sub-rows of sub-elements. Array connection lines transmit operating signals to the display elements, with one connection line corresponding to one row of display elements in the array. Sub-array connection lines electrically connect to each array connection line. Switches transmit the operating signals from each array connection line to the sub-rows to effect gray scale modulation.
Abstract:
A separable modulator architecture is disclosed. The modulator has a mirror suspended from a flexible layer over a cavity. The flexible layer also forms supports and support posts for the mirror. An alternative separable modulator architecture has a mirror suspended over a cavity. The modulator is supported by supports and support posts. The support posts comprise a flexible layer over support post plugs. A bus structure may be formed upon the flexible layer arranged over the support posts.
Abstract:
A light modulator is arranged as an array of rows and columns of interferometric display elements. Each element is divided into sub-rows of sub-elements. Array connection lines transmit operating signals to the display elements, with one connection line corresponding to one row of display elements in the array. Sub-array connection lines electrically connect to each array connection line. Switches transmit the operating signals from each array connection line to the sub-rows to effect gray scale modulation.
Abstract:
An interferometric modulator is provided having a faster deformation time constant on actuation than relaxation time constant upon release from actuation. In some embodiments, apertures are formed in a mechanical membrane to decrease pressure, including liquid and/or gas pressures, on the membrane when actuated. In other embodiments, a dampening layer is disposed in close proximity above the membrane to apply greater downward pressure on the membrane and therefore slow the motion of the membrane when released from an actuated state. Other embodiments comprise structures, such as a heating element or vacuum device, to manipulate pressures above and/or below the mechanical membrane to affect the mechanical persistence of the display device.
Abstract:
A light modulator is arranged as array of rows and columns of interferometric display elements. Each element is divided into sub-rows of sub-elements. Array connection lines transmit operating signals to the display elements, with one connection line corresponding to one row of display elements in the array. Sub-array connection lines electrically connect to each array connection line. Switches transmit the operating signals from each array connection line to the sub-rows to effect gray scale modulation.
Abstract:
Methods and systems for packaging MEMS devices such as interferometric modulator arrays are disclosed. One embodiment of a MEMS device package structure includes a seal with a chemically reactant getter. Another embodiment of a MEMS device package comprises a primary seal with a getter, and a secondary seal proximate an outer periphery of the primary seal. Yet another embodiment of a MEMS device package comprises a getter positioned inside the MEMS device package and proximate an inner periphery of the package seal.
Abstract:
Methods of manufacturing light panels having at least one re-entrant turning feature. In one embodiment, a method of manufacturing a light panel includes providing a base layer, providing a cover layer, and coupling the cover layer to the base layer to form at least one re-entrant turning feature between the base layer and the cover layer. In another embodiment, a method of manufacturing a light panel includes providing a base layer, forming at least one receiving space in the base layer, providing at least one prismatic block, and coupling at least a portion of the prismatic block into the receiving space such that re-entrant turning features are formed between the prismatic block and the base layer.
Abstract:
In one embodiment, the invention provides a method for fabricating a microelectromechanical systems device. The method comprises fabricating a first layer comprising a film having a characteristic electromechanical response, and a characteristic optical response, wherein the characteristic optical response is desirable and the characteristic electromechanical response is undesirable; and modifying the characteristic electromechanical response of the first layer by at least reducing charge build up thereon during activation of the microelectromechanical systems device.