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公开(公告)号：US20200298012A1
公开(公告)日：2020-09-24
申请号：US16894322
申请日：2020-06-05
Applicant: Medtronic, Inc.
Inventor： Troy A. Jenison , Andrew J. Ries , Kent E. Samuelson
Abstract: An implantable medical device (IMD) may include a plurality of coils that may be used to recharge a power supply of the IMD and/or provide telemetry for the IMD. The IMD may be configured to couple all of the coils in series, such that currents that are induced by each of the coils are added together when the IMD is exposed to an electromagnetic field. The IMD may be configured to alter the coupling of the coils such that the coils are coupled in series opposition, such that currents that are induced by some coils of the IMD are opposed by currents that are induced by other coils of the IMD.
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公开(公告)号：US20200001093A1
公开(公告)日：2020-01-02
申请号：US16021177
申请日：2018-06-28
Applicant: Medtronic, Inc.
Inventor： Andrew J. Thom , Rajesh V. Iyer , Gordon O. Munns , Christian S. Nielsen , Andrew J. Ries
IPC: A61N1/375
Abstract: Various embodiments of a hermetically-sealed package and a method of forming such package are disclosed. The package includes a housing that extends along a housing axis between a first end and a second end, where the housing includes first and second opaque portions and a transparent portion disposed between the first and second opaque portions. The first opaque portion is hermetically sealed to a first end of the transparent portion and the second opaque portion is hermetically sealed to a second end of the transparent portion. At least one of the first and second opaque portions is hermetically sealed to the transparent portion by a weld ring. The package further includes a power source disposed within the housing, and an inductive coil disposed at least partially within the transparent portion of the housing and electrically connected to the power source.
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公开(公告)号：US20190209848A1
公开(公告)日：2019-07-11
申请号：US15868358
申请日：2018-01-11
Applicant: Medtronic, Inc.
Inventor： Troy A. Jenison , Andrew J. Ries , Kent E. Samuelson
CPC classification number: A61N1/37229 , A61N1/0534 , A61N1/086 , A61N1/36062 , A61N1/36125 , A61N1/37211 , A61N1/37247 , A61N1/37514 , A61N1/3787
Abstract: An implantable medical device (IMD) may include a plurality of coils that may be used to recharge a power supply of the IMD and/or provide telemetry for the IMD. The IMD may be configured to couple all of the coils in series, such that currents that are induced by each of the coils are added together when the IMD is exposed to an electromagnetic field. The IMD may be configured to alter the coupling of the coils such that the coils are coupled in series opposition, such that currents that are induced by some coils of the IMD are opposed by currents that are induced by other coils of the IMD.
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公开(公告)号：US20170232261A1
公开(公告)日：2017-08-17
申请号：US15141430
申请日：2016-04-28
Applicant: Medtronic, Inc.
Inventor： Robert W. Stadler , Zhongping Yang , Sarah A. Audet , James K. Carney , James D. Reinke , Andrew J. Ries , John D. Wahlstrand
CPC classification number: A61N1/36585 , A61B5/0422 , A61N1/057 , A61N1/36542 , A61N1/37288 , A61N1/3756 , A61N1/3787
Abstract: An implantable medical device system is configured to deliver cardiac pacing by receiving a cardiac electrical signal by sensing circuitry of a first device via a plurality of sensing electrodes, identifying by a control module of the first device a first cardiac event from the cardiac electrical signal, setting a first pacing interval in response to identifying the first cardiac event, controlling a power transmitter of the first device to transmit power upon expiration of the first pacing interval, receiving the transmitted power by a power receiver of a second device; and delivering at least a portion of the received power to a patient's heart via a first pacing electrode pair of the second device coupled to the power receiver.
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公开(公告)号：USD1071219S1
公开(公告)日：2025-04-15
申请号：US29791736
申请日：2022-02-03
Applicant: Medtronic, Inc.
Designer： Andrew J. Ries , Kamal Deep Mothilal , Craig Wiklund , Kris A. Peterson
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Patent Agency Ranking
公开(公告)号：US20210045260A1
公开(公告)日：2021-02-11
申请号：US17013609
申请日：2020-09-06
Applicant: Medtronic, Inc.
Inventor： John K. Day , Michael J. Nidelkoff , Kris A. Peterson , Andrew J. Ries , David A. Ruben , Craig L. Wiklund
Abstract: Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.
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公开(公告)号：US20170127543A1
公开(公告)日：2017-05-04
申请号：US15299941
申请日：2016-10-21
Applicant: Medtronic, Inc.
