公开(公告)号：US20240165416A1

公开(公告)日：2024-05-23

申请号：US18540100

申请日：2023-12-14

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Mark E. Henschel ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey S. Voss

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  A61N1/37512

Abstract: In some examples, an implantable medical device includes a battery, an electronics module electrically connected to the battery, and an elongated housing comprising a side wall positioned between the battery and an end cap, wherein the electronics module is positioned within the elongated housing between the battery and the end cap. The implantable medical device also includes an electrical contact assembly comprising a first spring contact and a second spring contact. The electrical contact assembly of the implantable medical device is positioned within the elongated housing between the electronics module and the battery or the end cap.

公开(公告)号：US20220037092A1

公开(公告)日：2022-02-03

申请号：US17367831

申请日：2021-07-06

Applicant: Medtronic, Inc.

Inventor： Mark R. Boone ,  Joachim Hossick-Schott ,  Mark Henschel ,  Chunho Kim

IPC: H01G9/042 ,  H01G9/035

Abstract: Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and a cavity disposed in the substrate. The cavity extends between the first major surface and the second major surface. The electrical component also includes an anode electrode that includes a conductive foil layer disposed on the second major surface of the substrate and over the cavity. Tantalum material is disposed within the cavity and includes tantalum particles. A dielectric layer is disposed on the tantalum particles, and an electrolyte cathode layer is disposed on the dielectric layer. The electrical component also includes a cathode electrode disposed over the cavity.

公开(公告)号：US20210187307A1

公开(公告)日：2021-06-24

申请号：US17125250

申请日：2020-12-17

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

IPC: A61N1/375

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

公开(公告)号：US12220590B2

公开(公告)日：2025-02-11

申请号：US18124706

申请日：2023-03-22

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

IPC: A61N1/375

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

公开(公告)号：US11999014B2

公开(公告)日：2024-06-04

申请号：US17086946

申请日：2020-11-02

Applicant: Medtronic, Inc.

Inventor： Xiangnan He ,  David A. Ruben ,  Mark E. Henschel ,  Chunho Kim ,  Yongqian Wang ,  Rodney D. Toles

IPC: B23K26/38 ,  B23K26/06 ,  B23K26/082 ,  B23K26/362 ,  B23K26/70 ,  B23K101/38

CPC classification number: B23K26/38 ,  B23K26/0643 ,  B23K26/082 ,  B23K26/362 ,  B23K26/705 ,  B23K2101/38 ,  H05K2203/0207

Abstract: A system may include an emitting device and a controller. The emitting device may be adapted to emit a first laser beam and a second laser beam. The controller may include one or more processors and may be operably coupled to the emitting device to control emission of the first and second laser beams. The controller may be adapted to remove a portion of a workpiece to form an exposed surface of the workpiece with the first laser beam using the emitting device and to remove a portion of the exposed surface with the second laser beam using the emitting device.

公开(公告)号：US20230420191A1

公开(公告)日：2023-12-28

申请号：US18243274

申请日：2023-09-07

Applicant: MEDTRONIC, INC.

Inventor： Mark R. Boone ,  Joachim Hossick-Schott ,  Mark Henschel ,  Chunho Kim

IPC: H01G9/08 ,  H01G9/15 ,  H01G9/048

CPC classification number: H01G9/08 ,  H01G9/15 ,  H01G9/048 ,  H01G9/0425

Abstract: Various embodiments of an electrical component and a method of forming such component are disclosed. The electrical component includes a substrate having a first major surface, a second major surface, and a cavity disposed in the substrate. The cavity extends between the first major surface and the second major surface. The electrical component also includes an anode electrode that includes a conductive foil layer disposed on the second major surface of the substrate and over the cavity. Tantalum material is disposed within the cavity and includes tantalum particles. A dielectric layer is disposed on the tantalum particles, and an electrolyte cathode layer is disposed on the dielectric layer. The electrical component also includes a cathode electrode disposed over the cavity.

公开(公告)号：US20230248982A1

公开(公告)日：2023-08-10

申请号：US18102367

申请日：2023-01-27

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Mark E. Henschel ,  James R. Wasson ,  Chunho Kim ,  Walter E. Benecke ,  Kris A. Peterson ,  Jeff M. Wheeler ,  Songhua Shi

IPC: A61N1/375 ,  A61N1/372

CPC classification number: A61N1/3754 ,  A61N1/37223

Abstract: Various embodiments of a feedthrough assembly are disclosed. The assembly includes a header and a test fanout layer electrically connected to the header. A first major surface of the test fanout layer faces an inner surface of the header. The assembly further includes a test via extending between the first major surface and a second major surface of the test fanout layer, and a test pad disposed on the first major surface of the test fanout layer and electrically connected to the test via. At least a portion of the test pad is disposed between the outer surface of the header and a perimeter of the test fanout layer as viewed in a plane parallel to the first major surface of the test fanout layer such that the at least a portion of the test pad is exposed.

公开(公告)号：US20230218911A1

公开(公告)日：2023-07-13

申请号：US18124706

申请日：2023-03-22

Applicant: Medtronic, Inc.

Inventor： Andrew J. Ries ,  Chunho Kim ,  Robert A. Munoz ,  Christopher T. Kinsey ,  Jeffrey Voss ,  Kris A. Peterson ,  Mark E. Henschel

IPC: A61N1/375

CPC classification number: A61N1/3754 ,  A61N1/3756

Abstract: Various embodiments of a feedthrough header assembly and a device including such assembly are disclosed. The assembly includes a header having an inner surface and an outer surface; a dielectric substrate having a first major surface and a second major surface, where the second major surface of the dielectric substrate is disposed adjacent to the inner surface of the header; and a patterned conductive layer disposed on the first major surface of the dielectric substrate, where the patterned conductive layer includes a first conductive portion and a second conductive portion electrically isolated from the first conductive portion. The assembly further includes a feedthrough pin electrically connected to the second conductive portion of the patterned conductive layer and disposed within a via that extends through the dielectric substrate and the header. The feedthrough pin extends beyond the outer surface of the header.

公开(公告)号：US11569178B2

公开(公告)日：2023-01-31

申请号：US17324548

申请日：2021-05-19

Applicant: Medtronic, Inc.

Inventor： Chunho Kim ,  Mark R. Boone ,  Randolph E. Crutchfield

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/58 ,  H01L23/00

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.

公开(公告)号：US20210272909A1

公开(公告)日：2021-09-02

申请号：US17324548

申请日：2021-05-19

Applicant: Medtronic, Inc.

Inventor： Chunho Kim ,  Mark R. Boone ,  Randolph E. Crutchfield

IPC: H01L23/538 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31 ,  H01L23/58 ,  H01L23/00

Abstract: Various embodiments of an integrated circuit package and a method of forming such package are disclosed. The package includes a substrate having a core layer disposed between a first dielectric layer and a second dielectric layer, a die disposed in a cavity of the core layer, and an encapsulant disposed in the cavity between the die and a sidewall of the cavity. The package further includes a first patterned conductive layer disposed within the first dielectric layer, a device disposed on an outer surface of the first dielectric layer such that the first patterned conductive layer is between the device and the core layer, a second patterned conductive layer disposed within the second dielectric layer, and a conductive pad disposed on an outer surface of the second dielectric layer such that the second patterned conductive layer is between the conductive pad and the core layer.