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公开(公告)号：US20100002397A1
公开(公告)日：2010-01-07
申请号：US12282729
申请日：2007-03-08
申请人： Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
发明人： Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L23/3677 , H01L23/3735 , H01L23/4006 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.
摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且能够将诸如壳体的功率模块所需的各种部件附接到部件安装板上。
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公开(公告)号：US08824144B2
公开(公告)日：2014-09-02
申请号：US13352681
申请日：2012-01-18
申请人： Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
发明人： Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
CPC分类号： H01L23/473 , H01L23/3677 , H01L23/3735 , H01L23/4006 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.
摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且用于诸如壳体的功率模块的各种部件可以附接到部件附接板上。
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公开(公告)号：US20120113598A1
公开(公告)日：2012-05-10
申请号：US13352681
申请日：2012-01-18
申请人： Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
发明人： Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L23/3677 , H01L23/3735 , H01L23/4006 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components for a power module, such as a casing, can be attached onto the component attachment plate.
摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且用于诸如壳体的功率模块的各种部件可以附接到部件附接板上。
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公开(公告)号：US08102652B2
公开(公告)日：2012-01-24
申请号：US12282729
申请日：2007-03-08
申请人： Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
发明人： Keiji Toh , Shogo Mori , Hideyasu Obara , Nobuhiro Wakabayashi , Shintaro Nakagawa , Shinobu Yamauchi
CPC分类号： H01L23/473 , H01L23/3677 , H01L23/3735 , H01L23/4006 , H01L25/072 , H01L2924/0002 , H01L2924/00
摘要： A power module base includes a heat radiation substrate formed of a high-thermal-conduction material, an insulating substrate joined to an upper surface of the heat radiation substrate, a wiring layer provided on an upper surface of the insulating substrate, and a heat radiation fin joined to a lower surface of the heat radiation substrate. A component attachment plate thicker than the heat radiation substrate and including a through hole for accommodating the insulating substrate is joined to the upper surface of the heat radiation substrate such that the insulating substrate is located within the through hole. This power module base can maintain the upper surface of the component attachment plate flat, and various components required for a power module, such as a casing, can be attached onto the component attachment plate.
摘要翻译： 功率模块基座包括由高导热材料形成的散热衬底，与散热衬底的上表面接合的绝缘衬底，设置在绝缘衬底的上表面上的布线层，以及热辐射 翅片接合到散热基板的下表面。 比热辐射基板厚的部件附着板和包含用于容纳绝缘基板的通孔接合到散热基板的上表面，使得绝缘基板位于通孔内。 该电源模块基座可以将部件附接板的上表面保持平坦，并且能够将诸如壳体的功率模块所需的各种部件附接到部件安装板上。
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公开(公告)号：US20080290500A1
公开(公告)日：2008-11-27
申请号：US12154542
申请日：2008-05-23
申请人： Yoshitaka Iwata , Keiji Toh , Shinobu Tamura , Shintaro Nakagawa
发明人： Yoshitaka Iwata , Keiji Toh , Shinobu Tamura , Shintaro Nakagawa
IPC分类号： H01L23/36
CPC分类号： H01L23/473 , H01L23/13 , H01L23/3735 , H01L2924/0002 , H01L2924/13055 , H01L2924/13091 , H01L2924/00
摘要： A semiconductor device has a ceramic substrate having a first surface and a second surface, a metal layer that is coupled to the second surface, a heat sink that is coupled to the metal layer and a stress relaxation member. The stress relaxation member is arranged between the metal layer and the heat sink and has a first surface that is coupled to the metal layer and a second surface that is coupled to the heat sink. A plurality of stress relaxation spaces are provided over the entire surface of at least one of the first and second surfaces of the stress relaxation member. The stress relaxation spaces that are arranged at the outermost portions of the stress relaxation member are deeper than the other stress relaxation spaces.