Inventor： John K. Day , Michael J. Nidelkoff , Kris A. Peterson , Andrew J. Ries , David A. Ruben , Craig L. Wiklund
Abstract: Various embodiments of a sealed package and method of forming such package are disclosed. The package can include a housing having an inner surface and an outer surface, and a substrate having a first major surface and a second major surface. The package can also include an electronic device disposed on the first major surface of the substrate, and a power source disposed at least partially within the housing. The substrate can be sealed to the housing such that a non-bonded electrical connection is formed between a device contact of the electronic device and a power source contact of the power source.
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公开(公告)号：US20160023012A1
公开(公告)日：2016-01-28
申请号：US14338815
申请日：2014-07-23
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Richard P. Nelson , Kamal Deep Mothilal
IPC: A61N1/39
CPC classification number: A61N1/3968 , A61N1/0558 , A61N1/057 , A61N1/372 , A61N1/375 , A61N2001/0582
Abstract: An implantable medical device housing has an outer surface and an inner surface that defines an interior cavity. A wire is coupled to the housing outer surface. The wire wholly defines an open aperture for receiving a fixation member. The wire includes a first wire end, a second wire end, and an annular loop between the first and second ends. A cover extends over at least the first end and the second end of the wire.
Abstract translation: 可植入医疗装置壳体具有限定内腔的外表面和内表面。 线耦合到壳体外表面。 线完全限定用于接收固定构件的开口孔。 线包括第一线端，第二线端和在第一端和第二端之间的环形环。 至少覆盖电线的第一端和第二端的盖子延伸。
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19.发明申请NOVEL SHIELD FORMING TO FACILITATE TIGHT RADIUS AT WELD SEAM USING PROGRESSIVE STAMPING 有权使用渐进式冲压成形的焊缝形成的新型屏蔽公开(公告)号：US20150297897A1
公开(公告)日：2015-10-22
申请号：US14257088
申请日：2014-04-21
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries
CPC classification number: A61N1/375 , A61B5/686 , A61B46/10 , A61B46/13 , A61B50/30 , A61B2017/00526 , A61B2560/0406 , A61B2562/12 , A61M5/14276 , A61M2207/00
Abstract: A method for manufacturing a medical device housing includes deforming an inner surface of a shield member to produce a seam area along the inner surface. The shield member has an inner surface and an outer surface spaced apart by a shield thickness. A seam seals the inner surface seam area of the shield member to a second shield member. The shield member inner surface has a bend extending to an interior edge of the seam.
Abstract translation: 一种用于制造医疗装置壳体的方法包括使屏蔽构件的内表面变形以产生沿着内表面的接缝区域。 屏蔽构件具有内表面和与屏蔽厚度间隔开的外表面。 接缝将屏蔽部件的内表面接缝区域密封到第二屏蔽部件。 屏蔽构件内表面具有延伸到接缝的内部边缘的弯曲。
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公开(公告)号：US20150165196A1
公开(公告)日：2015-06-18
申请号：US14179795
申请日：2014-02-13
Applicant: Medtronic, Inc.
Inventor： Andrew J. Ries , Terrence J. Snyder , Iryna M. Levina , Robert A. Munoz , Eric J. Wengreen , John E. Lovins
IPC: A61N1/362
CPC classification number: A61N1/362 , A61N1/3754 , A61N1/3758 , A61N1/378 , B23K26/24 , H01M2/0207 , H01M2/1016 , H01M2/1022 , H01M10/425 , Y10T29/49826
Abstract: An implantable medical device includes two conductive enclosures that are attached together, wherein the first enclosure contains electronics, and the second enclosure contains a power source. The second enclosure, all or a portion of which is located outside the first enclosure, includes an inner layer, an outer layer, and a header plate, all of which are configured to provide redundant sealing for the power source. The inner and outer layers, formed by separate metal sheets nested one within the other, are preferably in direct mechanical and electrical contact. The first sheet, which forms the inner layer, approximately conforms to a profile of the power source, located therein, and the second sheet, which forms the outer layer, conforms to a profile of the first sheet. An insulative housing, which contains connector contacts of the device, is directly secured to the first and second conductive enclosures, for example, by mounting brackets.
Abstract translation: 可植入医疗装置包括两个连接在一起的导电外壳，其中第一外壳包含电子元件，第二外壳包含电源。 第二外壳，其全部或一部分位于第一外壳的外部，包括内层，外层和集管板，所有这些外壳均被配置为为电源提供冗余密封。 优选地，内层和外层由彼此嵌套的单独的金属板形成，其中，所述内层和外层优选直接机械和电接触。 形成内层的第一片大致符合位于其中的电源的轮廓，形成外层的第二片符合第一片的轮廓。 包含设备的连接器触点的绝缘壳体例如通过安装支架直接固定到第一和第二导电外壳。
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