摘要翻译： 半导体器件具有陶瓷衬底，其具有第一表面和第二表面，耦合到第二表面的金属层，耦合到金属层的散热器和应力松弛元件。 应力松弛构件布置在金属层和散热器之间，并且具有耦合到金属层的第一表面和耦合到散热器的第二表面。 在应力缓和构件的第一和第二表面中的至少一个的整个表面上设置有多个应力松弛空间。 布置在应力松弛部件的最外部的应力松弛空间比其他应力松弛空间深。
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公开(公告)号：US20070163761A1
公开(公告)日：2007-07-19
申请号：US10587173
申请日：2005-02-10
IPC分类号： F28F13/18
CPC分类号： C23C22/34 , C23C22/361 , F25B39/04 , F28D1/05366 , F28D2021/0084 , F28F19/06 , F28F21/084
摘要： A method for manufacturing an aluminum heat exchanger includes the steps of: obtaining a heat exchanger tube 2 by forming a Zn thermally sprayed layer on a surface of an aluminum flat tube core so as to adjust Zn adhesion amount to 1 to 10 g/m2; obtaining a heat exchanger core by alternatively arranging the heat exchanger tube 2 and an aluminum fin 3 and brazing the heat exchanger tube and the fin with end portions of the heat exchanger tube connected to aluminum headers in fluid communication; and forming a chemical conversion treatment coat (corrosion resistance coat) on a surface of the heat exchanger core by subjecting the surface of the heat exchanger core to chemical conversion treatment using at least one chemical conversion treatment agent selected from the group consisting of phosphoric acid chromate, chromic acid chromate, phosphoric acid zirconium series, phosphoric acid titanium series, fluoridation zirconium series, and fluoridation titanium series. The obtained heat exchanger has a long last good corrosion resistance and can prevent occurrence of fin detachment and pit corrosion.
摘要翻译： 铝热交换器的制造方法包括以下步骤：通过在铝扁平管芯的表面上形成Zn热喷镀层来获得热交换管2，以将Zn附着量调整为1〜10g / SUP> 2 ; 通过交替布置热交换器管2和铝翅片3并且通过流体连通的连接到铝集管的热交换器管的端部钎焊热交换器管和翅片来获得热交换器芯; 以及通过使用至少一种选自磷酸铬酸盐的化学转化处理剂对热交换器芯的表面进行化学转化处理，在热交换器芯的表面上形成化学转化处理涂层（耐腐蚀性涂层） ，铬酸铬酸盐，磷酸锆系列，磷酸钛系列，氟化锆系列和氟化钛系列。 获得的热交换器具有长时间的良好的耐腐蚀性，并且可以防止翅片脱落和凹坑腐蚀的发生。
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公开(公告)号：US20060236538A1
公开(公告)日：2006-10-26
申请号：US10554843
申请日：2004-04-26
申请人： Shintaro Nakagawa
发明人： Shintaro Nakagawa
CPC分类号： F25B39/022 , B23K1/203 , B23K2101/14 , F28F1/126 , F28F21/084 , F28F2245/02 , F28F2275/04 , Y10T29/4935 , Y10T29/49364
摘要： An evaporator 1 comprises a flat tube 2 bent zigzag, and a corrugated fin 3 disposed between each adjacent pair of straight tube portions 2a of the flat tube 2 and brazed thereto by the flux brazing method. The flux remains on the surface of the portion of the corrugated fin 3 not brazed to the straight tube portions 2a in an amount of 0.03 to 1 g/m2. @ The evaporator 1 is fabricated by a process including applying the flux in an amount of 0.05 to 2.8 g/m2 to the outer surface of a zigzag flat tube 2, disposing a corrugated fin 3 between each adjacent pair of straight tube portions 2a of the flat tube 2 and brazing the fin 3 to the flat tube 2. The evaporator 1 can be effectively inhibited from emanating odor.
摘要翻译： 蒸发器1包括弯曲曲折的扁平管2和设置在扁平管2的每个相邻的一对直管部分2a之间并通过焊剂钎焊方法钎焊到其上的波纹状翅片3。 焊剂残留在波纹状散热片3的未被钎焊到直管部分2a的部分的表面上，其量为0.03-1g / m 2。 蒸发器1通过包括以0.05至2.8g / m 2的量的焊剂施加到锯齿形扁平管2的外表面的工艺制造，设置波纹状翅片 3，在扁平管2的相邻的一对直管部分2a之间，并且将翅片3钎焊到扁平管2上。可以有效地抑制蒸发器1发出气味。
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18.发明授权Method for surface treating a heat exchanger, surface treatment agent, and aluminum heat exchanger 有权表面处理热交换器，表面处理剂和铝热交换器的方法公开(公告)号：US08815022B2
公开(公告)日：2014-08-26
申请号：US13011457
申请日：2011-01-21
CPC分类号： F28F21/089 , B23K2101/14 , C08K3/36 , C08K9/08 , C09D5/028 , C09D7/62 , C23C22/34 , C23G1/125 , F28F2245/00 , F28F2275/04
摘要： A method for surface treating a heat exchanger and an aluminum heat exchanger obtained from this method are provided that can effectively suppress the foul odor characteristic to flux that emanates following degradation of a hydrophilic coating film and a chemical conversion coating film in a non-corrosive flux brazed heat exchanger on which flux easily remains. The method for surface treating a non-corrosive flux brazed heat exchanger made of an aluminum material conducts a pickling treatment step, a chemical conversion treatment step, and a deodorizing treatment step on the heat exchanger, in which the acidic cleaning agent contains nitric acid and sulfuric acid as well as a predetermined amount of ferric salt, and the surface treatment agent contains silica grains coated by a vinyl alcohol polymer and polyallylamine resin such that the total content of the silica grains and the vinyl alcohol polymer is a predetermined amount.
摘要翻译： 提供一种表面处理由该方法获得的热交换器和铝热交换器的方法，其能够有效地抑制非腐蚀性助焊剂中的亲水性涂膜和化学转化膜的劣化后产生的助熔剂的臭味特征 铜焊热交换器易于保持焊剂。 表面处理由铝材制成的非腐蚀性焊剂钎焊式热交换器的方法在热交换器上进行酸洗处理步骤，化学转化处理步骤和除臭处理步骤，其中酸性清洗剂含有硝酸和 硫酸以及预定量的铁盐，并且表面处理剂含有由乙烯醇聚合物和聚烯丙基胺树脂包覆的二氧化硅颗粒，使得二氧化硅颗粒和乙烯醇聚合物的总含量为预定量。
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19.发明授权公开(公告)号：US06554916B2
公开(公告)日：2003-04-29
申请号：US09854147
申请日：2001-05-12
申请人： Masahiro Kojima , Takashi Sudo , Shintaro Nakagawa , Masahiko Matsukawa , Toshio Inbe , Tatsuo Yoshida
发明人： Masahiro Kojima , Takashi Sudo , Shintaro Nakagawa , Masahiko Matsukawa , Toshio Inbe , Tatsuo Yoshida
IPC分类号： C23C2257
CPC分类号： C23C22/83 , B05D7/51 , C23C22/78 , F28D17/005 , F28F13/18 , F28F2245/02
摘要： A treatment method for hydrophilicity for a heat exchanger which can maintain the deodorizing property and hydrohilicity even after a long-time use, and a heat exchanger thus treated for hydrophilicity by said method are provided. After a previous acidic washing treatment, a heat exchanger is subjected to a chemical transformation treatment to form a chemical conversion coating film using a chromium chromate treatment agent, chromium phosphate treatment agent, or treatment agent of zirconium series, followed by a treatment for hydrophilicity using a treatment agent for hydrophilicity, which contains silica particulates and polymer of vinyl alcohol series in aqueous medium in a weight ratio 30:70˜70:30 and in tot al content of 1˜25 weight percent, and in which said silica particulates are coated with said polymer of vinyl alcohol series, and dispersed as coated particles of the average particle diameter of 5˜1000 nm in aqueous medium, to form the coating film so as to amount to 1˜3 g/m2.
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20.发明授权Method for surface treating a heat exchanger, hydrophilizing treatment agent, and aluminum heat exchanger 有权表面处理热交换器，亲水处理剂和铝热交换器的方法公开(公告)号：US08821651B2
公开(公告)日：2014-09-02
申请号：US13011180
申请日：2011-01-21
CPC分类号： F28F19/04 , B23K1/0012 , B23K1/008 , B23K31/00 , B23K2101/14 , B23K2103/10 , C08K3/36 , C08K5/3412 , C08K9/04 , C09D5/082 , C09D7/62 , C23C22/83 , F28D2021/0085 , F28F2245/02 , F28F2275/04
摘要： A method for surface treating a heat exchanger, a hydrophilizing treatment agent used in this method, and an aluminum heat exchanger obtained from this method are provided that excel in the initial adherence, hydrophilicity, and odor suppressibility, and can maintain these abilities for an extended time, while having little burden on the environment and the human body. The method for surface treating an aluminum heat exchanger that is brazed includes (1) a pickling treatment step; (2) a chemical conversion treatment step; and (3) a hydrophilization treatment step, in which the acidic cleaning agent contains nitric acid and sulfuric acid and contains ferric salt in a predetermined amount, the hydrophilizing treatment agent contains silica grains coated with a vinyl alcohol polymer and a polyallylamine resin.
摘要翻译： 提供了一种用于表面处理热交换器的方法，该方法中使用的亲水处理剂和由该方法得到的铝热交换器，其具有优异的初始粘附性，亲水性和气味抑制性，并且可以将这些能力保持在延伸 而对环境和人体的负担却很小。 用于表面处理钎焊的铝热交换器的方法包括（1）酸洗处理步骤; （2）化学转化处理步骤; 和（3）亲水化处理工序，其中酸性清洗剂含有硝酸和硫酸并含有预定量的铁盐，亲水处理剂含有涂覆有乙烯醇聚合物和聚烯丙基胺树脂的二氧化硅颗粒。
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